Title: A novel partitioned homogenization approach for rapid and accurate vibration analysis of printed circuit boards Dear Professor Jia, We are pleased to let you know that the final version of your article A novel partitioned homogenization approach for rapid and accurate vibration analys ...
Title: Accurate and efficient simulation of PCB warpage during manufacturing processes using partitioned equivalent model Reference: MR_115903 Dear Professor Jia, We are pleased to let you know that the final version of your article “Accurate and efficient simulation of PCB warpage durin ...
我们课题组的研究论文《 Warpage Prediction of Fan-out Wafer-Level Package Based on Coupled Deep Learning and Finite Element Simulation 》在 Microelectronics Reliability 期刊上发表了。这是我们课题组最近两年在 Microelectronics Reliability 专业期刊上发表的第六篇电路结构可靠性研究论 ...
我们课题组在集成电路 2.5D 先进封装可靠性方面的研究论文 Finite element analysis of 2.5D packaging processes based on multi-physics field coupling for predicting the reliability of IC components 在 Microelectronics Reliability 期刊上发表了。 Elsevier 公司给出了 50 ...
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