█武汉大学科教管理与评价研究中心 陈立新 张琳 黄颖
附录2 2021年PCT国际专利申请统计分析报告
附录2.7 各技术领域的PCT专利申请状况
附录2.7.39 半导体零配件领域的PCT专利申请状况
第39个技术领域是半导体零配件,主要包括安装架、密封层、支架、冷却装置、防辐射保护装置等半导体通用零部件。2021年,该领域的PCT专利申请总计922项(增长率为4.5%),占总申请量的0.4%,是申请量第52多的领域。
2021年,中国局在半导体零配件领域上申请PCT专利211项,占该领域申请量的22.9%。美国局在该领域上申请专利130项,份额为14.1%。日本局申请专利451项,份额为48.9%。欧洲局申请专利58项,份额为6.3%。
附表2.7.39-1 2021年半导体零配件领域各专利局的PCT专利申请数量
专利局 | 申请数量 | 占本局比例 | 占领域比例 | |
1 | 中国 | 211 | 0.3% | 22.9% |
2 | 美国 | 130 | 0.2% | 14.1% |
3 | 日本 | 451 | 1.0% | 48.9% |
4 | 欧洲 | 58 | 0.2% | 6.3% |
5 | 韩国 | 33 | 0.2% | 3.6% |
6 | 国际 | 22 | 0.2% | 2.4% |
7 | 英国 | 3 | 0.1% | 0.3% |
8 | 法国 | 3 | 0.1% | 0.3% |
9 | 加拿大 | 3 | 0.2% | 0.3% |
10 | 澳大利亚 | 0 | 0.0% | 0.0% |
11 | 土耳其 | 0 | 0.0% | 0.0% |
12 | 德国 | 1 | 0.1% | 0.1% |
13 | 以色列 | 1 | 0.1% | 0.1% |
14 | 瑞典 | 3 | 0.2% | 0.3% |
15 | 其他 | 3 | -- | 0.3% |
小计 | 922 | -- | 100% |
附图2.7.39-1 2021年半导体零配件领域各专利局的PCT专利申请数量对比
2021年,在半导体零配件领域上PCT专利申请最多的机构是村田制造公司、三菱电机公司、华为技术公司。
附表2.7.39-2 2021年半导体零配件领域的PCT国际专利申请前10机构
机构名称 | 国家 | 机构英文名称 | 2021 | |
1 | 村田制造公司 | 日本 | MURATA MANUFACTURING CO., LTD. | 65 |
2 | 三菱电机公司 | 日本 | MITSUBISHI ELECTRIC CORPORATION | 57 |
3 | 华为技术公司 | 中国 | HUAWEI TECHNOLOGIES CO., LTD. | 45 |
4 | 京瓷株式会社 | 日本 | KYOCERA CORPORATION | 30 |
5 | 罗姆株式会社 | 日本 | ROHM CO., LTD. | 30 |
6 | 长鑫存储技术有限公司 | 中国 | CHANGXIN MEMORY TECHNOLOGIES, INC | 26 |
7 | 高通公司 | 美国 | QUALCOMM INCORPORATED | 23 |
8 | 日立安斯泰莫株式会社 | 日本 | HITACHI ASTEMO, LTD. | 19 |
9 | 电装公司 | 日本 | DENSO CORPORATION | 18 |
10 | 索尼半导体解决方案公司 | 日本 | SONY SEMICONDUCTOR SOLUTIONS CORPORATION | 18 |
附图2.7.39-2 2021年半导体零配件领域的PCT国际专利申请前10机构
致谢
感谢大连理工大学刘则渊教授、河南师范大学梁立明教授、科技部中国科学技术发展战略研究院武夷山研究员、大连理工大学丁堃教授、大连理工大学杨中楷教授对本报告的大力支持与帮助。同时,向以不同形式对本报告提出意见和建议的专家学者们表示诚挚的感谢。
如需要中美欧日韩五局及PCT专利数据、专利报告,以及咨询相关专利问题请添加微信号。
附表 2021年该领域PCT国际专利申请
ID | Title | Applicant |
WO/2021/151130 | HEAT DISSIPATION DEVICE | 4MOTEC GMBH & CO KG |
WO/2021/108903 | CREATING STAGING IN BACKPLANE FOR MICRO DEVICE INTEGRATION | VUEREAL INC. |
WO/2021/108909 | HIGH EFFICIENT MICRO DEVICES | VUEREAL INC. |
WO/2021/226714 | PASSING SIGNALS THROUGH MICRO DEVICE SIDEWALLS | VUEREAL INC. |
WO/2021/000111 | INTERDIGITAL CAPACITOR AND MULTIPLYING DIGITAL-TO-ANALOG CONVERSION CIRCUIT | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/000304 | CAPACITOR AND FABRICATION METHOD THEREFOR | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
WO/2021/003635 | STRUCTURE AND METHOD FOR FORMING CAPACITORS FOR THREE-DIMENSIONAL NAND | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
WO/2021/007767 | INTERCONNECT STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
WO/2021/022416 | CAPACITOR AND MANUFACTURING METHOD THEREFOR | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
WO/2021/022566 | SECURITY CHIP, PREPARATION METHOD FOR SECURITY CHIP, AND ELECTRONIC DEVICE | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
WO/2021/026865 | CHIP INTERCONNECTION STRUCTURE, CHIPS AND CHIP INTERCONNECTION METHOD | SHENZHEN GOODIX TECHNOLOGY CO.,LTD. |
WO/2021/035572 | SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
WO/2021/042377 | INTEGRATED DEVICE AND MANUFACTURING METHOD THEREFOR | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
WO/2021/046818 | ELECTRONIC COMPONENT COMPRISING SUBSTRATE WITH THERMAL INDICATOR | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
WO/2021/051285 | CAPACITOR AND MANUFACTURING METHOD THEREFOR | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
WO/2021/056181 | ENCAPSULATION STRUCTURE AND MANUFACTURING METHOD THEREFOR | HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) CO., LTD. |
WO/2021/022642 | BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR AND DISPLAY PANEL | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
WO/2021/056592 | SEMICONDUCTOR APPARATUS, DEVICE FOR POWER CONVERSION, AND METHOD FOR PROVIDING SEMICONDUCTOR APPARATUS | RETHINK ROBOTICS GMBH |
WO/2021/056603 | POWER TYPE SEMICONDUCTOR DEVICE PACKAGING STRUCTURE | GLOBAL ENERGY INTERCONNECTION RESEARCH INSTITUTE CO., LTD. |
WO/2021/056604 | PREPARATION PROCESS OF POWER TYPE SEMICONDUCTOR DEVICE PACKAGE STRUCTURE | GLOBAL ENERGY INTERCONNECTION RESEARCH INSTITUTE CO., LTD. |
WO/2021/072670 | CHIP AND INTEGRATED CHIP | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/081728 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/081855 | CHIP PACKAGE ON PACKAGE STRUCTURE AND PACKAGING METHOD THEREFOR, AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/081906 | SUPPORTING BACKPLANE, MANUFACTURING METHOD THEREFOR, AND BACKPLANE | BOE TECHNOLOGY GROUP CO., LTD. |
WO/2021/081943 | CHIP STACK PACKAGING STRUCTURE, PACKAGING METHOD THEREOF AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/017239 | BUFFER STRUCTURE, DISPLAY PANEL, AND MANUFACTURING METHOD FOR BUFFER STRUCTURE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
WO/2021/087720 | SEMICONDUCTOR DEVICES HAVING ADJOINED VIA STRUCTURES FORMED BY BONDING AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
WO/2021/087735 | METHOD AND STRUCTURE FOR FORMING STAIRS IN THREE-DIMENSIONAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
WO/2021/056704 | INTEGRATED FLEXIBLE SUBSTRATE WITH GOOD STRETCHABILITY, FLEXIBLE CIRCUIT, AND METHOD FOR MANUFACTURING SAME | TSINGHUA UNIVERSITY |
WO/2021/062919 | CHIP-ON FILM AND DISPLAY DEVICE | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
WO/2021/092779 | CHIP PACKAGE ON PACKAGE STRUCTURE AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/027147 | TIMING CONTROL BOARD AND DISPLAY DEVICE | TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. |
WO/2021/097730 | MULTI-CHIP STACK PACKAGE AND MANUFACTURING METHOD | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/036027 | CHIP REWIRING STRUCTURE AND PREPARATION METHOD THEREFOR | CHIPMORE TECHNOLOGY CORPORATION LIMITED |
WO/2021/097814 | CHIP PACKAGE, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING CHIP PACKAGE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/102876 | CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
WO/2021/102940 | INTEGRATED CIRCUIT | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/108965 | ENCAPSULATION SUBSTRATE INTEGRATED WITH INDUCTOR, AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/068388 | RECESSED STRUCTURE CAPABLE OF BEING CONVENIENTLY MONITORED ONLINE, AND MANUFACTURING METHOD THEREOF | SHANGHAI IC R & D CENTER CO., LTD. |
WO/2021/103110 | CHIP PACKAGE STRUCTURE AND PACKAGING METHOD | CHINA WAFER LEVEL CSP CO., LTD. |
WO/2021/088187 | PRESS-FIT POWER MODULE INSPECTION SYSTEM AND INSPECTION METHOD | SHENZHEN INSTITUTE OF WIDE-BANDGAP SEMICONDUCTORS |
WO/2021/088197 | PACKAGING STRUCTURE OF AND MANUFACTURING METHOD FOR SILICON CARBIDE MOSFET MODULE | BEIJING UNIVERSITY OF TECHNOLOGY |
WO/2021/103145 | GOA CIRCUIT AND DISPLAY PANEL COMPRISING THE GOA CIRCUIT | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
WO/2021/114202 | SEMICONDUCTOR DEVICE PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR | XIDIAN UNIVERSITY |
WO/2021/114213 | CHIP PACKAGING STRUCTURE | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
WO/2021/022748 | SEMICONDUCTOR CHIP AND SMART POWER MODULE | GUANGDONG MIDEA WHITE HOME APPLIANCE TECHNOLOGY INNOVATION CENTER CO. LTD. |
WO/2021/114281 | ELECTRONIC COMPONENT, CIRCUIT BOARD HAVING SAME, AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/119924 | CHIP STACK STRUCTURE AND MANUFACTURING METHOD THEREFOR | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/119930 | CHIP PACKAGE AND FABRICATION METHOD THEREFOR | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/056859 | 2.5-D MULTI-CHIP PACKAGING STRUCTURE FOR INTEGRATED ANTENNA STRUCTURE, AND MANUFACTURING METHOD | SHANGHAI XIANFANG SEMICONDUCTOR CO., LTD |
WO/2021/114326 | ARRAY SUBSTRATE AND DISPLAY PANEL | SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
WO/2021/114410 | PACKAGE STRUCTURE FACILITATING SYSTEM HEAT DISSIPATION, AND PACKAGING PROCESS THEREOF | SHANGHAI XIANFANG SEMICONDUCTOR CO., LTD |
WO/2021/128366 | ELECTRONIC ELEMENT PACKAGING STRUCTURE | AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD. |
WO/2021/082269 | SENSOR PACKAGING STRUCTURE AND ELECTRONIC DEVICE | WEIFANG GOERTEK MICROELECTRONICS CO., LTD. |
WO/2021/031507 | FORMATION OF FINE PITCH TRACES USING ULTRA-THIN PAA MODIFIED FULLY ADDITIVE PROCESS | COMPASS TECHNOLOGY COMPANY LIMITED |
WO/2021/012641 | ENCAPSULATION STRUCTURE WITH EXPOSED HIGH-DENSITY MULTI-SIDED PINS AND PRODUCTION METHOD THEREFOR | GUANGDONG CHIPPACKING TECHNOLOGY CO., LTD. |
WO/2021/142599 | CHIP PACKAGING STRUCTURE AND PACKAGING METHOD | SZ DJI TECHNOLOGY CO., LTD. |
WO/2021/146855 | RADIO FREQUENCY FILTER | EPICMEMS(XIAMEN) CO., LTD. |
WO/2021/146901 | INTERCONNECT STRUCTURES OF THREE-DIMENSIONAL MEMORY DEVICES | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
WO/2021/155522 | HYBRID BONDING BASED INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | ALIBABA GROUP HOLDING LIMITED |
WO/2021/155537 | COPPER WIRE BOND ON GOLD BUMP ON SEMICONDUCTOR DIE BOND PAD | TEXAS INSTRUMENTS INCORPORATED |
WO/2021/159306 | PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR, AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/128562 | CRIMPING-TYPE IGBT MODULE AND POWER SEMICONDUCTOR DEVICE | ZHUZHOU CRRC TIMES SEMICONDUCTOR CO., LTD. |
WO/2021/168837 | DATA PROCESSING DEVICE AND METHOD | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/174415 | PROTECTION STRUCTURES IN SEMICONDUCTOR CHIPS AND METHODS FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
WO/2021/174470 | CIRCUIT STRUCTURE AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/184166 | ELECTRONIC APPARATUS, CHIP PACKAGING STRUCTURE, AND MANUFACTURING METHOD FOR SAME | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/022811 | SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREFOR | FUJIAN JINHUA INTEGRATED CIRCUIT CO., LTD. |
WO/2021/184190 | CIRCUIT BOARD STRUCTURE, ELECTRONIC PRODUCT, AND MANUFACTURING METHOD AND REPAIR METHOD FOR CIRCUIT BOARD STRUCTURE | SZ DJI TECHNOLOGY CO., LTD. |
WO/2021/159588 | BONDING STRUCTURE AND MANUFACTURING METHOD THEREFOR | WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD. |
WO/2021/189232 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
WO/2021/189292 | CHIP STRUCTURE AND CHIP PREPARATION METHOD | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/189300 | MEMORY CHIP STACKED PACKAGE AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/179352 | HIGH-POWER IPM STRUCTURE BASED ON GRAPHENE-BASED PACKAGING SUBSTRATE, AND PROCESSING TECHNOLOGY | HUANGSHAN UNIVERSITY |
WO/2021/189486 | DISPLAY PANEL AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
WO/2021/195871 | EMBEDDED SUBSTRATE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/195942 | PHOTOELECTRIC CO-PACKAGING INTEGRATED DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/196012 | CHIP PACKAGE AND PREPARATION METHOD THEREFOR | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
WO/2021/196016 | CAPACITOR, CAPACITOR STRUCTURE, AND METHOD FOR FABRICATING CAPACITOR | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
WO/2021/196018 | CAPACITOR AND MANUFACTURING METHOD THEREFOR | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
WO/2021/196039 | SECURITY CHIP, METHOD FOR MANUFACTURING SECURITY CHIP, AND ELECTRONIC DEVICE | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
WO/2021/203407 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME | INNOSCIENCE (ZHUHAI) TECHNOLOGY CO., LTD. |
WO/2021/208006 | PACKAGING STRUCTURE, ELECTRIC VEHICLE AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/208066 | ELECTRONIC DEVICE, SEMICONDUCTOR WAFER, AND CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/208078 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/139040 | GALLIUM OXIDE FIELD EFFECT TRANSISTOR AND MANUFACTURING METHOD THEREFOR | THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION |
WO/2021/217319 | PACKAGE STRUCTURE, ELECTRONIC DEVICE, AND CHIP PACKAGING METHOD | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/217359 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME | YANGTZE MEMORY TECHNOLOGIES CO., LTD. |
WO/2021/217361 | CHIP PACKAGE, ELECTRONIC DEVICE, AND PREPARATION METHOD FOR CHIP PACKAGE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/223080 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO., LTD. |
