期刊简介
Chips (ISSN 2674-0729) 创刊于2022年，是一个国际性、经同行评审的开放获取期刊。期刊聚焦芯片领域，专注于芯片的设计，制造，以及相关的应用等方面。目前，Chips 期刊已被Scopus等数据库收录。
Time to First Decision：22.4 Days
Acceptance to Publication：5.7 Days
期刊Scope
芯片设计；
芯片制造；
芯片的应用。
期刊主编
Prof. Dr. Gaetano Palumbo
Università di Catania, Italy
精选文章
1. Review of Industrialization Development of Nanoimprint Lithography Technology
纳米压印光刻技术产业化发展综述
Yuanxun Cao et al.
https://doi.org/10.3390/chips4010010
2. Oxygen Vacancy Engineering and Its Impact on Resistive Switching of Oxide Thin Films for Memory and Neuromorphic Applications
氧空位工程及其对用于记忆和神经形态应用的氧化物薄膜电阻开关的影响
Biswajit Jana and Ayan Roy Chaudhuri
3. Radiation-Induced Effects on Semiconductor Devices: A Brief Review on Single-Event Effects, Their Dynamics, and Reliability Impacts
半导体器件的辐射诱导效应：单事件效应、动力学和可靠性影响综述
Vitor A. P. Aguiar, Saulo G. Alberton and Matheus S. Pereira
https://doi.org/10.3390/chips4010012
4. Slew-Rate Enhancement Techniques for Switched-Capacitors Fast-Settling Amplifiers: A Review
开关电容快速稳定放大器的转换速率增强技术综述
Michele Dei, Francesco Gagliardi and Paolo Bruschi
5. A Review of Recent Advances in High-Dynamic-Range CMOS Image Sensors
高动态范围CMOS图像传感器研究进展
Jingyang Chen et al.
https://doi.org/10.3390/chips4010008
特刊推荐
Design and Implementation of Reconfigurable Optoelectronic Integrated Chips
客座编辑： Dr. Jiyuan Zheng
投稿截止日期：31 October 2026
https://www.mdpi.com/journal/chips/special_issues/2BZJY3C2D9
Emerging Issues in Hardware and IC System Security
客座编辑： Dr. Zain Ul Abideen
投稿截止日期：30 Novermber 2026
https://www.mdpi.com/journal/chips/special_issues/O7D8VG4U0E
Advances in Power Management Integrated Circuits (PMICs)
客座编辑：Dr. Zhanghao Yu
投稿截止日期：30 Novermber 2026
https://www.mdpi.com/journal/chips/special_issues/Y1LV82GI8K
Neuromorphic Chips at the Intersection of Neuroscience, Electronics and AI
客座编辑： Dr. Liangshun Wu and Dr. Pak Kwong Chan
投稿截止日期：31 December 2026
https://www.mdpi.com/journal/chips/special_issues/W2SY1TIV5V
High-Performance Packaging Substrates for Chiplet Integration: Materials, Process and Reliability
客座编辑： Dr. Shanjun Ding
投稿截止日期：31 December 2026
https://www.mdpi.com/journal/chips/special_issues/X3TIHA2M68
作者指南
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