陈立新
2021年半导体制造领域的PCT专利申请状况——中国占17%,美国占30%,日本占35%,欧洲占6%
2022-11-30 22:44
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陈立新 张琳 黄颖:中美欧日韩五局专利报告3148.doc

武汉大学科教管理与评价研究中心 陈立新 张琳 黄颖

微信号:13592308169

附录2  2021PCT国际专利申请统计分析报告

附录2.7 各技术领域的PCT专利申请状况

附录2.7.38 半导体制造领域的PCT专利申请状况

38个技术领域是半导体制造,包括半导体及其部件的制造方法和设备。2021年,该领域的PCT专利申请总计1878项(增长率为-20.1%),占总申请量的0.7%,是申请量第45多的领域。

2021年,中国局在半导体制造领域上申请PCT专利319项,占该领域申请量的17%。美国局在该领域上申请专利565项,份额为30.1%。日本局申请专利650项,份额为34.6%。欧洲局申请专利113项,份额为6%

 

附表2.7.38-1  2021年半导体制造领域各专利局的PCT专利申请数量


专利局

申请数量

占本局比例

占领域比例

1

中国

319

0.5%

17.0%

2

美国

565

1.0%

30.1%

3

日本

650

1.4%

34.6%

4

欧洲

113

0.3%

6.0%

5

韩国

123

0.7%

6.5%

6

国际

55

0.4%

2.9%

7

英国

4

0.1%

0.2%

8

法国

23

0.9%

1.2%

9

加拿大

5

0.3%

0.3%

10

澳大利亚

1

0.1%

0.1%

11

土耳其

1

0.1%

0.1%

12

德国

4

0.3%

0.2%

13

以色列

2

0.1%

0.1%

14

瑞典

2

0.2%

0.1%

15

其他

11

--

0.6%


小计

1878

--

100%

注:本表按照提交PCT国际专利申请的专利局进行统计。

 

 


附图2.7.38-1  2021年半导体制造领域各专利局的PCT专利申请数量对比

 

2021年,在半导体制造领域上PCT专利申请最多的机构是应用材料公司、东京电子株式会社、拉姆研究公司。

 

附表2.7.38-2  2021年半导体制造领域的PCT国际专利申请前10机构


机构名称

国家

机构英文名称

2021

1

应用材料公司

美国

APPLIED MATERIALS, INC

185

2

东京电子株式会社

日本

TOKYO ELECTRON LTD.

168

3

拉姆研究公司

美国

LAM RESEARCH CORPORATION

95

4

长鑫存储技术有限公司

中国

CHANGXIN MEMORY TECHNOLOGIES, INC

84

5

国际电气株式会社

日本

KOKUSAI ELECTRIC CORPORATION

41

6

日立高新技术公司

日本

HITACHI HIGH-TECH CORPORATION

38

7

索尼半导体解决方案公司

日本

SONY SEMICONDUCTOR SOLUTIONS   CORPORATION

33

8

三菱电机公司

日本

MITSUBISHI ELECTRIC CORPORATION

30

9

科磊公司

美国

KLA CORPORATION

29

10

株式会社斯库林集团

日本

SCREEN HOLDINGS CO., LTD.

27

注:本表数据按照第一申请人进行统计。

 


附图2.7.38-2  2021年半导体制造领域的PCT国际专利申请前10机构

 

 

 

 

 

 

 

 

致谢

感谢大连理工大学刘则渊教授、河南师范大学梁立明教授、科技部中国科学技术发展战略研究院武夷山研究员、大连理工大学丁堃教授、大连理工大学杨中楷教授对本报告的大力支持与帮助。同时,向以不同形式对本报告提出意见和建议的专家学者们表示诚挚的感谢。

如需要中美欧日韩五局及PCT专利数据、专利报告,以及咨询相关专利问题请添加微信号。

微信号:13592308169

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附表  2021年该领域PCT国际专利申请

 