WO/2021/226744 | DISPLAY PANEL AND MANUFACTURING METHOD THEREFOR, AND DISPLAY APPARATUS AND MANUFACTURING METHOD THEREFOR | BOE TECHNOLOGY GROUP CO., LTD. |
WO/2021/226799 | PACKAGE STRUCTURE, MANUFACTURING METHOD THEREFOR, AND COMMUNICATION APPARATUS | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/196351 | EMBEDDED CHIP PACKAGE AND MANUFACTURING METHOD THEREFOR | ZHUHAI ACCESS SEMICONDUCTOR CO., LTD |
WO/2021/227045 | SEMICONDUCTOR PACKAGING METHOD AND PACKAGING STRUCTURE THEREOF | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
WO/2021/196359 | PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR | MONTAGE TECHNOLOGY (KUNSHAN) CO., LTD. |
WO/2021/143000 | PACKAGE STRUCTURE AND FORMING METHOD THEREFOR | JCET GROUP CO., LTD. |
WO/2021/093304 | PACKAGING STRUCTURE AND PACKAGING METHOD FOR CAVITY DEVICE GROUP | JCET GROUP CO., LTD. |
WO/2021/237714 | CHIP ENCAPSULATION STRUCTURE AND METHOD, AND CHIP MODULE | SHENZHEN GOODIX TECHNOLOGY CO., LTD. |
WO/2021/196394 | SYSTEM-ON-CHIP INTEGRATED PACKAGING STRUCTURE, MANUFACTURING METHOD THEREFOR AND THREE-DIMENSIONAL STACKED DEVICE | HUATIAN TECHNOLOGY (KUNSHAN) ELECTRONICS CO., LTD. |
WO/2021/232510 | GROUND REFERENCE SHAPE FOR HIGH SPEED INTERCONNECT | INNOGRIT TECHNOLOGIES CO., LTD. |
WO/2021/109527 | PLASTIC ENCAPSULATION STRUCTURE USED FOR THREE DIMENSIONAL FAN-OUT ENCAPSULATION | SHANGHAI XIANFANG SEMICONDUCTOR CO., LTD |
WO/2021/109528 | MULTI-CHANNEL AIP ENCAPSULATION STRUCTURE AND MANUFACTURING METHOD THEREFOR | SHANGHAI XIANFANG SEMICONDUCTOR CO., LTD |
WO/2021/047225 | HEAT DISSIPATION STRUCTURE AND HEAT DISSIPATION SYSTEM | SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA. |
WO/2021/103489 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/103490 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/232521 | SUPPORTING PLATE, DISPLAY MODULE, AND ELECTRONIC DEVICE | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
WO/2021/253225 | CHIP PACKAGING STRUCTURE AND METHOD | INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES |
WO/2021/223294 | CHIP ON FILM | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
WO/2021/088380 | SEMICONDUCTOR STRUCTURE AND PREPARATION METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/109540 | SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/036445 | POWER SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFOR | GREE ELECTRIC APPLIANCES, INC. OF ZHUHAI |
WO/2021/232529 | BINDING REGION CIRCUIT | WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD. |
WO/2021/253512 | THREE-DIMENSIONAL CAPACITOR/INDUCTOR BASED ON HIGH-FUNCTIONAL-DENSITY THROUGH-SILICON VIA STRUCTURE, AND PREPARATION METHOD | FUDAN UNIVERSITY |
WO/2021/082510 | SEMICONDUCTOR PACKAGE STRUCTURE HAVING MICRO-ISOLATION CAVITY | ZHEJIANG UNIVERSITY |
WO/2021/227240 | THREE-DIMENSIONAL PACKAGING HOUSING STRUCTURE OF RADIO FREQUENCY MICROSYSTEM AND MANUFACTURING METHOD | CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO.55 RESEARCH INSTITUTE |
WO/2021/109580 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/017896 | PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF | TONGFU MICROELECTRONICS CO., LTD. |
WO/2021/017898 | PACKAGING STRUCTURE ANDFORMATION METHOD THEREOF | NANTONG TONGFU MICROELECTRONICS CO., LTD |
WO/2021/017961 | CHIP AND PREPARATION METHOD THEREFOR, AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/018014 | TSV-BASED MULTI-CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME | SHANGHAI XIANFANG SEMICONDUCTOR CO., LTD. |
WO/2021/253572 | CAPACITOR AND INDUCTOR EMBEDDED STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND SUBSTRATE | ZHUHAI ACCESS SEMICONDUCTOR CO., LTD. |
WO/2021/253573 | HEAT DISSIPATION AND ELECTROMAGNETIC SHIELDING EMBEDDED ENCAPSULATION STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND SUBSTRATE | ZHUHAI ACCESS SEMICONDUCTOR CO., LTD. |
WO/2021/018156 | PACKAGING DEVICE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/036700 | MAGNETIC FLUID PUMP DEVICE FOR IGBT HEAT DISSIPATION AND TEST METHOD | DALIAN UNIVERSITY OF TECHNOLOGY |
WO/2021/135230 | CONTROL CHIP MOUNTING BASE OF CONTROL SYSTEM | PAGEMAN TECHNOLOGY (TAICANG) CO., LTD. |
WO/2021/027718 | HEAT SINK FOR IC COMPONENT AND IC HEAT SINK ASSEMBLY | HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED |
WO/2021/023306 | THREE-DIMENSIONAL PACKAGING STRUCTURE AND METHOD FOR BONDING WALL FAN-OUT DEVICE | XIAMEN SKY SEMICONDUCTOR TECHNOLOGY CO. LTD. |
WO/2021/036786 | ELECTRONIC ASSEMBLY, AND ELECTRONIC APPARATUS | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/068657 | ENCAPSULATION STRUCTURE AND ELECTRONIC APPARATUS | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/208322 | MULTI-CHIP HEAT-DISSIPATING PACKAGING STRUCTURE AND PACKAGING METHOD | FIBERHOME TELECOMMUNICATION TECHNOLOGIES CO., LTD |
WO/2021/052143 | SUBSTRATE FOR SOLDERING ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR DEVICE | SHENZHEN LIGHTING INSTITUTE |
WO/2021/037233 | PACKAGE BODY AND PREPARATION METHOD THEREFOR | SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD. |
WO/2021/057415 | LOW-EMI DEEP TRENCH ISOLATION TRENCH TYPE POWER SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREFOR | NANJING MARCHING POWER TECHNOLOGY CO., LTD |
WO/2021/135356 | ELECTRONIC MODULE AND ELECTRONIC APPARATUS | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/077937 | EMI SHIELDING MATERIAL, EMI SHIELDING PROCESS, AND COMMUNICATION MODULE PRODUCT | HANGZHOU JWL TECHNOLOGY INC. |
WO/2021/128958 | ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD FOR DIGITAL CIRCUIT | THE 13TH RESEARCH INSTITUTE OF CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION |
WO/2021/047667 | FAN-OUT TRANSITION STRUCTURE FOR TRANSMISSIONOF mm-WAVE SIGNALS FROM IC TO PCB VIA CHIP-SCALE PACKAGING | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/077965 | COOLING DEVICE FOR HEAT EXCHANGE OF CPU RADIATOR | BEIJING DEEPCOOL INDUSTRIES CO., LTD. |
WO/2021/073401 | CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE | HANGZHOU JWL TECHNOLOGY INC. |
WO/2021/063253 | MOLD, AND ENCAPSULATION METHOD FOR DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
WO/2021/063267 | LEAD FRAME, PACKAGED INTEGRATED CIRCUIT BOARD, POWER CHIP, AND CIRCUIT BOARD PACKAGING METHOD | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/120774 | WAFER AND PROBING BOARD CARD | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/068966 | THERMAL INTERFACE MATERIAL LAYER AND USE THEREOF | NINGBO S J ELECTRONICS CO., LTD. |
WO/2021/189817 | PACKAGING STRUCTURE, SEMICONDUCTOR DEVICE AND PACKAGING METHOD | CHINA WAFER LEVEL CSP CO., LTD |
WO/2021/109722 | METALIZED LAMINATE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE COMPRISING METALIZED LAMINATE | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
WO/2021/078071 | ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD | ZTE CORPORATION |
WO/2021/093516 | COMPOSITE HEAT DISSIPATION DEVICE FOR USE IN HEATING COMPONENT HAVING INSERTION PORT, AND HEAT DISSIPATOR HAVING SAME | LUMOS TECHNOLOGY CO., LTD. |
WO/2021/179612 | BALL PLACEMENT STRUCTURE AND PREPARATION PROCESS | CHIPMORE TECHNOLOGY CORPORATION LIMITED |
WO/2021/083032 | PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR | SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD. |
WO/2021/120837 | MANUFACTURING METHOD FOR PACKAGE STRUCTURE AND PACKAGE STRUCTURE | SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD. |
WO/2021/135619 | PACKAGING STRUCTURE AND FORMING METHOD THEREFOR | CHIPMORE TECHNOLOGY CORPORATION LIMITED |
WO/2021/135620 | PACKAGING STRUCTURE AND METHOD FOR FORMING THEREOF | CHIPMORE TECHNOLOGY CORPORATION LIMITED |
WO/2021/109795 | METALIZED LAMINATION LAYER AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE COMPRISING METALIZED LAMINATION LAYER | INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES |
WO/2021/164337 | PACKAGE SUBSTRATE AND FORMING METHOD THEREFOR, AND PACKAGE STRUCTURE AND FORMING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/189877 | PIN, POWER DEVICE, METHOD FOR MANUFACTURING POWER DEVICE, AND PACKAGING MOULD | GREE ELECTRIC APPLIANCES, INC.OF ZHUHAI |
WO/2021/098849 | ALIGNMENT METHOD FOR BACKSIDE PHOTOLITHOGRAPHY PROCESS | SHENZHEN LIGHTING INSTITUTE |
WO/2021/115292 | CHIP MODULE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE | QINGDAO GOERTEK INTELLIGENT SENSOR CO., LTD |
WO/2021/164386 | QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND PREPARATION METHOD THEREFOR, AND ELECTRONIC DEVICE | QINGDAO GOERTEK MICROELECTRONICS RESEARCH INSTITUTE CO., LTD |
WO/2021/135880 | SPECIAL-SHAPED TWS SIP MODULE AND MANUFACTURING METHOD THEREFOR | QINGDAO GOERTEK INTELLIGENT SENSOR CO., LTD |
WO/2021/115357 | CERAMIC SUBSTRATE | YLX INCORPORATED |
WO/2021/203726 | SENSOR AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE | QINGDAO GOERTEK INTELLIGENT SENSOR CO., LTD |
WO/2021/218213 | LIQUID COOLING HEAT RADIATOR AND COMMUNICATION DEVICE | HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD. |
WO/2021/136222 | SILICON WAFER BACK METALLIZATION STRUCTURE AND MANUFACTURING PROCESS THEREFOR | NANJING INSTITUTE OF PRODUCT QUALITY INSPECTION |
WO/2021/136432 | SHIELDING ASSEMBLY, VEHICLE-MOUNTED DEVICE AND COMMUNICATION DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/129889 | HEAT DISSIPATING PANEL FOR CHIP HEAT DISSIPATION, SERVER HEAT DISSIPATING SYSTEM, AND HEATING APPARATUS | BEIJING SAI TECHNOLOGY CO., LTD. |
WO/2021/159961 | SYSTEM-IN-PACKAGE AND MANUFACTURING METHOD THEREFOR | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/190140 | PACKAGING STRUCTURE, ASSEMBLY AND METHOD FOR CHIP | CHINA WAFER LEVEL CSP CO., LTD |
WO/2021/190141 | PACKAGING STRUCTURE FOR CHIP AND PACKAGING METHOD THEREFOR | CHINA WAFER LEVEL CSP CO., LTD |
WO/2021/160060 | HEAT SINK, SINGLE BOARD, ELECTRONIC DEVICE, AND MANUFACTURING METHOD | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/164596 | FLEXIBLE CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND DISPLAY MODULE | BOE TECHNOLOGY GROUP CO., LTD. |
WO/2021/164607 | PACKAGING STRUCTURE AND FORMATION METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/160114 | HEAT DISSIPATION ASSEMBLY AND ELECTRONIC DEVICE CARRYING SAME | SHINE OPTOELECTRONICS (KUNSHAN) CO., LTD. |
WO/2021/227584 | ELECTROSTATIC PROTECTION CIRCUIT | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/169961 | PACKAGING STRUCTURE, PACKAGING METHOD, AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/179989 | POWER HEAT DISSIPATION DEVICE | INVENTCHIP TECHNOLOGY CO., LTD. |
WO/2021/232891 | WAFER-LEVEL CHIP STRUCTURE, MULTI-CHIP STACKING INTERCONNECTION STRUCTURE AND PREPARATION METHOD | SHANGHAI XIANFANG SEMICONDUCTOR CO., LTD. |
WO/2021/185108 | DOUBLE-SIDED CAPACITOR STRUCTURE AND FORMING METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/203889 | PID TEST STRUCTURE AND SEMICONDUCTOR TEST STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/196988 | TEST CIRCUIT AND SEMICONDUCTOR TESTING METHOD | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/190294 | WORD LINE STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR MEMORY | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/180122 | SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREFOR, AND FUSING METHOD FOR LASER FUSE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/180124 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME, AND FUSE ARRAY | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/190308 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING SAME | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/203907 | ANTI-FUSE UNIT AND ANTI-FUSE ARRAY | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/208654 | PREPARATION METHOD FOR LEAD OF SEMICONDUCTOR STRUCTURE, AND SEMICONDUCTOR STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/248954 | POWER SEMICONDUCTOR MODULE | WUXI LEAPERS SEMICONDUCTOR CO., LTD. |
WO/2021/190385 | SEMICONDUCTOR STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/203937 | ANTI-FUSE UNIT STRUCTURE AND ANTI-FUSE ARRAY | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/197090 | SEMICONDUCTOR STRUCTURE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/203969 | ANTIFUSE DEVICE AND ANTIFUSE UNIT | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/253912 | CHIP PACKAGING DEVICE, AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/204047 | SEMICONDUCTOR STORAGE DEVICE AND METHOD FOR PREPARING SAME | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/208757 | GRAPHIC FILM, SEMICONDUCTOR INTERMEDIATE PRODUCT, AND METHOD FOR ETCHING HOLE | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. |
