我们团队在Microelectronics Reliability期刊上刚发表了一篇17页的研究论文,Title: Utilizing CNN to predict homogeneous thermo-mechanical properties of conductive layers for reliability numerical analysis in electronics。
Elsevier出版商给出了50天的任何人都可以免费下载全文的许可:
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https://authors.elsevier.com/a/1iyFe5%7EJAvJCb
该论文是2023年10月17日投稿的,审稿周期很长。实际上,在投稿后,我们团队用十种Transformer模型做了比较性的量化评估(AI样本是相同的),发现了很有趣的结果:某些Transformer模型能比这篇论文里的CNN模型取得预测精度更高、训练效率更高的结果;更加重要的是,所需样本数量可以很大幅度地减少,给人很大的惊喜,使得AI+IC更有产业应用可行性!
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