我们课题组在集成电路2.5D先进封装可靠性方面的研究论文 Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components 在 Microelectronics Reliability 期刊上发表了。
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Dear Professor Jia,
We are pleased to let you know that the final version of your article Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components is now available online, containing full bibliographic details. Are you ready to share it with the world?
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