WO/2021/204069 | TERMINAL CONNECTION STRUCTURE, DISPLAY UNIT, AND DISPLAY | BEIJING IVISUAL 3D TECHNOLOGY CO., LTD. |
WO/2021/204070 | TERMINAL CONNECTION STRUCTURE, DISPLAY UNIT, AND DISPLAY | BEIJING IVISUAL 3D TECHNOLOGY CO., LTD. |
WO/2021/204072 | TERMINAL CONNECTION STRUCTURE, DISPLAY UNIT, AND DISPLAY | BEIJING IVISUAL 3D TECHNOLOGY CO., LTD. |
WO/2021/208831 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAME, AND SEMICONDUCTOR DEVICE | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/208961 | FAN-OUT PACKAGING STRUCTURE | JCET GROUP CO., LTD. |
WO/2021/227862 | CHIP MODULE AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/218963 | THYRISTOR ELEMENT, THYRISTOR ELEMENT ASSEMBLY STRUCTURE AND SOFT STARTER | ZHUZHOU CRRC TIMES SEMICONDUCTOR CO., LTD. |
WO/2021/238559 | CHIP PACKAGE STRUCTURE AND ELECTRONIC DEVICE | ZTE CORPORATION |
WO/2021/219008 | STIFFENER RING AND SURFACE PACKAGING ASSEMBLY | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/223694 | POWER SEMICONDUCTOR DEVICE | YAN, Xinhai |
WO/2021/223695 | POWER MODULE | YAN, Xinhai |
WO/2021/254040 | DISPLAY SUBSTRATE, AND DISPLAY PANEL AND METHOD FOR PREPARING SAME | BOE TECHNOLOGY GROUP CO., LTD. |
WO/2021/238696 | WORD LINE LEAD-OUT STRUCTURE AND PREPARATION METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/244304 | CHIP ENCAPSULATION STRUCTURE AND ELECTRONIC DEVICE | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/238781 | BIT LINE LEADING-OUT STRUCTURE AND PREPARATION METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/249171 | SEMICONDUCTOR STRUCTURE AND PREPARATION METHOD THEREFOR | CHANGXIN MEMORY TECHNOLOGIES, INC. |
WO/2021/238971 | SEMICONDUCTOR CHIP, MULTIPLEXER, AND COMMUNICATION DEVICE | ROFS MICROSYSTEM (TIANJIN) CO, .LTD. |
WO/2021/258981 | ADAPTER BOARD AND CHIP ENCAPSULATION STRUCTURE | ZTE CORPORATION |
WO/2021/244512 | APPLICATION OF DIANTIMONY TRIOXIDE MATERIAL AS SEMICONDUCTOR INTEGRATED CIRCUIT INTER-LAYER OR INTER-METAL DIELECTRIC MATERIAL | SHANGHAITECH UNIVERSITY |
WO/2021/259016 | DISPLAY SUBSTRATE, TESTING METHOD THEREFOR AND PREPARATION METHOD THEREFOR, AND DISPLAY PANEL | BOE TECHNOLOGY GROUP CO., LTD. |
WO/2021/259071 | FOLDABLE SCREEN AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO., LTD. |
WO/2021/249509 | SEMICONDUCTOR APPARATUS, AND ELECTRONIC DEVICE COMPRISING SAME | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/001001 | COOLING ARRANGEMENT | CONTINENTAL AUTOMOTIVE GMBH |
WO/2021/121560 | INTEGRATED ELECTRONIC DEVICE WITH EMBEDDED MICROCHANNELS AND A METHOD FOR PRODUCING THEREOF | ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL) |
WO/2021/121608 | INDIVIDUAL ENCAPSULATED COMPONENT AND METHOD FOR THE PRODUCTION THEREOF | EV GROUP E. THALLNER GMBH |
WO/2021/148140 | A HEATSINK WITH INCREASED AIR FLOW | HUAWEI TECHNOLOGIES CO., LTD. |
WO/2021/164858 | SHORT-CIRCUIT SWITCHING DEVICE | SIEMENS AKTIENGESELLSCHAFT |
WO/2021/001084 | SEMICONDUCTOR DEVICE | INFINEON TECHNOLOGIES AUSTRIA AG |
WO/2021/005171 | POWER SEMICONDUCTOR MODULE WITH INTEGRATED SURGE ARRESTER | ABB POWER GRIDS SWITZERLAND AG |
WO/2021/005235 | THROUGH MOLD VIA FRAME | ROCKLEY PHOTONICS LIMITED |
WO/2021/018566 | LEAD FRAME ASSEMBLY, METHOD FOR PRODUCING A PLURALITY OF COMPONENTS, AND COMPONENT | OSRAM OPTO SEMICONDUCTORS GMBH |
WO/2021/013915 | ELECTRICAL AND/OR ELECTRONIC COMPONENT AND CONTACT ARRANGEMENT | ROBERT BOSCH GMBH |
WO/2021/013956 | POWER SEMICONDUCTOR MODULE AND METHOD OF FORMING THE SAME | ABB POWER GRIDS SWITZERLAND AG |
WO/2021/013988 | POWER SEMICONDUCTOR MODULE | ABB POWER GRIDS SWITZERLAND AG |
WO/2021/014000 | ARRANGEMENT COMPRISING A BASEPLATE FOR A POWER SEMICONDUCTOR MODULE AND A COOLER | ABB POWER GRIDS SWITZERLAND AG |
WO/2021/047815 | COOLING SYSTEM | TDK ELECTRONICS AG |
WO/2021/037808 | VARIABLE STIFFNESS MODULES | X-CELEPRINT LIMITED |
WO/2021/043661 | THROUGH-SUBSTRATE VIA AND METHOD FOR MANUFACTURING A THROUGH-SUBSTRATE VIA | AMS AG |
WO/2021/099019 | ELECTRONIC MODULE COMPRISING A PULSATING HEAT PIPE | SIEMENS AKTIENGESELLSCHAFT |
WO/2021/064094 | USE OF A SPIN TRANSITION MATERIAL TO MEASURE AND/OR LIMIT THE TEMPERATURE OF ELECTRONIC/PHOTONIC COMPONENTS | CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE |
WO/2021/069450 | POWER SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR COMPONENT | VITESCO TECHNOLOGIES GMBH |
WO/2021/069451 | POWER SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A POWER SEMICONDUCTOR COMPONENT | VITESCO TECHNOLOGIES GMBH |
WO/2021/069501 | COOLING SYSTEM COMPRISING A SERPENTINE PASSAGEWAY | DANFOSS SILICON POWER GMBH |
WO/2021/073985 | SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT | VITESCO TECHNOLOGIES GMBH |
WO/2021/121728 | METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE OF THIS TYPE | ROGERS GERMANY GMBH |
WO/2021/078953 | METHOD FOR PRODUCING AN SMD SOLDERABLE COMPONENT, SMD SOLDERABLE COMPONENT, ELECTRONICS UNIT AND FIELD DEVICE | ENDRESS+HAUSER SE+CO. KG |
WO/2021/209164 | SWITCHING ELEMENT | MARQUARDT GMBH |
WO/2021/089443 | CHARGED-PARTICLE DETECTOR PACKAGE FOR HIGH SPEED APPLICATIONS | ASML NETHERLANDS B.V. |
WO/2021/110387 | POWER MODULE | DANFOSS SILICON POWER GMBH |
WO/2021/105028 | POWER MODULE WITH HOUSED POWER SEMICONDUCTORS FOR CONTROLLABLE ELECTRICAL POWER SUPPLY OF A CONSUMER, AND METHOD FOR PRODUCING SAME | ZF FRIEDRICHSHAFEN AG |
WO/2021/105144 | CIRCUIT CARRIER FOR AN ELECTRONICS MODULE, AND POWER ELECTRONICS MODULE HAVING A CIRCUIT CARRIER | VITESCO TECHNOLOGIES GERMANY GMBH |
WO/2021/105203 | SUBSTRATE BONDING | PLESSEY SEMICONDUCTORS LIMITED |
WO/2021/115793 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE | TECHNISCHE UNIVERSITÄT DRESDEN |
WO/2021/139924 | COOLING DEVICE | ROBERT BOSCH GMBH |
WO/2021/115897 | COOLING DEVICE FOR SEMICONDUCTOR SWITCHING ELEMENTS, POWER INVERTER DEVICE AND ARRANGEMENT WITH A POWER INVERTER DEVICE AND AN ELECTRIC MACHINE | VALEO SIEMENS EAUTOMOTIVE GERMANY GMBH |
WO/2021/122034 | METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE, AND METAL-CERAMIC SUBSTRATE PRODUCED USING A METHOD OF THIS TYPE | ROGERS GERMANY GMBH |
WO/2021/123015 | COMPUTER DEVICE AND METHOD OF MANUFACTURING THE SAME | GRAPHCORE LIMITED |
WO/2021/130110 | POWER MODULE WITH IMPROVED ELECTRICAL AND THERMAL CHARACTERISTICS | DANFOSS SILICON POWER GMBH |
WO/2021/144120 | HOUSING, OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND PRODUCTION METHOD | OSRAM OPTO SEMICONDUCTORS GMBH |
WO/2021/130141 | SEMICONDUCTOR DEVICE WITH A BOND PAD AND A SANDWICH PASSIVATION LAYER AND MANUFACTURING METHOD THEREOF | AMS AG |
WO/2021/130290 | POWER MODULE WITH IMPROVED ELECTRICAL CHARACTERISTICS | DANFOSS SILICON POWER GMBH |
WO/2021/156086 | FAST ELECTRONIC SWITCH | SIEMENS AKTIENGESELLSCHAFT |
WO/2021/151949 | POWER SEMICONDUCTOR MODULE WITH ACCESSIBLE METAL CLIPS | ABB POWER GRIDS SWITZERLAND AG |
WO/2021/170332 | ELECTRONIC MODULE, METHOD FOR PRODUCING AN ELECTRONIC MODULE, AND INDUSTRIAL PLANT | SIEMENS AKTIENGESELLSCHAFT |
WO/2021/152021 | FREE CONFIGURABLE POWER SEMICONDUCTOR MODULE | ABB POWER GRIDS SWITZERLAND AG |
WO/2021/170472 | SUBSTRATE SEMI-FINISHED PRODUCT FOR A POWER-ELECTRONICS ASSEMBLY | SIEMENS AKTIENGESELLSCHAFT |
WO/2021/165483 | POWER SEMICONDUCTOR MODULE | ABB POWER GRIDS SWITZERLAND AG |
WO/2021/197719 | POWER MODULE DEVICE WITH IMPROVED THERMAL PERFORMANCE | ABB POWER GRIDS SWITZERLAND AG |
WO/2021/209186 | SEMICONDUCTOR MODULE COMPRISING A HOUSING | SIEMENS AKTIENGESELLSCHAFT |
WO/2021/180639 | ELECTRONICS MODULE AND METHOD FOR PRODUCING AN ELECTRONICS MODULE | ROGERS GERMANY GMBH |
WO/2021/185616 | MULTI-METAL HOOK-AND-LOOP WELDING | NANOWIRED GMBH |
WO/2021/185617 | COMPOSITE CONNECTION OF TWO COMPONENTS | NANOWIRED GMBH |
WO/2021/185618 | CONNECTION OF COMPONENTS | NANOWIRED GMBH |
WO/2021/180660 | POWER MODULE | DANFOSS SILICON POWER GMBH |
WO/2021/186085 | ELECTRONIC PACKAGE AND ELECTRONIC DEVICE COMPRISING THE SAME | AMPLEON NETHERLANDS B.V. |
WO/2021/198018 | ELECTRONIC MODULE FOR CHIP CARD | SMART PACKAGING SOLUTIONS |
WO/2021/249680 | ELECTRICAL POWER MODULE | MAGNA POWERTRAIN GMBH & CO KG |
WO/2021/254679 | POWER SEMICONDUCTOR MODULE COMPRISING AT LEAST ONE POWER SEMICONDUCTOR ELEMENT | SIEMENS AKTIENGESELLSCHAFT |
WO/2021/259555 | COOLING GEOMETRY FOR POWER ELECTRONICS | ZF FRIEDRICHSHAFEN AG |
WO/2021/234118 | ELECTRIC CIRCUIT FOR AN ELECTRONIC CHIP CARD MODULE WITH COLOURED CONTACTS AND METHOD FOR PRODUCING SAME | LINXENS HOLDING |
WO/2021/254922 | THERMALLY STABLE BOND BETWEEN A STRANDED WIRE AND A CONTACT PAD AND THE METHOD FOR PRODUCING IT | HERAEUS NEXENSOS GMBH |
WO/2021/165577 | AIRBRIDGE FOR MAKING CONNECTIONS ON SUPERCONDUCTING CHIP, AND METHOD FOR PRODUCING SUPERCONDUCTING CHIPS WITH AIRBRIDGES | IQM FINLAND OY |
WO/2021/099719 | CONDUCTIVE METAL FRAME FOR A POWER ELECTRONIC MODULE AND ASSOCIATED MANUFACTURING PROCESS | SAFRAN |
WO/2021/136906 | METHOD FOR SELF-ALIGNED CONNECTION OF A STRUCTURE TO A SUPPORT, DEVICE OBTAINED FROM SUCH A METHOD, AND THE STRUCTURES AND SUPPORTS IMPLEMENTED BY SUCH A METHOD | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES |
WO/2021/181021 | DEVICE FOR TRANSFERRING HEAT | SAFRAN |
WO/2021/019199 | BOARD ASSEMBLY WITH CHEMICAL VAPOR DEPOSITION DIAMOND (CVDD) WINDOWS FOR THERMAL TRANSPORT | MICROSEMI SEMICONDUCTOR LIMITED |
WO/2021/094714 | SYSTEM-IN-PACKAGE ARCHITECTURE WITH WIRELESS BUS INTERCONNECT | ARM LIMITED |
WO/2021/105676 | SENSOR SEMICONDUCTOR PACKAGE, ARTICLE COMPRISING THE SAME AND MANUFACTURING METHOD THEREOF | PREVAYL LIMITED |
WO/2021/001757 | METHOD AND APPARATUS FOR MOUNTING AND COOLING A CIRCUIT COMPONENT | LANDA LABS (2012) LTD. |
WO/2021/005585 | THREE-DIMENSIONAL INTEGRATED CIRCUIT | GOŁOFIT, Krzysztof |
WO/2021/028800 | OPTO-ELECTRONIC DEVICE INCLUDING AN AUXILIARY ELECTRODE AND A PARTITION | OTI LUMIONICS INC. |
WO/2021/059052 | INTERCONNECTION WITH SIDE CONNECTION TO SUBSTRATE | INTERNATIONAL BUSINESS MACHINES CORPORATION |
WO/2021/064486 | ALIGNMENT CARRIER FOR INTERCONNECT BRIDGE ASSEMBLY | INTERNATIONAL BUSINESS MACHINES CORPORATION |
WO/2021/079209 | FORMING OF BUMP STRUCTURE | INTERNATIONAL BUSINESS MACHINES CORPORATION |
WO/2021/079333 | HEAT SINKS WITH VIBRATION ENHANCED HEAT TRANSFER FOR NON-LIQUID HEAT SOURCES | UNITED ARAB EMIRATES UNIVERSITY |
WO/2021/111296 | PATTERNED DESIGN FOR THERMAL MANAGEMENT OF TWO-PHASE IMMERSION COOLING SYSTEM FOR ELECTRONICS | 3M INNOVATIVE PROPERTIES COMPANY |
WO/2021/116911 | SINGLE LAYER LC OSCILLATOR | WILIOT, LTD. |
WO/2021/156688 | INTERCONNECT STRUCTURES WITH COBALT-INFUSED RUTHENIUM LINER AND A COBALT CAP | INTERNATIONAL BUSINESS MACHINES CORPORATION |
WO/2021/148977 | THROUGH-INTERPOSER GROUNDING USING BLIND VIAS | MURATA MANUFACTURING CO., LTD. |
WO/2021/149009 | ELECTRICAL CONNECTIONS TO EMBEDDED ELECTRONIC COMPONENTS | 3M INNOVATIVE PROPERTIES COMPANY |
WO/2021/165801 | SEMICONDUCTOR STRUCTURE WITH CRACK-BLOCKING THREE-DIMENSIONAL STRUCTURE | MURATA MANUFACTURING CO., LTD. |
WO/2021/186269 | INTERCONNECTION FABRIC FOR BURIED POWER DISTRIBUTION | INTERNATIONAL BUSINESS MACHINES CORPORATION |
WO/2021/245467 | HIGH-RESOLUTION SOLDERING | ORBOTECH LTD. |
WO/2021/205247 | ELECTRIC ASSEMBLY INCLUDING HEAT SPREADING LAYER | 3M INNOVATIVE PROPERTIES COMPANY |
WO/2021/209839 | THERMAL INTERFACE MATERIAL STRUCTURES FOR DIRECTING HEAT IN A THREE-DIMENSIONAL SPACE | INTERNATIONAL BUSINESS MACHINES CORPORATION |
WO/2021/220071 | SECURE CHIP IDENTIFICATION USING RESISTIVE PROCESSING UNIT AS A PHYSICALLY UNCLONABLE FUNCTION | INTERNATIONAL BUSINESS MACHINES CORPORATION |
WO/2021/191781 | HEAT DISSIPATION MECHANISM, GATEWAY, AND LITE-GATEWAY | TDK CORPORATION |
WO/2021/234478 | MULTILAYER TAPE INCLUDING PLURALITY OF MAGNETIC METAL PARTICLES AND ELECTRONIC ASSEMBLY INCLUDING THE SAME | 3M INNOVATIVE PROPERTIES COMPANY |
WO/2021/229553 | NUCLEATION-INHIBITING COATING CONTAINING RARE EARTH COMPOUNDS AND DEVICES INCORPORATING SAME | OTI LUMIONICS INC. |
WO/2021/240305 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | STMICROELECTRONICS S.R.L. |