IDTitleApplicant
WO/2021/151159A METHOD OF BONDING CARBON CONTAINING MATERIAL PORTIONS USING  A SILICON-CONTAINING MATERIALTHE UNIVERSITY OF MELBOURNE
WO/2021/035322ASSEMBLY METHOD FOR CHIP WITH EXPOSED TEST PADS AND CHIP WITH  EXPOSED TEST PADSCEITEC - CENTRO NACIONAL DE TECNOLOGIA ELETRÔNICA AVANÇADA  S.A.
WO/2021/016712HIGH EFFICIENCY MICRODEVICEVUEREAL INC.
WO/2021/113981BURIED HETEROSTRUCTURE SEMICONDUCTOR OPTICAL AMPLIFIER AND  METHOD FOR FABRICATING THE SAMENATIONAL RESEARCH COUNCIL OF CANADA
WO/2021/119836CARTRIDGE INSPECTION ANCHORSVUEREAL INC.
WO/2021/195755OFFSET ALIGNMENT AND REPAIR IN MICRO DEVICE TRANSFERVUEREAL INC.
WO/2021/207836FLIP CHIP MICROLED AND CARTRIDGE ARRANGEMENTVUEREAL INC.
WO/2021/003705WAFER CARRIER AND WAFER EPITAXIAL DEVICEENKRIS SEMICONDUCTOR, INC.
WO/2021/003706WAFER CARRYING DISK AND WAFER EPITAXIAL DEVICEENKRIS SEMICONDUCTOR, INC.
WO/2021/007737DETECTION CIRCUIT AND SENSORHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/007769DISPLAY SUBSTRATE, FABRICATION METHOD THEREFOR AND DISPLAY  APPARATUSBOE TECHNOLOGY GROUP CO., LTD.
WO/2021/007897MONOCRYSTALLINE SILICON LOCAL SOI SUBSTRATE, PHOTOELECTRIC  DEVICE, AND PREPARATION METHODSHANGHAI INDUSTRIAL ΜTECHNOLOGY RESEARCH INSTITUTE
WO/2021/017038TRANSFER METHOD FOR TRANSFERRING COMPOUND SEMICONDUCTOR  MONOCRYSTAL THIN FILM LAYER AND METHOD FOR PREPARING MONOCRYSTAL GAAS-OI  COMPOSITE WAFERBEIJING UNIVERSITY OF TECHNOLOGY
WO/2021/026872TRANSFER METHOD FOR SEMICONDUCTOR THIN FILM LAYER AND  MANUFACTURING METHOD FOR COMPOSITE WAFERBEIJING UNIVERSITY OF TECHNOLOGY
WO/2021/000384MICRO-LED CHIP TRANSFER METHOD AND DISPLAY DEVICESHENZHEN SITAN TECHNOLOGY CO., LTD.
WO/2021/017044BATTERY CELL IV AND EL DOUBLE-SIDED TEST EQUIPMENTROBOTECHNIK INTELLIGENT TECHNOLOGY CO., LTD.
WO/2021/031106MANUFACTURING METHOD FOR SURFACE RELIEF GRATING STRUCTUREAAC OPTICS (CHANGZHOU) CO., LTD.
WO/2021/026957HIGH-PRECISION LARGE PANEL-LEVEL MICRO-ASSEMBLY DEVICESUZHOU ACCURACY ASSEMBLY AUTOMATION CO., LTD.
WO/2021/026990ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING SAMESHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/012359TFT DRIVING BACKBOARD AND MICRO-LED DISPLAYSHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/046684MASS TRANSFER APPARATUS AND METHOD THEREFORCHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/035853FLEXIBLE DISPLAY DEVICE FABRICATION METHOD AND FLEXIBLE  DISPLAY DEVICEWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/062674PACKAGING STRUCTURE AND FORMING METHOD THEREFOR, AND PACKAGING  METHODSHENZHEN GOODIX TECHNOLOGY CO., LTD.
WO/2021/062773LIGHT EMITTING DIODE DETECTION SYSTEMCHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/062786LED MASS TRANSFER METHOD AND APPARATUSCHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/062881COATING AND DEVELOPMENT EQUIPMENTKINGSEMI CO., LTD.
WO/2021/068219METHOD FOR DETECTING DEFECTS IN DEEP FEATURES WITH LASER  ENHANCED ELECTRON TUNNELING EFFECTYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/068222METHODS FOR WAFER WARPAGE CONTROLYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/068225METHODS AND STRUCTURES FOR DIE-TO-DIE BONDINGYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/072603LED TESTING DEVICE AND METHODCHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/072743SYSTEMS AND METHODS FOR EVALUATING CRITICAL DIMENSIONS BASED  ON DIFFRACTION-BASED OVERLAY METROLOGYYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/027059ARRAY SUBSTRATE AND PREPARATION METHOD THEREFOR, AND TOUCH  CONTROL DISPLAY PANELWUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