WO/2021/074916 | INTEGRATED ELECTRONIC STRUCTURE AND DATA COMMUNICATION BETWEEN COMPONENTS OF THE STRUCTURE | OEC SA |
WO/2021/001924 | POWER MODULE AND MANUFACTURING METHOD THEREFOR | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/001927 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/002006 | SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/005650 | SERVO AMP | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/005797 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/019594 | SEMICONDUCTOR MODULE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/019614 | SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/019697 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC COMPONENT DEVICE | SHOWA DENKO MATERIALS CO., LTD. |
WO/2021/028965 | SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/033269 | SEMICONDUCTOR PACKAGE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/033270 | SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERTER AND MOVING BODY | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/038688 | POWER SEMICONDUCTOR DEVICE, PRODUCTION METHOD FOR POWER SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/038796 | POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/044550 | HEAT SINK AND SEMICONDUCTOR MODULE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/070358 | SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/074978 | SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/074980 | POWER MODULE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/075030 | VEHICLE-MOUNTED CHARGER AND MANUFACTURING METHOD | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/075035 | OPTICAL COMMUNICATION COMPONENT | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
WO/2021/079427 | SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/084638 | HERMETICALLY SEALED SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/084749 | HEAT DISSIPATION SUBSTRATE AND PRODUCTION METHOD THEREFOR | MEIKO ELECTRONICS CO., LTD. |
WO/2021/084750 | INTERPOSER MOUNTED SUBSTRATE | MEIKO ELECTRONICS CO., LTD. |
WO/2021/095146 | SEMICONDUCTOR DEVICE | DENSO CORPORATION |
WO/2021/100199 | SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SAME, AND ELECTRIC POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/106114 | SEMICONDUCTOR MODULE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/111517 | COMPONENT MODULE AND MANUFACTURING METHOD THEREFOR | TAIYO YUDEN CO., LTD. |
WO/2021/111534 | OPTICAL TRANSMISSION MODULE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/111563 | SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/111575 | ELEMENT MODULE | TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION |
WO/2021/117191 | COMPONENT MODULE AND PRODUCTION METHOD FOR SAME | TAIYO YUDEN CO., LTD. |
WO/2021/124518 | POWER CONVERSION DEVICE AND METHOD FOR MANUFACTURING SAME | TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION |
WO/2021/130989 | POWER MODULE AND POWER CONVERTING DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/131044 | COMPONENT MODULE | TAIYO YUDEN CO., LTD. |
WO/2021/140547 | ELECTRIC POWER CONVERSION UNIT | TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION |
WO/2021/140572 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/140586 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/140664 | WIRING BOARD AND PRODUCTION METHOD FOR SAME | NEC CORPORATION |
WO/2021/144925 | SEMICONDUCTOR MODULE | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
WO/2021/144980 | POWER MODULE AND POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/149161 | HEAT DISSIPATION MEMBER AND HEAT SINK | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/053844 | SERVO DRIVER | OMRON CORPORATION |
WO/2021/157024 | SEMICONDUCTOR MODULE AND POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/157045 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/059549 | DRIVER | MITSUBA CORPORATION |
WO/2021/161498 | COMPONENT MODULE | TAIYO YUDEN CO., LTD. |
WO/2021/171336 | METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE | TAIYO YUDEN CO., LTD. |
WO/2021/171425 | DC POWER SUPPLY DEVICE, REFRIGERANT CYCLE DEVICE, AIR CONDITIONER, AND REFRIGERATOR | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/181468 | SEMICONDUCTOR MODULE | TAIYO YUDEN CO., LTD. |
WO/2021/181649 | SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME | TAIYO YUDEN CO., LTD. |
WO/2021/014681 | ELECTRONIC CIRCUIT MODULE | ALPS ALPINE CO., LTD. |
WO/2021/186519 | ELECTRONIC MODULE, METHOD FOR MANUFACTURING ELECTRONIC MODULE, AND ENDOSCOPE | OLYMPUS CORPORATION |
WO/2021/186657 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/009970 | SEMICONDUCTOR MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/191946 | POWER MODULE | TAIYO YUDEN CO., LTD. |
WO/2021/029105 | METAL FIXTURE AND ELECTRONIC COMPONENT UNIT | KYB CORPORATION |
WO/2021/192245 | HIGH HEAT-DISSIPATION MODULE STRUCTURE | TAIYO YUDEN CO., LTD. |
WO/2021/095282 | LIGHT-EMITTING DEVICE | NUVOTON TECHNOLOGY CORPORATION JAPAN |
WO/2021/199384 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/199421 | CIRCUIT FORMATION METHOD AND CIRCUIT FORMATION DEVICE | FUJI CORPORATION |
WO/2021/199447 | MEMORY UNIT, SEMICONDUCTOR MODULE, DIMM MODULE, AND MANUFACTURING METHOD FOR SAME | ULTRAMEMORY INC. |
WO/2021/205634 | POWER SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/038951 | WIRING SUBSTRATE | NGK SPARK PLUG CO., LTD. |
WO/2021/044663 | PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME | MURATA MANUFACTURING CO., LTD. |
WO/2021/038954 | ELECTRICAL DEVICE AND ELECTRONIC CONTROL DEVICE | HITACHI AUTOMOTIVE SYSTEMS, LTD. |
WO/2021/220357 | SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/220373 | SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/224996 | IMAGING MODULE, ENDOSCOPIC SYSTEM, AND METHOD FOR MANUFACTURING IMAGING MODULE | OLYMPUS CORPORATION |
WO/2021/059576 | PIEZOELECTRIC OSCILLATOR | MURATA MANUFACTURING CO., LTD. |
WO/2021/229673 | POWER SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/229733 | SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAME | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/234803 | SEMICONDUCTOR MODULE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/234849 | SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
WO/2021/234892 | SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, MOVING BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/019877 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE, AND ELECTRONIC COMPONENT DEVICE | SHOWA DENKO MATERIALS CO., LTD. |
WO/2021/038986 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE AND ELECTRONIC COMPONENT DEVICE | SHOWA DENKO MATERIALS CO., LTD. |
WO/2021/014732 | SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURE OF SEMICONDUCTOR PACKAGE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
WO/2021/234969 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/038989 | ELECTRONIC APPARATUS COOLING DEVICE, WATER-COOLED INFORMATION PROCESSING DEVICE, COOLING MODULE, AND ELECTRONIC APPARATUS COOLING METHOD | NEC CORPORATION |
WO/2021/240764 | COOLER AND SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/005915 | SEMICONDUCTOR DEVICE | DENSO CORPORATION |
WO/2021/005916 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | DENSO CORPORATION |
WO/2021/002132 | SEMICONDUCTOR MODULE CIRCUIT STRUCTURE | FUJI ELECTRIC CO., LTD. |
WO/2021/245907 | PHOTOELECTRON INTEGRATION MODULE | NIPPON TELEGRAPH AND TELEPHONE CORPORATION |
WO/2021/245915 | POWER SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/049111 | TERMINAL STRUCTURE, PACKAGE, AND METHOD FOR MANUFACTURING TERMINAL STRUCTURE | NGK ELECTRONICS DEVICES, INC. |
WO/2021/044691 | HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE | MURATA MANUFACTURING CO., LTD. |
WO/2021/005972 | MULTILAYERED SUBSTRATE | MURATA MANUFACTURING CO., LTD. |
WO/2021/044698 | SEMICONDUCTOR LASER DEVICE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
WO/2021/095294 | PIEZOELECTRIC VIBRATOR AND METHOD FOR MANUFACTURING SAME | MURATA MANUFACTURING CO., LTD. |
WO/2021/255829 | HEAT-RADIATING MEMBER AND HEAT-RADIATING SUBSTRATE USING SAME | MEIKO ELECTRONICS CO., LTD. |
WO/2021/010079 | ELECTRONIC COMPONENT MOUNTING STRUCTURE, ELECTRONIC COMPONENT MOUNTING METHOD, AND LED DISPLAY PANEL | V TECHNOLOGY CO., LTD. |
WO/2021/044703 | SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
WO/2021/033418 | HIGH-FREQUENCY MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/024636 | SEMICONDUCTOR MODULE | FUJI ELECTRIC CO., LTD. |
WO/2021/039076 | HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE | MURATA MANUFACTURING CO., LTD. |
WO/2021/019982 | HEAT-CONDUCTING SHEET AND METHOD FOR MANUFACTURING SAME | AWA PAPER & TECHNOLOGICAL COMPANY, INC. |
WO/2021/006076 | MULTILAYERED SUBSTRATE | MURATA MANUFACTURING CO., LTD. |
WO/2021/029150 | SEMICONDUCTOR DEVICE | FUJI ELECTRIC CO., LTD. |
WO/2021/010153 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SAME | STANLEY ELECTRIC CO., LTD. |
WO/2021/014904 | LID MATERIAL FOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING LID MATERIAL, AND LIGHT-EMITTING DEVICE | DAISHINKU CORPORATION |
WO/2021/059647 | HEAT DISSIPATION SHEET | FUJIFILM CORPORATION |
WO/2021/059648 | HEAT DISSIPATION SHEET | FUJIFILM CORPORATION |
WO/2021/002375 | SEALANT FOR ORGANIC EL DISPLAY ELEMENT | SEKISUI CHEMICAL CO., LTD. |
WO/2021/002379 | SEALING AGENT SET FOR ORGANIC EL DISPLAY ELEMENT AND ORGANIC EL DISPLAY ELEMENT | SEKISUI CHEMICAL CO., LTD. |
WO/2021/006141 | MODULE AND METHOD FOR MANUFACTURING SAME | MURATA MANUFACTURING CO., LTD. |
WO/2021/010164 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURE OF ELECTRONIC COMPONENT | MURATA MANUFACTURING CO., LTD. |
WO/2021/002387 | STORAGE DEVICE UNIT | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
WO/2021/010173 | WIRING MODULE AND IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
WO/2021/020019 | TRANSMISSION LINE SUBSTRATE AND ELECTRONIC DEVICE | MURATA MANUFACTURING CO., LTD. |
WO/2021/014925 | LID MATERIAL FOR LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING LID MATERIAL | DAISHINKU CORPORATION |
WO/2021/010204 | RESIN SHEET FOR SEALING | NITTO DENKO CORPORATION |
WO/2021/010205 | SEALING RESIN SHEET | NITTO DENKO CORPORATION |
WO/2021/010206 | RESIN SHEET FOR SEALING | NITTO DENKO CORPORATION |
WO/2021/010207 | RESIN SHEET FOR SEALING | NITTO DENKO CORPORATION |
WO/2021/010208 | MULTILAYER RESIN SHEET FOR SEALING | NITTO DENKO CORPORATION |
WO/2021/010209 | SEALING RESIN SHEET | NITTO DENKO CORPORATION |
WO/2021/010210 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/006297 | SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE | DENSO CORPORATION |
WO/2021/015006 | ELECTRIC DEVICE UNIT | HITACHI ZOSEN CORPORATION |
WO/2021/015007 | HEAT DISSIPATION PLATE AND METHOD FOR MANUFACTURING HEAT DISSIPATION PLATE | HITACHI METALS,LTD. |
WO/2021/015008 | ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE | TDK CORPORATION |
WO/2021/225006 | SEMICONDUCTOR DEVICE | AOI ELECTRONICS CO.,LTD. |
WO/2021/020193 | PACKAGE FOR MOUNTING ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND ELECTRONIC MODULE | KYOCERA CORPORATION |
WO/2021/039202 | THERMALLY CONDUCTIVE RESIN AND HEAT-DISSIPATING STRUCTURE | IBIDEN CO., LTD. |
WO/2021/020331 | MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/020332 | MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/192341 | PRODUCTION METHOD FOR SEMICONDUCTOR PACKAGES | SHOWA DENKO MATERIALS CO., LTD. |
WO/2021/020447 | ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, ELECTRONIC MODULE, AND METHOD FOR MANUFACTURING ELECTRONIC ELEMENT MOUNTING SUBSTRATE | KYOCERA CORPORATION |
WO/2021/020456 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE | DENSO CORPORATION |
WO/2021/020471 | CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING SAME, COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING SAME | DENKA COMPANY LIMITED |
WO/2021/020480 | ELECTRONIC COMPONENT MOUNTING PACKAGE, AND ELECTRONIC DEVICE | KYOCERA CORPORATION |
WO/2021/020530 | ELECTRONIC COMPONENT MOUNTING PACKAGE, AND ELECTRONIC DEVICE | KYOCERA CORPORATION |
WO/2021/053975 | POWER CONVERTER AND MOTOR-INTEGRATED POWER CONVERTER | HITACHI AUTOMOTIVE SYSTEMS, LTD. |
WO/2021/033538 | ELECTRONIC SUBSTRATE, METHOD FOR MANUFACTURING ELECTRONIC SUBSTRATE, AND ELECTRONIC INSTRUMENT | AGC INC. |
WO/2021/025045 | HEAT SINK | MITSUBISHI MATERIALS CORPORATION |
WO/2021/039325 | MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/025073 | MULTILAYER SUBSTRATE MANUFACTURING METHOD AND MULTILAYER SUBSTRATE | MURATA MANUFACTURING CO., LTD. |
WO/2021/029371 | PACKAGE FOR MOUNTING OPTICAL ELEMENT, ELECTRONIC DEVICE, AND ELECTRONIC MODULE | KYOCERA CORPORATION |
WO/2021/039376 | ELECTRICAL JUNCTION BOX | AUTONETWORKS TECHNOLOGIES, LTD. |
WO/2021/029416 | PRINTED CIRCUIT BOARD | ITABASHI SEIKI CO,. LTD. |
WO/2021/044816 | SEMICONDUCTOR LASER DRIVING DEVICE, ELECTRONIC EQUIPMENT, AND METHOD OF MANUFACTURING SEMICONDUCTOR LASER DRIVING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
WO/2021/049237 | CONTACT PROBE AND INSPECTION SOCKET COMPRISING SAME | YAMAICHI ELECTRONICS CO., LTD. |
WO/2021/049242 | WIRING CIRCUIT BOARD | NITTO DENKO CORPORATION |
WO/2021/054008 | ELECTRICAL CIRCUIT BODY, POWER CONVERSION DEVICE, AND ELECTRICAL CIRCUIT BODY MANUFACTURING METHOD | HITACHI AUTOMOTIVE SYSTEMS, LTD. |
WO/2021/054017 | MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/039500 | HEAT-RADIATING SHEET AND METHOD OF PRODUCING HEAT-RADIATING SHEET | DENKA COMPANY LIMITED |
WO/2021/084848 | HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE | MURATA MANUFACTURING CO., LTD. |
WO/2021/100273 | METHOD AND SYSTEM FOR INTERCONNECTING POWER DEVICE EMBEDDED IN SUBSTRATE USING CONDUCTING PASTE INTO CAVITIE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/145015 | SUBSTRATE AND ANTENNA MODULE | FUJIKURA LTD. |
WO/2021/039732 | COMPOSITION FOR FORMING HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING MATERIAL, HEAT-CONDUCTING SHEET, AND DEVICE WITH HEAT-CONDUCTING LAYER | FUJIFILM CORPORATION |
WO/2021/039809 | SEMICONDUCTOR ENCAPSULATION RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE | SUMITOMO BAKELITE CO., LTD. |
WO/2021/039816 | ELECTRIC CIRCUIT BOARD AND POWER MODULE | KYOCERA CORPORATION |
WO/2021/065259 | SEMICONDUCTOR DEVICE | DENSO CORPORATION |
WO/2021/059851 | ELECTRONIC COMPONENT, MANUFACTURING METHOD OF ELECTRONIC COMPONENT, MOUNTING STRUCTURE, AND MANUFACTURING METHOD OF MOUNTING STRUCTURE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
WO/2021/039963 | MOUNT BOARD AND ELECTRONIC DEVICE | KYOCERA CORPORATION |
WO/2021/039969 | ELECTRONIC COMPONENT MOUNTING PACKAGE, AND ELECTRONIC DEVICE | KYOCERA CORPORATION |
WO/2021/065272 | PHOTODETECTOR | HAMAMATSU PHOTONICS K.K. |
WO/2021/049400 | ELECTRONIC COMPONENT MODULE AND PRODUCTION METHOD FOR ELECTRONIC COMPONENT MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/059914 | ELECTRONIC CIRCUIT DEVICE | HITACHI ASTEMO, LTD. |
WO/2021/054143 | SUBSTRATE FOR SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING WIRELESS COMMUNICATION DEVICE | TORAY INDUSTRIES, INC. |
WO/2021/045211 | VAPOR CHAMBER, ELECTRONIC APPARATUS, VAPOR CHAMBER SHEET, SHEET HAVING MULTIPLE FACES OF VAPOR CHAMBER INTERMEDIARY BODY, ROLL HAVING MULTIPLE FACES OF VAPOR CHAMBER INTERMEDIARY BODY WOUND THEREON, AND VAPOR CHAMBER INTERMEDIARY BODY | DAI NIPPON PRINTING CO., LTD. |
WO/2021/059936 | THERMALLY CONDUCTIVE SILICONE COMPOSITION, PRODUCTION METHOD THEREOF, AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. |
WO/2021/059947 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/049521 | MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/152899 | ELECTRONIC CONTROL DEVICE | HITACHI ASTEMO, LTD. |
WO/2021/131175 | COOLING STRUCTURE AND HEATSINK | MEIDENSHA CORPORATION |
WO/2021/049578 | SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE | SHOWA DENKO MATERIALS CO., LTD. |
WO/2021/049645 | ENCAPSULATING MATERIAL FOR COMPRESSION MOLDING AND ELECTRONIC PART AND DEVICE | SHOWA DENKO MATERIALS CO., LTD. |
WO/2021/070569 | ELECTRONIC DEVICE | DENSO CORPORATION |
WO/2021/054316 | CIRCUIT BOARD AND MODULE COMPRISING SAME | DENKA COMPANY LIMITED |
WO/2021/054332 | MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/065529 | AIRTIGHT CONNECTION UNIT, AIRTIGHT CONNECTION ASSEMBLY, AIRTIGHT CONTAINER AND VAPORIZER, AS WELL AS METHOD FOR MANUFACTURING AIRTIGHT CONNECTION ASSEMBLY | HITACHI METALS, LTD. |
WO/2021/117310 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
WO/2021/060161 | MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/060163 | MODULE AND METHOD FOR MANUFACTURING SAME | MURATA MANUFACTURING CO., LTD. |
WO/2021/060164 | ELECTRONIC COMPONENT MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/054435 | CIRCUIT BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE | KYOCERA CORPORATION |
WO/2021/065601 | WIRING SUBSTRATE | KYOCERA CORPORATION |
WO/2021/060318 | HEAT-DISSIPATING SHEET, HEAT-DISSIPATING SHEET LAMINATE, STRUCTURE, AND HEAT-GENERATING ELEMENT HEAT DISSIPATION TREATMENT METHOD | DENKA COMPANY LIMITED |
WO/2021/060319 | HEAT DISSIPATION SHEET, HEAT DISSIPATION SHEET LAYERED BODY, STRUCTURE, AND METHOD FOR DISSIPATING HEAT FROM HEAT-GENERATING ELEMENT | DENKA COMPANY LIMITED |
WO/2021/060320 | HEAT-DISSIPATING SHEET | DENKA COMPANY LIMITED |
WO/2021/060321 | HEAT DISSIPATION SHEET | DENKA COMPANY LIMITED |
WO/2021/079677 | RESIN COMPOSITION FOR SEALING AND SEMICONDUCTOR DEVICE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
WO/2021/065672 | LID FOR ELECTRONIC DEVICE, PACKAGE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE | KYOCERA CORPORATION |
WO/2021/131192 | WIRING STRUCTURE | NGK ELECTRONICS DEVICES, INC. |
WO/2021/060475 | ELECTRONIC COMPONENT MOUNTING BASE AND ELECTRONIC DEVICE | KYOCERA CORPORATION |
WO/2021/060547 | ELECTRONIC DEVICE | DENSO CORPORATION |
WO/2021/171671 | IC MODULE AND METHOD FOR MANUFACTURING IC MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/085006 | POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING POWER SEMICONDUCTOR DEVICE | HITACHI ASTEMO, LTD. |
WO/2021/065899 | THERMALLY CONDUCTIVE RESIN SHEET | SEKISUI CHEMICAL CO., LTD. |
WO/2021/065907 | SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT PRODUCTION METHOD | ROHM CO., LTD. |
WO/2021/065974 | RESIN COMPOSITION AND RESIN SHEET | AJINOMOTO CO., INC. |
WO/2021/070702 | SEMICONDUCTOR DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
WO/2021/111715 | IMAGING DEVICE AND METHOD FOR MANUFACTURING IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
WO/2021/111716 | IMAGING DEVICE AND MANUFACTURING METHOD FOR IMAGING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
WO/2021/066024 | LID BODY, ELECTRONIC COMPONENT ACCOMMODATION PACKAGE, AND ELECTRONIC DEVICE | KYOCERA CORPORATION |
WO/2021/079735 | SEMICONDUCTOR DEVICE, RECTIFYING ELEMENT USING SAME, AND ALTERNATOR | HITACHI POWER SEMICONDUCTOR DEVICE, LTD. |
WO/2021/095401 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD | MURATA MANUFACTURING CO., LTD. |
WO/2021/124653 | SEMICONDUCTOR DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
WO/2021/111731 | LIGHT-EMITTING DEVICE AND DISPLAY DEVICE | JAPAN DISPLAY INC. |
WO/2021/075360 | ELECTRONIC CONTROL DEVICE | HITACHI ASTEMO, LTD. |
WO/2021/079782 | INSULATED TRANSMISSION DEVICE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
WO/2021/100366 | ELECTRONIC DEVICE, SULFIDATION INHIBITOR, AND SEALANT | KONICA MINOLTA, INC. |
WO/2021/085180 | ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/079846 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/085216 | SEMICONDUCTOR DEVICE, ELECTRIC POWER CONVERSION DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/079851 | CIRCUIT MODULE AND METHOD FOR PRODUCING SAME | MURATA MANUFACTURING CO., LTD. |
WO/2021/085234 | SEMICONDUCTOR MODULE, POWER CONVERSION APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING POWER CONVERSION APPARATUS | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/079913 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/079918 | COMPOSITE SHEET AND METHOD FOR MANUFACTURING SAME, AND LAMINATE AND METHOD FOR MANUFACTURING SAME | DENKA COMPANY LIMITED |
WO/2021/090694 | MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/085303 | RESIN MOLDED BODY FOR OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE | DAICEL CORPORATION |
WO/2021/186782 | CIRCUIT BOARD MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/079995 | ELECTRONIC COMPONENT MOUNTING PACKAGE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE | KYOCERA CORPORATION |
WO/2021/085378 | LID BODY, ELECTRONIC COMPONENT ACCOMMODATION PACKAGE, AND ELECTRONIC DEVICE | KYOCERA CORPORATION |
WO/2021/085383 | THERMALLY CONDUCTIVE SHEET AND PRODUCTION METHOD FOR SAME | SEKISUI POLYMATECH CO., LTD. |
WO/2021/085413 | MOUNT BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE | KYOCERA CORPORATION |
WO/2021/095515 | HEAT DISSIPATION SHEET | TATSUTA ELECTRIC WIRE & CABLE CO., LTD. |
WO/2021/106471 | RADAR DEVICE | DENSO CORPORATION |
WO/2021/192384 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/085458 | LIGHT-EMITTING ELEMENT MOUNTING PACKAGE AND LIGHT-EMITTING DEVICE | KYOCERA CORPORATION |
WO/2021/124691 | HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE | MURATA MANUFACTURING CO., LTD. |
WO/2021/085490 | CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAME, COMPOSITE SUBSTRATE AND METHOD FOR PRODUCING SAME, AND CIRCUIT BOARD AND METHOD FOR PRODUCING SAME | DENKA COMPANY LIMITED |
WO/2021/124704 | SEMICONDUCTOR DEVICE | FUJI ELECTRIC CO., LTD. |
WO/2021/090759 | GRAPHENE-CONTAINING CARBONACEOUS MEMBER/CERAMIC ASSEMBLY AND COPPER/GRAPHENE-CONTAINING CARBONACEOUS MEMBER/CERAMIC ASSEMBLY | MITSUBISHI MATERIALS CORPORATION |
WO/2021/085587 | WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE | KYOCERA CORPORATION |
WO/2021/095568 | COOLING SYSTEM AND ELECTRONIC DEVICE | NEC PLATFORMS, LTD. |
WO/2021/095569 | COOLING SYSTEM AND ELECTRONIC APPARATUS | NEC PLATFORMS, LTD. |
WO/2021/095572 | COOLING SYSTEM AND ELECTRONIC APPARATUS | NEC PLATFORMS, LTD. |
WO/2021/090780 | THERMALLY CONDUCTIVE SILICONE COMPOSITION AND THERMALLY CONDUCTIVE SILICONE MATERIAL | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
WO/2021/090785 | ELECTRONIC DEVICE | ELEPHANTECH INC. |
WO/2021/111791 | HEAT SINK AND HEAT SINK MANUFACTURING METHOD | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/090840 | VAPOR CHAMBER | FURUKAWA ELECTRIC CO., LTD. |
WO/2021/090867 | LAMINATE FOR SEMICONDUCTOR PROCESSING, ADHESIVE TAPE FOR SEMICONDUCTOR PROCESSING, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | SEKISUI CHEMICAL CO., LTD. |
WO/2021/095658 | SENSOR DEVICE AND SENSOR | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
WO/2021/100504 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURE OF ELECTRONIC COMPONENT | MURATA MANUFACTURING CO., LTD. |
WO/2021/100505 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | MURATA MANUFACTURING CO., LTD. |
WO/2021/100506 | ELECTRONIC COMPONENT | MURATA MANUFACTURING CO., LTD. |
WO/2021/117392 | MULTILAYER SUBSTRATE, CIRCUIT DEVICE, AND FILTER CIRCUIT BOARD | MURATA MANUFACTURING CO., LTD. |
WO/2021/117400 | SEMICONDUCTOR DEVICE | NUVOTON TECHNOLOGY CORPORATION JAPAN |
WO/2021/095792 | METHOD FOR MANUFACTURING SEALING SHEET | AJINOMOTO CO., INC. |
WO/2021/111845 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | SONY GROUP CORPORATION |
WO/2021/106620 | HEAT DISSIPATION CHIP | ROHM CO., LTD. |
WO/2021/111846 | POWER SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAME | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/106655 | PACKAGE FOR HOUSING ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND ELECTRONIC MODULE | KYOCERA CORPORATION |
WO/2021/181756 | HIGH FREQUENCY CIRCUIT AND COMMUNICATION DEVICE | MURATA MANUFACTURING CO., LTD. |
WO/2021/100674 | WINDOW AND WINDOW SPACER MEMBER | LINTEC CORPORATION |
WO/2021/100761 | CURABLE RESIN COMPOSITION, METHOD FOR PRODUCING CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION |
WO/2021/131423 | NON-CONTACT COMMUNICATION MEDIUM | KYOCERA CORPORATION |
WO/2021/192409 | SEMICONDUCTOR DEVICE | SANSHA ELECTRIC MANUFACTURING CO.,LTD. |
WO/2021/124805 | ELECTRONIC COMPONENT MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/124806 | ELECTRONIC COMPONENT MODULE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/186797 | CIRCUIT BOARD MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/106904 | GRAPHENE BONDED BODY | MITSUBISHI MATERIALS CORPORATION |