WO/2021/003884ARRAY SUBSTRATE AND PREPARATION METHOD THEREFORWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/017206ELECTROMAGNETIC SHIELDING PACKAGING STRUCTURE AND PACKAGING  METHOD THEREFORJIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
WO/2021/035931ARRAY SUBSTRATE, MANUFACTURING METHOD FOR ARRAY SUBSTRATE, AND  DISPLAY PANELSHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/068307SOLAR CELL AND MANUFACTURING METHOD THEREFORZHEJIANG JINKO SOLAR CO., LTD.
WO/2021/081975SUBSTRATE CLEANING METHOD AND APPARATUSACM RESEARCH (SHANGHAI) INC.
WO/2021/031358ARRAY SUBSTRATE AND FABRICATING METHOD THEREFOR, AND DISPLAY  PANELWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/031374PREPARATION METHOD FOR ARRAY SUBSTRATE AND ARRAY SUBSTRATEWUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
WO/2021/042502QUANTUM DOT LIGHT-EMITTING DEVICE PATTERNING METHOD AND  QUANTUM DOT LIGHT-EMITTING DEVICESHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/031380ARRAY SUBSTRATE AND PREPARATION METHOD THEREFORWUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
WO/2021/088027AUTOMATIC ASSESSMENT METHOD AND ASSESSMENT SYSTEM THEREOF FOR  YIELD IMPROVEMENTYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/031392MANUFACTURING METHOD FOR ARRAY SUBSTRATE, AND ARRAY SUBSTRATEWUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
WO/2021/082066DISPLAY PANEL AND METHOD FOR MANUFACTURE THEREOFSHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/092764SEMICONDUCTOR DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/042551ADJUSTABLE WAFER OVERTURNING DEVICEROBOTECHNIK INTELLIGENT TECHNOLOGY CO., LTD.
WO/2021/008040DRY ETCHING METHOD FOR FILM LAYER STRUCTURE, AND FILM LAYER  STRUCTURETCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
WO/2021/092862SEMICONDUCTOR SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND  SEMICONDUCTOR DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/082089MANUFACTURING METHOD FOR ARRAY SUBSTRATE, AND ARRAY SUBSTRATESHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/000501METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICEWUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
WO/2021/056777PI SUBSTRATE AND PREPARATION METHOD THEREFORWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/056778WELDING PROCESS FOR CLADDING COPPER ON BACK SURFACE OF WAFERYANTAI TAIXIN ELECTRONIC TECHNOLOGY CO., LTD.
WO/2021/097756PACKAGED ELECTRONIC DEVICE WITH LOW RESISTANCE BACKSIDE  CONTACTTEXAS INSTRUMENTS INCORPORATED
WO/2021/056785<u>INVERTER MANUFACTURING METHOD AND INVERTER</u>SHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/102659MICRO DEVICE TRANSFER APPARATUS AND METHODCHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/102712SEMICONDUCTOR VACUUM TREATMENT DEVICE AND SEMICONDUCTOR  TREATMENT METHODCHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/102877MASS TRANSFER CARRIER PLATE, MASS TRANSFER DEVICE, AND METHOD  FOR SAMECHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/108942METHOD FOR AUTOMATICALLY EXPANDING FILM, AND STORAGE MEDIUM  AND DEVICECHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/109007MASS TRANSFER METHOD AND SYSTEM FOR SEMICONDUCTOR ELEMENTCHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/109010MASS TRANSFER METHOD AND SYSTEM FOR SEMICONDUCTOR DEVICECHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD
WO/2021/097933OLED AUTOMATIC PRODUCTION DEVICESHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/109073SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFORENKRIS SEMICONDUCTOR, INC.