WO/2021/140765 | SEMICONDUCTOR DEVICE AND VEHICLE | FUJI ELECTRIC CO., LTD. |
WO/2021/111960 | THREE-DIMENSIONAL LAMINATED INTEGRATED CIRCUIT IN WHICH IS USED LIQUID IMMERSION COOLING METHOD PERFORMED USING SEMICONDUCTOR PACKAGE AND PERFORATED INTERPOSER | SOFTBANK CORP. |
WO/2021/140771 | SEMICONDUCTOR DEVICE | FUJI ELECTRIC CO., LTD. |
WO/2021/124832 | POWER MODULE, POWER CONVERSION DEVICE, AND METHOD FOR MANUFACTURING POWER MODULE | HITACHI ASTEMO, LTD. |
WO/2021/124833 | POWER MODULE | HITACHI ASTEMO, LTD. |
WO/2021/149352 | POWER CONVERSION DEVICE | DENSO CORPORATION |
WO/2021/107114 | WIRING BASE, PACKAGE FOR STORING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE | KYOCERA CORPORATION |
WO/2021/107145 | DISPLAY DEVICE | KYOCERA CORPORATION |
WO/2021/210214 | PIEZOELECTRIC VIBRATOR AND METHOD FOR MANUFACTURING SAME | MURATA MANUFACTURING CO., LTD. |
WO/2021/220542 | PIEZOELECTRIC VIBRATOR | MURATA MANUFACTURING CO., LTD. |
WO/2021/112073 | ELECTRONIC COMPONENT MOUNTING BASE, ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING SAME, AND ELECTRONIC INSTRUMENT | SONY GROUP CORPORATION |
WO/2021/117548 | SEMICONDUCTOR DEVICE PRODUCTION METHOD, SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/131540 | LIGHT-EMITTING ELEMENT PACKAGE AND PRODUCTION METHOD FOR SAME | AJINOMOTO CO., INC. |
WO/2021/145082 | SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
WO/2021/124922 | ELECTRIC POWER CONVERSION DEVICE | HITACHI ASTEMO, LTD. |
WO/2021/112238 | MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC SHIELD FILM, AND TERMINAL PROTECTION TAPE | LINTEC CORPORATION |
WO/2021/145096 | ELECTRONIC DEVICE | DENSO CORPORATION |
WO/2021/192429 | HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE | MURATA MANUFACTURING CO., LTD. |
WO/2021/131663 | MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/153016 | WIRING BOARD | KYOCERA CORPORATION |
WO/2021/153023 | SUBSTRATE AND SEMICONDUCTOR PACKAGE | SONY GROUP CORPORATION |
WO/2021/131718 | THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR MOUNTING THERMALLY CONDUCTIVE SHEET | DEXERIALS CORPORATION |
WO/2021/131775 | MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/149393 | ELECTRONIC CONTROL DEVICE | HITACHI ASTEMO, LTD. |
WO/2021/157199 | POWER CONVERTER | DENSO CORPORATION |
WO/2021/149404 | IMAGING DEVICE | HITACHI ASTEMO, LTD. |
WO/2021/140850 | MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/181789 | POWER CONVERSION UNIT AND POWER CONVERSION DEVICE | HITACHI, LTD. |
WO/2021/153061 | INSPECTION SOCKET | YOKOWO CO., LTD. |
WO/2021/255963 | WIRELESS MODULE | FUJIKURA LTD. |
WO/2021/132144 | SEMICONDUCTOR DEVICE | TAMURA CORPORATION |
WO/2021/132177 | HEATSINK AND COOLING DEVICE | NIDEC CORPORATION |
WO/2021/132182 | HEATSINK AND COOLING DEVICE | NIDEC CORPORATION |
WO/2021/149452 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/153121 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE | ROHM CO., LTD. |
WO/2021/166447 | ELECTRONIC CONTROL DEVICE | HITACHI ASTEMO, LTD. |
WO/2021/181831 | ELECTRICAL CIRCUIT BODY, POWER CONVERSION DEVICE, AND ELECTRICAL CIRCUIT BODY MANUFACTURING METHOD | HITACHI ASTEMO, LTD. |
WO/2021/140962 | MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, RESIN SEALING MEMBER, SEMICONDUCTOR DEVICE, AND POWER CONVERTER | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/132678 | SEMICONDUCTOR CHIP PRODUCTION METHOD | LINTEC CORPORATION |
WO/2021/161681 | SEMICONDUCTOR CIRCUIT DEVICE | FUJI ELECTRIC CO., LTD. |
WO/2021/199553 | POWER MODULE ASSEMBLY, PROCESS FOR MANUFACTURING POWER MODULE ASSEMBLY, AND POWER MODULE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/149491 | WIRING SUBSTRATE AND ELECTRONIC DEVICE | KYOCERA CORPORATION |
WO/2021/145250 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/141045 | CIRCUIT BOARD | TOPPAN PRINTING CO., LTD. |
WO/2021/141110 | VAPOR CHAMBER WICK SHEET, VAPOR CHAMBER, AND ELECTRONIC APPARATUS | DAI NIPPON PRINTING CO., LTD. |
WO/2021/166498 | WIRING SUBSTRATE AND ELECTRONIC DEVICE | KYOCERA CORPORATION |
WO/2021/166511 | SEMICONDUCTOR LASER DEVICE | PANASONIC CORPORATION |
WO/2021/149637 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | ROHM CO., LTD. |
WO/2021/181895 | POWER CONVERSION UNIT, POWER CONVERSION DEVICE, AND MOBILE BODY | HITACHI, LTD. |
WO/2021/149690 | THERMALLY CONDUCTIVE SHEET, LAMINATE, AND SEMICONDUCTOR DEVICE | SEKISUI CHEMICAL CO., LTD. |
WO/2021/149727 | SEALING RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE | SHOWA DENKO MATERIALS CO., LTD. |
WO/2021/149728 | METHOD FOR MANUFACTURING TEST PIECE FOR ADHESION EVALUATION TEST, AND ADHESION EVALUATION METHOD | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/157368 | MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/176871 | MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/186891 | SEMICONDUCTOR MODULE | FUJI ELECTRIC CO.,LTD. |
WO/2021/235002 | POWER MODULE | HITACHI ASTEMO, LTD. |
WO/2021/229859 | SEMICONDUCTOR DEVICE, BUSBAR, AND POWER CONVERSION DEVICE | HITACHI ASTEMO, LTD. |
WO/2021/166548 | SUBSTRATE WITH BUILT-IN COMPONENT AND POWER SUPPLY DEVICE | OMRON CORPORATION |
WO/2021/153444 | VAPOR CHAMBER | FURUKAWA ELECTRIC CO., LTD. |
WO/2021/153447 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/153450 | ELECTRONIC COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE | KYOCERA CORPORATION |
WO/2021/149802 | COPPER/GRAPHENE JOINED BODY AND METHOD FOR MANUFACTURING SAME, AND COPPER/GRAPHENE JOINED STRUCTURE | MITSUBISHI MATERIALS CORPORATION |
WO/2021/240877 | CRYSTAL OSCILLATOR | NIHON DEMPA KOGYO CO., LTD. |
WO/2021/235005 | PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE | LINTEC CORPORATION |
WO/2021/171881 | PACKAGE | NGK ELECTRONICS DEVICES, INC. |
WO/2021/149836 | SEMICONDUCTOR APPARATUS, AND INSPECTION DEVICE FOR SAME | KIMOTO Gunsei |
WO/2021/199635 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/157467 | MOISTURE-CURABLE HOT MELT COMPOSITION FOR ELECTRICAL/ELECTRONIC COMPONENTS, BONDING AGENT, AND COATING AGENT | SEKISUI FULLER COMPANY, LTD. |
WO/2021/153683 | SILSESQUIOXANE DERIVATIVE AND USE THEREFOR | TOAGOSEI CO., LTD. |
WO/2021/157469 | ELECTRONIC CIRCUIT DEVICE | HITACHI, LTD. |
WO/2021/157472 | SIDE FILLING RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD FOR REMOVING SIDE FILLING MATERIAL | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
WO/2021/166611 | POWER CONVERSION DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/220570 | ELECTRONIC CONTROL DEVICE | HITACHI ASTEMO, LTD. |
WO/2021/186935 | POWER CONVERSION DEVICE | FUJI ELECTRIC CO., LTD. |
WO/2021/153802 | SEMICONDUCTOR APPARATUS | KIMOTO, Gunsei |
WO/2021/245983 | VEHICLE-MOUNTED ELECTRONIC CONTROL DEVICE | HITACHI ASTEMO, LTD. |
WO/2021/255987 | POWER MODULE AND METHOD FOR MANUFACTURING POWER MODULE | HITACHI ASTEMO, LTD. |
WO/2021/157720 | SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE | FLOSFIA INC. |
WO/2021/261001 | PROCESSING DEVICE | HITACHI ASTEMO, LTD. |
WO/2021/172012 | SEMICONDUCTOR LASER APPARATUS | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
WO/2021/176978 | LASER MODULE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
WO/2021/172015 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/182016 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/192715 | SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
WO/2021/182022 | ELECTRONIC DEVICE | ROHM CO., LTD. |
WO/2021/162127 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
WO/2021/177034 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/182047 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/172178 | ELECTRONIC COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE | KYOCERA CORPORATION |
WO/2021/192755 | CIRCUIT BOARD | SUMITOMO BAKELITE CO., LTD. |
WO/2021/172202 | SEALING STRUCTURE AND METHOD FOR PRODUCING SAME | NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY |
WO/2021/182078 | HEAT SINK INTEGRATED INSULATING CIRCUIT BOARD | MITSUBISHI MATERIALS CORPORATION |
WO/2021/187018 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/177093 | HEAT-DISSIPATING STRUCTURE AND ELECTRONIC APPARATUS | MURATA MANUFACTURING CO., LTD. |
WO/2021/192788 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/172355 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR SYSTEM | FLOSFIA INC. |
WO/2021/215108 | HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE | MURATA MANUFACTURING CO., LTD. |
WO/2021/172479 | HEAT DISSIPATION MEMBER | KYOCERA CORPORATION |
WO/2021/261013 | ELECTRONIC CONTROL DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC CONTROL DEVICE | HITACHI ASTEMO, LTD. |
WO/2021/250947 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | HITACHI ASTEMO, LTD. |
WO/2021/177207 | LOW VOLTAGE VARISTOR, CIRCUIT BOARD, SEMICONDUCTOR COMPONENT PACKAGE AND INTERPOSER | NAMICS CORPORATION |
WO/2021/205792 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | SONY GROUP CORPORATION |
WO/2021/187187 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
WO/2021/182550 | THERMALLY CONDUCTIVE PASTE | SUMITOMO METAL MINING CO., LTD. |
WO/2021/182554 | PROTECTIVE FILM-FORMING SHEET | LINTEC CORPORATION |
WO/2021/193090 | POWER CONVERSION DEVICE | HITACHI, LTD. |
WO/2021/200011 | ELEMENT-MOUNTED BOARD AND METHOD FOR MANUFACTURINGELEMENT-MOUNTED BOARD | DENKA COMPANY LIMITED |
WO/2021/182569 | SEMICONDUCTOR DEVICE | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
WO/2021/220641 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | DENSO CORPORATION |
WO/2021/200057 | DEVICE AND METHOD FOR INCREASING THE RELIABILITY OF A POWER MODULE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/187409 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/215140 | METAL PLATE, METAL-RESIN COMPOSITE, AND SEMICONDUCTOR DEVICE | JX NIPPON MINING & METALS CORPORATION |
WO/2021/200094 | SEMICONDUCTOR DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
WO/2021/187464 | INSULATED CIRCUIT BOARD | MITSUBISHI MATERIALS CORPORATION |
WO/2021/200138 | SEMICONDUCTOR DEVICE | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
WO/2021/200166 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/200211 | SEMICONDUCTOR MODULE | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
WO/2021/210344 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE | DENSO CORPORATION |
WO/2021/200280 | ELECTRONIC COMPONENT | MURATA MANUFACTURING CO., LTD. |
WO/2021/200336 | ELECTRONIC DEVICE | ROHM CO., LTD. |
WO/2021/193528 | METHOD FOR MANUFACTURING JOINED BODY AND METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD | MITSUBISHI MATERIALS CORPORATION |
WO/2021/193587 | SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/193607 | ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND ELECTRONIC DEVICE | KYOCERA CORPORATION |
WO/2021/200406 | SEMICONDUCTOR DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
WO/2021/193701 | INSULATED CIRCUIT BOARD MANUFACTURING METHOD | MITSUBISHI MATERIALS CORPORATION |
WO/2021/205891 | LEAD FRAME PRODUCTION METHOD, LEAD FRAME, AND POWER SOURCE DEVICE | MURATA MANUFACTURING CO., LTD. |
WO/2021/193810 | CERAMIC CIRCUIT BOARD, HEAT-DISSIPATING MEMBER, AND ALUMINUM-DIAMOND COMPLEX | DENKA COMPANY LIMITED |
WO/2021/193823 | SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR | MITSUBISHI ELECTRIC CORPORATION |
WO/2021/220684 | INSULATING FILM, METAL-CLAD MULTILAYER MEMBER AND REWIRING LAYER | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. |
WO/2021/215187 | ELECTRONIC DEVICE | DENSO CORPORATION |
WO/2021/193877 | RELEASE FILM FOR USE IN SEMICONDUCTOR SEALING, MARKING FILM FOR USE IN SEMICONDUCTOR SEALING, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE | SHOWA DENKO MATERIALS CO., LTD. |
WO/2021/193880 | HEAT DISSIPATION DEVICE AND ELECTRONIC APPARATUS | SONY INTERACTIVE ENTERTAINMENT INC. |
WO/2021/200724 | BORON NITRIDE SINTERED BODY, COMPOSITE BODY, METHOD FOR PRODUCING SAID BORON NITRIDE SINTERED BODY, METHOD FOR PRODUCING SAID COMPOSITE BODY, AND HEAT DISSIPATION MEMBER | DENKA COMPANY LIMITED |
WO/2021/200792 | COPPER BASE SUBSTRATE | MITSUBISHI MATERIALS CORPORATION |
WO/2021/200801 | CERAMIC CIRCUIT BOARD, ELECTRONIC DEVICE, METAL MEMBER, AND PRODUCTION METHOD FOR CERAMIC CIRCUIT BOARD | DENKA COMPANY LIMITED |
WO/2021/200809 | CERAMIC CIRCUIT BOARD, ELECTRONIC DEVICE, AND METAL MEMBER | DENKA COMPANY LIMITED |
WO/2021/200813 | CERAMIC CIRCUIT BOARD, ELECTRONIC DEVICE, AND METAL MEMBER | DENKA COMPANY LIMITED |
WO/2021/240982 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
WO/2021/205926 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/205930 | MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/200971 | BORON NITRIDE SINTERED BODY, COMPLEX, METHOD FOR MANUFACTURING THESE, AND HEAT DISSIPATION MEMBER | DENKA COMPANY LIMITED |
WO/2021/201019 | COOLING DEVICE | MARELLI CORPORATION |
WO/2021/210402 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/201119 | METAL BASE SUBSTRATE | MITSUBISHI MATERIALS CORPORATION |
WO/2021/206058 | TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING, LEAD FRAME PROVIDED WITH TEMPORARY PROTECTIVE FILM, ENCAPSULATION MOLDED BODY, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE | SHOWA DENKO MATERIALS CO., LTD. |
WO/2021/206122 | ELECTRONIC DEVICE | DENSO CORPORATION |
WO/2021/261056 | POWER MODULE | HITACHI POWER SEMICONDUCTOR DEVICE, LTD. |
WO/2021/241053 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
WO/2021/229995 | SEMICONDUCTOR APPARATUS, TEMPERATURE CORRECTING SYSTEM, AND ALARM SYSTEM | SONY SEMICONDUCTOR SOLUTIONS CORPORATION |
WO/2021/241064 | HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE | MURATA MANUFACTURING CO., LTD. |
WO/2021/215463 | ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | KYOCERA CORPORATION |
WO/2021/215472 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/256083 | COOLING DEVICE AND SEMICONDUCTOR MODULE | FUJI ELECTRIC CO., LTD. |
WO/2021/230047 | THERMALLY CONDUCTIVE SHEET, AND METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE SHEET | DEXERIALS CORPORATION |
WO/2021/256092 | SEMICONDUCTOR MODULE | FUJI ELECTRIC CO., LTD. |
WO/2021/221042 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/225116 | CIRCUIT MODULE AND COMMUNICATION DEVICE | SUMITOMO ELECTRIC INDUSTRIES, LTD. |
WO/2021/241161 | HEAT RADIATION STRUCTURE, AND BATTERY PROVIDED WITH SAME | SHIN-ETSU POLYMER CO., LTD. |
WO/2021/235259 | THERMALLY CONDUCTIVE SILICONE COMPOSITION, PRODUCTION METHOD FOR SAME, AND SEMICONDUCTOR DEVICE | SHIN-ETSU CHEMICAL CO., LTD. |
WO/2021/246117 | MODULE AND METHOD FOR MANUFACTURING SAME | MURATA MANUFACTURING CO., LTD. |
WO/2021/251045 | MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/230289 | TRANSMISSION COMPONENT AND SEMICONDUCTOR DEVICE | SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC. |
WO/2021/241249 | THERMALLY CONDUCTIVE SHEET, METHOD FOR MANUFACTURING SAME, HEAT-DISSIPATING STRUCTURE, AND ELECTRONIC APPARATUS | DEXERIALS CORPORATION |
WO/2021/246136 | CIRCUIT BOARD | SUMITOMO BAKELITE CO., LTD. |
WO/2021/241298 | THERMALLY CONDUCTIVE SHEET WITH METAL PLATE AND METHOD FOR PODUCING THERMALLY CONDUCTIVE SHEET | SUMITOMO BAKELITE CO., LTD. |
WO/2021/241304 | MOUNTING STRUCTURE FOR SEMICONDUCTOR MODULE | ROHM CO., LTD. |
WO/2021/261117 | CIRCUIT SUBSTRATE HAVING CAVITY AND METHOD FOR MANUFACTURING SAME | TDK CORPORATION |
WO/2021/235483 | VERTICAL CONTACT-TYPE PROBE, PROBE CARD, AND SOCKET | SHIN-ETSU POLYMER CO., LTD. |
WO/2021/241447 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/261136 | POWER MODULE AND POWER CONVERSION DEVICE USING SAID POWER MODULE | HITACHI, LTD. |
WO/2021/246204 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | DENSO CORPORATION |
WO/2021/251112 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, RESIN COMPOSITION FOR TEMPORARY PROTECTION, AND RESIN FILM FOR TEMPORARY PROTECTION | SHOWA DENKO MATERIALS CO., LTD. |
WO/2021/251126 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/241642 | TEMPERATURE ADJUSTMENT UNIT AND METHOD FOR MANUFACTURING TEMPERATURE ADJUSTMENT UNIT | TOMOEGAWA CO., LTD. |
WO/2021/241643 | TEMPERATURE ADJUSTMENT UNIT | TOMOEGAWA CO., LTD. |
WO/2021/241691 | DIAMOND COMPOSITE AND PRODUCTION METHOD THEREFOR | NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY |
WO/2021/251160 | MODULE AND COMPONENT | MURATA MANUFACTURING CO., LTD. |
WO/2021/256220 | THERMAL CONDUCTOR AND METHOD FOR MANUFACTURING THERMAL CONDUCTOR | SHOWA MARUTSUTSU COMPANY, LTD. |
WO/2021/246369 | METHOD FOR MANUFACTURING INSULATED RESIN CIRCUIT BOARD | MITSUBISHI MATERIALS CORPORATION |
WO/2021/261179 | CIRCUIT BOARD | SUMITOMO BAKELITE CO., LTD. |
WO/2021/246397 | TWO-PACK CURABLE HEAT CONDUCTIVE GREASE COMPOSITION, HEAT CONDUCTIVE GREASE AND ELECTRONIC DEVICE | DENKA COMPANY LIMITED |
WO/2021/251218 | MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/251219 | MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/256299 | MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/256300 | MODULE | MURATA MANUFACTURING CO., LTD. |
WO/2021/246519 | VAPOR CHAMBER AND MANUFACTURING METHOD FOR VAPOR CHAMBER | FURUKAWA ELECTRIC CO., LTD. |
WO/2021/261270 | ELECTRONIC COMPONENT | MURATA MANUFACTURING CO., LTD. |
WO/2021/261273 | ELECTRONIC COMPONENT | MURATA MANUFACTURING CO., LTD. |
WO/2021/256426 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR | ELEPHANTECH INC. |
WO/2021/256501 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | MURATA MANUFACTURING CO., LTD. |
WO/2021/261356 | METHOD FOR PRODUCING COVER MEMBER | NIPPON ELECTRIC GLASS CO., LTD. |
WO/2021/261441 | ALUMINUM NITRIDE SINTERED BODY, CIRCUIT SUBSTRATE AND JUNCTION SUBSTRATE | DENKA COMPANY LIMITED |
WO/2021/261508 | SEMICONDUCTOR DEVICE | ROHM CO., LTD. |
WO/2021/261520 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME | DENSO CORPORATION |
WO/2021/261525 | WIRING STRUCTURE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR PACKAGE | SHOWA DENKO MATERIALS CO., LTD. |
WO/2021/261552 | EVAPORATOR AND LOOP HEAT PIPE | KAWASAKI JUKOGYO KABUSHIKI KAISHA |
WO/2021/010521 | MODULE FOR REMOVING MIS-ASSEMBLED SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND METHOD FOR REMOVING MIS-ASSEMBLED SEMICONDUCTOR LIGHT-EMITTING ELEMENT BY USING SAME | LG ELECTRONICS INC. |
WO/2021/100947 | METHOD FOR MANUFACTURING DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING ELEMENTS AND SELF-ASSEMBLY DEVICE USED THEREFOR | LG ELECTRONICS INC. |
WO/2021/075639 | SEMICONDUCTOR DEVICE PACKAGE COMPRISING THERMAL INTERFACE LAYER AND METHOD FOR MANUFACTURING SAME | INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS |
WO/2021/117984 | HEAT REGULATING DEVICE USING SHAPE MEMORY ALLOY, POWER ELECTRONIC SYSTEM PROVIDED WITH SAME, AND SHAPE MEMORY ALLOY STRUCTURE THEREOF | LS ELECTRIC CO., LTD. |
WO/2021/040178 | PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING SAME | SKC CO., LTD. |
WO/2021/210712 | SEMICONDUCTOR LEAD FRAME STAMPING DIE WITH IMPROVED PRODUCTION EFFICIENCY | DONG HO A-TEC CO., LTD. |
WO/2021/230390 | POWER MODULE AND METHOD FOR MANUFACTURING POWER MODULE | LG ELECTRONICS INC. |
WO/2021/006479 | ELECTRONIC DEVICE INCLUDING INTERPOSER | SAMSUNG ELECTRONICS CO., LTD. |
WO/2021/230413 | CONDUCTOR BONDING METHOD | AN, Seong Ryong |
WO/2021/201336 | FLIP CHIP BONDING-BASED SEMICONDUCTOR DEVICE PACKAGE | KOSTEC SYS. CO., LTD |
WO/2021/015466 | CHIP DEVICE | MODA-INNOCHIPS CO., LTD. |
WO/2021/015503 | INTERPOSER AND ELECTRONIC DEVICE INCLUDING THE SAME | SAMSUNG ELECTRONICS CO., LTD. |
WO/2021/049805 | SEALING SHEET, AND SEMICONDUCTOR DEVICE INCLUDING SAME | DOOSAN CORPORATION |
WO/2021/096178 | ANTENNA PACKAGE | DONGWOO FINE-CHEM CO., LTD. |
WO/2021/101151 | ELECTRONIC DEVICE INCLUDING CONNECTION MEMBER | SAMSUNG ELECTRONICS CO., LTD. |
WO/2021/096318 | CARRIER SUBSTRATE AND ELEMENT TRANSFER METHOD USING SAME | CENTER FOR ADVANCED META-MATERIALS |
WO/2021/112498 | FINGERPRINT RECOGNITION MODULE AND ELECTRONIC DEVICE COMPRISING SAME | LG INNOTEK CO., LTD. |
WO/2021/112627 | UNDERFILL FILM FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SAME | DOOSAN CORPORATION |
WO/2021/137469 | SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTION MEMBER FORMED USING PHOTOSENSITIVE ANISOTROPIC CONDUCTIVE LAYER, AND METHOD FOR PRODUCING SAME | KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY |
WO/2021/125761 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR | AMOSENSE CO.,LTD |
WO/2021/137549 | LIGHT-EMITTING ELEMENT FLAT BONDING METHOD AND FLAT BONDING DEVICE | SEOUL VIOSYS CO., LTD. |
WO/2021/162369 | POWER MODULE AND METHOD FOR MANUFACTURING SAME | AMOGREENTECH CO., LTD. |
WO/2021/187772 | LED CHIP TRANSFER METHOD AND APPARATUS USING FOAM AND PHOTOSENSITIVE RESIN, AND METHOD FOR MANUFACTURING DISPLAY DEVICE BY USING SAME | LIGHTIZER CO., LTD. |
WO/2021/230615 | POWER MODULE AND METHOD FOR MANUFACTURING SAME | AMOSENSE CO., LTD. |
WO/2021/230617 | POWER MODULE | AMOSENSE CO., LTD. |
WO/2021/230620 | POWER MODULE | AMOSENSE CO., LTD. |
WO/2021/230621 | POWER MODULE | AMOSENSE CO., LTD. |
WO/2021/230623 | POWER MODULE | AMOSENSE CO., LTD. |
WO/2021/241950 | POWER MODULE | AMOSENSE CO., LTD. |
WO/2021/241951 | POWER MODULE | AMOSENSE CO., LTD. |
WO/2021/242013 | PACKAGE SUBSTRATE | LG INNOTEK CO., LTD. |
WO/2021/261940 | STACKED PACKAGE USING STEPPED CAVITY SUBSTRATE AND METHOD FOR MANUFACTURING SAME | SIMMTECH CO., LTD. |
WO/2021/261955 | STACKED PACKAGE HAVING CHIP MOUNTED IN CAVITY AND METHOD FOR FABRICATING SAME | SIMMTECH CO., LTD. |
WO/2021/049995 | METHOD AND ARRANGEMENT FOR ASSEMBLY OF MICROCHIPS INTO A SEPARATE SUBSTRATE | RIBET, Frederico |
WO/2021/158158 | ELECTRONIC SYSTEM WITH POWER DISTRIBUTION NETWORK INCLUDING CAPACITOR COUPLED TO COMPONENT PADS | SMOLTEK AB |
WO/2021/177874 | HIGH-CURRENT SEMICONDUCTOR COMPONENTS AND SYSTEMS | POWONICS AB |
WO/2021/262086 | HEAT SINK ARRAY AND METHOD OF USE | NATIONAL UNIVERSITY OF SINGAPORE |
WO/2021/025688 | DIELECTRIC PASSIVATION FOR LAYERED III-NITRIDE STRUCTURES | IQE PLC |
WO/2021/025724 | METAL-INSULATOR-METAL (MIM) CAPACITOR | MICROCHIP TECHNOLOGY INCORPORATED |
WO/2021/167596 | ELECTRIC POWER MODULE | PIERBURG GMBH |
WO/2021/167618 | HEAT DISSIPATERS FOR VOLTAGE REGULATORS | HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
WO/2021/177958 | PROTECTIVE MESH ARRAY FOR USE WITHIN AN ELECTRICAL NETWORK | LYNN, David |
WO/2021/096552 | BONDED ASSEMBLY CONTAINING A DIELECTRIC BONDING PATTERN DEFINITION LAYER AND METHODS OF FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
WO/2021/145908 | TECHNIQUES FOR FORMING INTEGRATED INDUCTOR-CAPACITOR OSCILLATORS AND RELATED METHODS, OSCILLATORS, SEMICONDUCTOR DEVICES, SYSTEMS-ON-CHIPS, AND OTHER SYSTEMS | MICROCHIP TECHNOLOGY INCORPORATED |
WO/2021/188128 | DEFORMED MESH THERMAL GROUND PLANE | KELVIN THERMAL TECHNOLOGIES, INC. |
WO/2021/154326 | BONDED ASSEMBLY CONTAINING METAL-ORGANIC FRAMEWORK BONDING DIELECTRIC AND METHODS OF FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
WO/2021/188133 | SEMICONDUCTOR STRUCTURE CONTAINING REENTRANT SHAPED BONDING PADS AND METHODS OF FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
WO/2021/055030 | GLASS DIELECTRIC LAYER WITH PATTERNING | INTEL CORPORATION |
WO/2021/061208 | ELECTROSTATIC DISCHARGE PROTECTION FOR STACKED-DIE SYSTEM | INTEL CORPORATION |
WO/2021/040877 | MOLDED SILICON INTERCONNECTS IN BRIDGES FOR INTEGRATED-CIRCUIT PACKAGES | INTEL CORPORATION |
WO/2021/061246 | MOLDED INTERCONNECTS IN BRIDGES FOR INTEGRATED-CIRCUIT PACKAGES | INTEL CORPORATION |
WO/2021/141631 | THERMAL MANAGEMENT PACKAGE AND METHOD | MICROCHIP TECHNOLOGY INC. |
WO/2021/016378 | THERMAL MANAGEMENT OF HIGH HEAT FLUX MULTICOMPONENT ASSEMBLY | HENKEL IP & HOLDING GMBH |
WO/2021/016399 | THERMAL MANAGEMENT DEVICE AND SYSTEM | MONAZAMI, Reza |
WO/2021/016408 | OVERLAY MEASUREMENT TARGETS DESIGN | KLA CORPORATION |
WO/2021/016547 | WIREBONDABLE INTERPOSER FOR FLIP CHIP PACKAGED INTEGRATED CIRCUIT DIE | SAMTEC, INC. |
WO/2021/040955 | MONOLITHIC DIE WITH ACOUSTIC WAVE RESONATORS AND ACTIVE CIRCUITRY | INTEL CORPORATION |
WO/2021/030072 | ELECTRONIC MODULE FOR MOTHERBOARD | RAYTHEON COMPANY |
WO/2021/026342 | ELECTRONICS ASSEMBLIES AND METHODS OF MANUFACTURING ELECTRONICS ASSEMBLIES WITH IMPROVED THERMAL PERFORMANCE | INTELLIGENT PLATFORMS, LLC |
WO/2021/133434 | SKIP LEVEL VIAS IN METALLIZATION LAYERS FOR INTEGRATED CIRCUIT DEVICES | INTEL CORPORATION |
WO/2021/091609 | POWER DELIVERY NETWORK FOR ACTIVE-ON-ACTIVE STACKED INTEGRATED CIRCUITS | XILINX, INC. |
WO/2021/041044 | METAL LAYER PATTERNING FOR MINIMIZING MECHANICAL STRESS IN INTEGRATED CIRCUIT PACKAGES | CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LTD. |
WO/2021/034624 | ATOMIC FORCE MICROSCOPY TIPS FOR INTERCONNECTION | FACEBOOK TECHNOLOGIES, LLC |
WO/2021/034818 | METHODS AND APPARATUS FOR CONTACTLESS SUBSTRATE WARPAGE CORRECTION | APPLIED MATERIALS, INC. |
WO/2021/041147 | METHOD AND SYSTEM OF STRETCHING AN ACCEPTOR SUBSTRATE TO ADJUST PLACEMENT OF A COMPONENT | SELFARRAY, INC. |
WO/2021/126319 | THERMALLY CONDUCTIVE SLUGS/ACTIVE DIES TO IMPROVE COOLING OF STACKED BOTTOM DIES | INTEL CORPORATION |
WO/2021/066981 | PACKAGE COMPRISING A SOLDER RESIST LAYER CONFIGURED AS A SEATING PLANE FOR A DEVICE | QUALCOMM INCORPORATED |
WO/2021/066982 | PACKAGE COMPRISING A DIE AND DIE SIDE REDISTRIBUTION LAYERS (RDL) | QUALCOMM INCORPORATED |
WO/2021/066983 | ULTRA-LOW PROFILE STACKED RDL SEMICONDUCTOR PACKAGE | QUALCOMM INCORPORATED |
WO/2021/050514 | SYSTEMS AND METHODS FOR REDUCING VIA FORMATION IMPACT ON ELECTRONIC DEVICE FORMATION | CORNING INCORPORATED |
WO/2021/061481 | VIAS INCLUDING CIRCUMFERENTIAL TRENCHES, INTERPOSER INCLUDING THE VIAS, AND METHOD FOR FABRICATING THE VIAS | CORNING INCORPORATED |
WO/2021/118672 | ELECTRONIC DEVICE INCLUDING HERMETIC MICRO-CAVITY AND METHODS OF PREPARING THE SAME | RAYTHEON COMPANY |
WO/2021/076284 | CONFORMAL SHIELD FOR BLOCKING LIGHT IN AN INTEGRATED CIRCUIT PACKAGE | CIRRUS LOGIC INTERNATIONAL SEMICONDUCTOR LTD. |
WO/2021/096597 | PACKAGE SPARK GAP STRUCTURE | INTEL CORPORATION |
WO/2021/067330 | ELECTRICALLY CONDUCTIVE VIAS AND METHODS FOR PRODUCING SAME | SAMTEC, INC. |
WO/2021/162752 | PROCESS TO YIELD ULTRA-LARGE INTEGRATED CIRCUITS AND ASSOCIATED INTEGRATED CIRCUITS | RAYTHEON COMPANY |
WO/2021/067908 | EX-SITU MANUFACTURE OF METAL MICRO-WIRES AND FIB PLACEMENT IN 1C CIRCUITS | TEXAS INSTRUMENTS INCORPORATED |
WO/2021/076355 | HIGH TEMPERATURE PRINTED CIRCUIT BOARD SUBSTRATE | 3D GLASS SOLUTIONS, INC. |
WO/2021/072010 | THERMOELECTRIC COOLERS FOR ELECTRONICS COOLING | BAE SYSTEMS CONTROLS INC. |
WO/2021/076408 | COMBINED HEAT EXCHANGER AND RF SHIELD | MICROSOFT TECHNOLOGY LICENSING, LLC |
WO/2021/108037 | INDUCTOR DESIGN IN ACTIVE 3D STACKING TECHNOLOGY | XILINX, INC. |
WO/2021/076726 | PROCESS FOR CONFORMAL COATING OF MULTI-ROW SURFACE-MOUNT COMPONENTS IN A LIDLESS BGA PACKAGE AND PRODUCT MADE THEREBY | ADVANCED MICRO DEVICES, INC. |
WO/2021/076872 | FLIP-CHIP DEVICE | QUALCOMM INCORPORATED |
WO/2021/091684 | METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE | APPLIED MATERIALS, INC. |
WO/2021/183190 | COMPOSITE SPRING HEAT SPREADER | RAYTHEON COMPANY |
WO/2021/154351 | GUIDING ELECTRONS IN GRAPHENE WITH A CARBON NANOTUBE | PRESIDENT AND FELLOWS OF HARVARD COLLEGE |
WO/2021/112969 | METHODS AND APPARATUS FOR PROCESSING A SUBSTRATE | APPLIED MATERIALS, INC. |
WO/2021/108064 | PACKAGE CORE ASSEMBLY AND FABRICATION METHODS | APPLIED MATERIALS, INC. |
WO/2021/108065 | PACKAGE CORE ASSEMBLY AND FABRICATION METHODS | APPLIED MATERIALS, INC. |
WO/2021/112978 | PACKAGE COMPRISING A SUBSTRATE HAVING A VIA WALL CONFIGURED AS A SHIELD | QUALCOMM INCORPORATED |
WO/2021/112979 | INTEGRATED DEVICE WITH ELECTROMAGNETIC SHIELD | QUALCOMM INCORPORATED |
WO/2021/087285 | CONFIGURABLE CAPACITOR | EMPOWER SEMICONDUCTOR, INC. |
WO/2021/137929 | THERMAL COMPRESSION FLIP CHIP BUMP | QUALCOMM INCORPORATED |
WO/2021/145940 | MULTI-CHIP STACKED DEVICES | XILINX, INC. |
WO/2021/141660 | STRUCTURE FOR BONDING AND ELECTRICAL CONTACT FOR DIRECT BOND HYBRIDIZATION | RAYTHEON COMPANY |
WO/2021/113076 | SEMICONDUCTORS HAVING DIE PADS WITH ENVIRONMENTAL PROTECTION AND PROCESS OF MAKING SEMICONDUCTORS HAVING DIE PADS WITH ENVIRONMENTAL PROTECTION | CREE, INC. |
WO/2021/206760 | INTEGRATED CIRCUIT (IC) PACKAGE WITH INTEGRATED INDUCTOR HAVING CORE MAGNETIC FIELD (B FIELD) EXTENDING PARALLEL TO DIE SUBSTRATE | MICROCHIP TECHNOLOGY INCORPORATED |
WO/2021/173204 | SPLIT SUBSTRATE INTERPOSER | TOKYO ELECTRON LIMITED |
WO/2021/173205 | SPLIT SUBSTRATE INTERPOSER WITH INTEGRATED PASSIVE DEVICE | TOKYO ELECTRON LIMITED |
WO/2021/158282 | INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A THERMAL CONDUCTIVE PACKAGE SUBSTRATE WITH DIE REGION SPLIT, AND RELATED FABRICATION METHODS | QUALCOMM INCORPORATED |
WO/2021/126791 | MEMS-BASED COOLING SYSTEMS FOR CLOSED AND OPEN DEVICES | FRORE SYSTEMS INC. |
WO/2021/146027 | POWER MODULE PACKAGE AND PACKAGING TECHNIQUES | ALLEGRO MICROSYSTEMS, LLC |
WO/2021/146028 | SYSTEMS AND METHODS FOR FABRICATING SUPERCONDUCTING INTEGRATED CIRCUITS | D-WAVE SYSTEMS INC. |
WO/2021/127587 | THERMAL COOLING ELEMENT FOR MEMORY DEVICES OF A MEMORY SUB-SYSTEM | MICRON TECHNOLOGY, INC. |
WO/2021/138177 | THERMAL MANAGEMENT USING VARIATION OF THERMAL RESISTANCE OF THERMAL INTERFACE | ADVANCED MICRO DEVICES, INC. |
WO/2021/236165 | SEMICONDUCTOR DIE CONTAINING DUMMY METALLIC PADS AND METHODS OF FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
WO/2021/225639 | THREE-DIMENSIONAL MEMORY DEVICE WITH A DIELECTRIC ISOLATION SPACER AND METHODS OF FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
WO/2021/201934 | SEMICONDUCTOR DIE INCLUDING EDGE RING STRUCTURES AND METHODS FOR MAKING THE SAME | SANDISK TECHNOLOGIES LLC |
WO/2021/252021 | THREE-DIMENSIONAL MEMORY DEVICE INCLUDING MULTI-TIER MOAT ISOLATION STRUCTURES AND METHODS OF MAKING THE SAME | SANDISK TECHNOLOGIES LLC |
WO/2021/242322 | STACKED DIE ASSEMBLY INCLUDING DOUBLE-SIDED INTER-DIE BONDING CONNECTIONS AND METHODS OF FORMING THE SAME | SANDISK TECHNOLOGIES LLC |
WO/2021/042094 | STACKED DIE PACKAGE INCLUDING WIRE BONDING AND DIRECT CHIP ATTACHMENT, AND RELATED METHODS, DEVICES AND APPARATUSES | MICRON TECHNOLOGY, INC. |
WO/2021/022292 | DIFFERENTIAL CONTRAST PLATING FOR ADVANCED PACKAGING APPLICATIONS | LAM RESEARCH CORPORATION |
WO/2021/035235 | ELECTRONIC DEVICES COMPRISING OVERLAY MARKS, MEMORY DEVICES COMPRISING OVERLAY MARKS, AND RELATED METHODS | MICRON TECHNOLOGY, INC. |
WO/2021/216143 | BACKSIDE INTERCONNECT FOR INTEGRATED CIRCUIT PACKAGE INTERPOSER | MICROCHIP TECHNOLOGY INCORPORATED |
WO/2021/158339 | ELECTRICAL INTERCONNECT STRUCTURE FOR A SEMICONDUCTOR DEVICE AND AN ASSEMBLY USING THE SAME | MICRON TECHNOLOGY, INC. |
WO/2021/206776 | THERMAL MANAGEMENT STRUCTURES FOR NITRIDE-BASED HEAT GENERATING SEMICONDUCTOR DEVICES | RAYTHEON COMPANY |
WO/2021/162816 | PACKAGE COMPRISING A SUBSTRATE CONFIGURED AS A HEAT SPREADER | QUALCOMM INCORPORATED |
WO/2021/230925 | PRINTED CIRCUIT BOARD CAVITY MODE SUPPRESSION | RAYTHEON COMPANY |
WO/2021/162834 | PACKAGE COMPRISING A SUBSTRATE THAT INCLUDES A STRESS BUFFER LAYER | QUALCOMM INCORPORATED |
WO/2021/158419 | HIGH DENSITY 3D INTERCONNECT CONFIGURATION | APPLE INC. |
WO/2021/155018 | JET IMPINGEMENT COOLING DEVICES, SYSTEMS, AND METHODS | COLORADO STATE UNIVERSITY RESEARCH FOUNDATION |
WO/2021/247094 | INTEGRATED INDUCTOR WITH A STACKED METAL WIRE | MICROCHIP TECHNOLOGY INCORPORATED |
WO/2021/158881 | SELECTIVE ALTERATION OF INTERCONNECT PADS FOR DIRECT BONDING | INVENSAS BONDING TECHNOLOGIES, INC. |
WO/2021/188232 | MECHANISM FOR VARIABLE THERMAL CONDUCTANCE | NORTHROP GRUMMAN SYSTEMS CORPORATION |
WO/2021/167822 | DEVICE CARRIER CONFIGURED FOR INTERCONNECTS, A PACKAGE IMPLEMENTING A DEVICE CARRIER HAVING INTERCONNECTS, AND PROCESSES OF MAKING THE SAME | CREE, INC. |
WO/2021/201990 | MULTIPLE CHIP MODULE WITH LID AND STIFFENER RING | APPLE INC. |
WO/2021/173817 | VOLTAGE REGULATION INTEGRATED CIRCUIT (IC) WITH CIRCUIT COMPONENTS IN AN INTEGRATED THREE-DIMENSIONAL (3D) INDUCTOR CORE AND RELATED METHODS OF FABRICATION | QUALCOMM INCORPORATED |
WO/2021/194716 | HEAT EXCHANGE RIBBON | ARRIS ENTERPRISES LLC |
WO/2021/178722 | COMPLIANT THERMAL MANAGEMENT DEVICES, SYSTEMS, AND METHODS OF FABRICATION THEREOF | TRANSPORT PHENOMENA TECHNOLOGIES, LLC |
WO/2021/178870 | MAGNETIC SENSOR ARRAY DEVICE OPTIMIZATIONS AND HYBRID MAGNETIC CAMERA | LEXMARK INTERNATIONAL, INC. |
WO/2021/183506 | DEVICE COMPRISING CONTACT TO CONTACT COUPLING OF PACKAGES | QUALCOMM INCORPORATED |
WO/2021/202074 | MULTI LEVEL RADIO FREQUENCY (RF) INTEGRATED CIRCUIT COMPONENTS INCLUDING PASSIVE DEVICES | CREE, INC. |
WO/2021/202075 | RF AMPLIFIER PACKAGE | CREE, INC. |
WO/2021/230966 | METHODS OF FORMING CONDUCTIVE PIPES BETWEEN NEIGHBORING FEATURES, AND INTEGRATED ASSEMBLIES HAVING CONDUCTIVE PIPES BETWEEN NEIGHBORING FEATURES | MICRON TECHNOLOGY, INC. |
WO/2021/188784 | ON-BOARD INTEGRATED ENCLOSURE FOR ELECTROMAGNETIC COMPATIBILITY SHIELDING | MARVELL ASIA PTE, LTD. |
WO/2021/194858 | PATCH SUBSTRATE CONFIGURED AS A SHIELD LOCATED OVER A CAVITY OF A BOARD | QUALCOMM INCORPORATED |
WO/2021/188846 | DIMENSION COMPENSATION CONTROL FOR DIRECTLY BONDED STRUCTURES | INVENSAS BONDING TECHNOLOGIES, INC. |
WO/2021/194981 | INTEGRATED DEVICE COMPRISING TRANSISTOR COUPLED TO A DUMMY GATE CONTACT | QUALCOMM INCORPORATED |
WO/2021/195013 | MULTI-CHIP PACKAGE WITH REINFORCED ISOLATION | TEXAS INSTRUMENTS INCORPORATED |
WO/2021/202199 | GROUP III NITRIDE-BASED RADIO FREQUENCY AMPLIFIERS HAVING BACK SIDE SOURCE, GATE AND/OR DRAIN TERMINALS | CREE, INC. |
WO/2021/202211 | METHODS OF OPTIMIZING CLAMPING OF A SEMICONDUCTOR ELEMENT AGAINST A SUPPORT STRUCTURE ON A WIRE BONDING MACHINE, AND RELATED METHODS | KULICKE AND SOFFA INDUSTRIES, INC. |
WO/2021/202267 | RELIABLE HYBRID BONDED APPARATUS | INVENSAS BONDING TECHNOLOGIES, INC. |
WO/2021/202454 | HYBRID PACKAGE APPARATUS AND METHOD OF FABRICATING | QUALCOMM INCORPORATED |
WO/2021/202674 | RF AMPLIFIER DEVICES AND METHODS OF MANUFACTURING | CREE, INC. |
WO/2021/207101 | PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECT ROUTING OVER SOLDER RESIST LAYER | QUALCOMM INCORPORATED |
WO/2021/211744 | INTEGRATED DEVICE COMPRISING PERIPHERY STRUCTURE CONFIGURED AS AN ELECTRICAL GUARD RING AND A CRACK STOP | QUALCOMM INCORPORATED |
WO/2021/231021 | HIGH-DENSITY FLIP CHIP PACKAGE FOR WIRELESS TRANSCEIVERS | QUALCOMM INCORPORATED |
WO/2021/236275 | RADIO-FREQUENCY INTEGRATED CIRCUIT PACKAGE EMPLOYING AN ELECTRO-MAGNETIC INTERFERENCE SHIELDING LAYER, AND RELATED FABRICATION METHODS | QUALCOMM INCORPORATED |
WO/2021/216684 | LIGHT-EMITTING DIODE CHIP STRUCTURES WITH REFLECTIVE ELEMENTS | JADE BIRD DISPLAY (SHANGHAI) LIMITED |
WO/2021/216689 | LIGHT-EMITTING DIODE CHIP STRUCTURES WITH REFLECTIVE ELEMENTS | JADE BIRD DISPLAY (SHANGHAI) LIMITED |
WO/2021/242450 | PACKAGE COMPRISING A SUBSTRATE, AN INTEGRATED DEVICE, AND AN ENCAPSULATION LAYER WITH UNDERCUT | QUALCOMM INCORPORATED |
WO/2021/222020 | MEMS HERMETIC SEAL APPARATUS AND METHODS | ELBIT SYSTEMS OF AMERICA, LLC |
WO/2021/225846 | SUBSTRATE COMPRISING CAPACITOR CONFIGURED FOR POWER AMPLIFIER OUTPUT MATCH | QUALCOMM INCORPORATED |
WO/2021/252100 | ADVANCED INTEGRATED PASSIVE DEVICE (IPD) WITH THIN-FILM HEAT SPREADER (TF-HS) LAYER FOR HIGH POWER HANDLING FILTERS IN TRANSMIT (TX) PATH | QUALCOMM INCORPORATED |
WO/2021/247195 | DIRECTED SELF-ASSEMBLY STRUCTURES AND TECHNIQUES | INTEL CORPORATION |
WO/2021/236361 | LATERALLY UNCONFINED STRUCTURE | INVENSAS BONDING TECHNOLOGIES, INC. |
WO/2021/236396 | HYBRID THERMAL INTERFACE MATERIAL AND LOW TEMPERATURE SOLDER PATTERNS TO IMPROVE PACKAGE WARPAGE AND RELIABILITY | APPLE INC. |
WO/2021/231620 | ELECTRONIC DEVICE COOLING SYSTEMS USING COOLED FLUID AND CONTROL OF SAME | GEMATEG INC. |
WO/2021/231636 | AN INTEGRATED CIRCUIT WIRE BONDED TO A MULTI-LAYER SUBSTRATE HAVING AN OPEN AREA THAT EXPOSES WIRE BOND PADS AT A SURFACE OF THE INNER LAYER | MICRON TECHNOLOGY, INC. |
WO/2021/247261 | SPRING BAR LEADFRAME | TEXAS INSTRUMENTS INCORPORATED |
WO/2021/247317 | RF AMPLIFIERS HAVING SHIELDED TRANSMISSION LINE STRUCTURES | CREE, INC. |
WO/2021/243195 | MULTICORE SUBSTRATE | QUALCOMM INCORPORATED |
WO/2021/262412 | SUBSTRATES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH IMPROVED THERMAL PERFORMANCE AND METHODS FOR MAKING THE SAME | MICRON TECHNOLOGY, INC. |
WO/2021/257312 | SEMICONDUCTOR PACKAGE INCLUDING UNDERMOUNTED DIE WITH EXPOSED BACKSIDE METAL | TEXAS INSTRUMENTS INCORPORATED |
WO/2021/257748 | OVENS FOR EQUIPMENT SUCH AS DIE ATTACH SYSTEMS, FLIP CHIP BONDING SYSTEMS, CLIP ATTACH SYSTEMS, AND RELATED METHODS | KULICKE AND SOFFA INDUSTRIES, INC. |
WO/2021/262538 | RADIO FREQUENCY TRANSISTOR AMPLIFIER PACKAGE | CREE, INC. |
WO/2021/262920 | MULTI-ZONE RADIO FREQUENCY TRANSISTOR AMPLIFIERS | CREE, INC. |
转载本文请联系原作者获取授权,同时请注明本文来自陈立新科学网博客。
链接地址:https://wap.sciencenet.cn/blog-681765-1365960.html?mobile=1
收藏