WO/2021/109075SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFORENKRIS SEMICONDUCTOR, INC.
WO/2021/103125MANUFACTURING METHOD FOR SEMICONDUCTOR POWER DEVICE, AND  SEMICONDUCTOR POWER DEVICESUZHOU ORIENTAL SEMICONDUCTOR CO., LTD.
WO/2021/109160METHOD FOR MANUFACTURING SEMICONDUCTOR POWER DEVICESUZHOU ORIENTAL SEMICONDUCTOR CO., LTD.
WO/2021/109230MICRO LIGHT EMITTING DIODE TRANSFER DEVICE AND MICRO LIGHT  EMITTING DIODE TRANSFER METHODSHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/119965MASS TRANSFER APPARATUS AND MASS TRANSFER METHODCHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/109238TRANSFER METHOD AND TRANSFER DEVICE FOR MICRO LEDSHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/120048CHIP STRUCTURE AND WIRELESS COMMUNICATION DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/114347METHOD FOR PREPARING METAL ELECTRODETCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
WO/2021/120143FLEXIBLE MICROWAVE POWER TRANSISTOR AND METHOD FOR PREPARATION  THEREOFUNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA
WO/2021/127862METHODS FOR ETCHING A MATERIAL LAYER FOR SEMICONDUCTOR  APPLICATIONSAPPLIED MATERIALS, INC.
WO/2021/077601DISPLAY PANEL AND MANUFACTURING METHOD THEREFORHUIZHOU CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
WO/2021/093104PREPARATION METHOD FOR FLEXIBLE DISPLAY PANEL, MATERIAL OF  SACRIFICIAL LAYER, AND PREPARATION METHOD THEREFORTCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
WO/2021/114430BACKPLANE MANUFACTURING METHODSHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/134255MASS TRANSFER APPARATUS AND METHODCHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/093127ALGAN/GAN OHMIC CONTACT ELECTRODE AND PREPARATION METHOD  THEREFOR, AND METHOD FOR REDUCING OHMIC CONTACTSOUTHERN UNIVERSITY OF SCIENCE AND TECHNOLOGY.
WO/2021/134423METHOD FOR PREPARING THIN FILM TRANSISTORGUANGZHOU NEW VISION OPTO-ELECTRONIC TECHNOLOGY CO., LTD.
WO/2021/114437TRENCH FIELD EFFECT TRANSISTOR STRUCTURE, AND MANUFACTURING  METHOD FOR SAMECHINA RESOURCES MICROELECTRONICS (CHONGQING) CO., LTD
WO/2021/134489MASS TRANSFER APPARATUS, FABRICATION METHOD THEREFOR, AND  DISPLAY DEVICECHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/134490MASS TRANSFER SYSTEM AND METHOD FOR LIGHT-EMITTING DIODECHONGQING KONKA PHOTOELECTRIC TRCHNOLOGY RESEARCH INSTITUTE  CO., LTD
WO/2021/134579DETECTION PROCESSING METHOD AND SYSTEM, AND STORAGE MEDIUMCHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/134751THIN FILM TRANSISTOR AND FABRICATION METHOD THEREOF, DISPLAY  PANEL AND DISPLAY APPARATUSBOE TECHNOLOGY GROUP CO., LTD.
WO/2021/128454ARRAY SUBSTRATE MANUFACTURING METHOD, ARRAY SUBSTRATE AND  DISPLAY DEVICESHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/000560SEMICONDUCTOR MEMORY PREPARATION METHOD AND SEMICONDUCTOR  MEMORYCHENGDU PBM TECHNOLOGY LTD.
WO/2021/138771HEATING DEVICE AND PREPARATION METHOD FOR MASS PREPARATION OF  HIGH-QUALITY ALUMINIUM NITRIDE TEMPLATESULTRATREND TECHNOLOGIES INC
WO/2021/138792METAL-DIELECTRIC BONDING METHOD AND STRUCTUREYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/138794METHODS FOR MULTI-WAFER STACKING AND DICINGYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/142622METHOD FOR DETERMINING CAUSE OF DEFECT, AND ELECTRONIC DEVICE,  STORAGE MEDIUM, AND SYSTEMBOE TECHNOLOGY GROUP CO., LTD.
WO/2021/128518METHOD FOR MANUFACTURING PATTERN OF THIN FILM TRANSISTOR, THIN  FILM TRANSISTOR AND PHOTOMASKTCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
WO/2021/098038METHOD AND DEVICE FOR WET PROCESSING INTEGRATED CIRCUIT  SUBSTRATES USING A MIXTURE OF CHEMICAL STEAM VAPORS AND CHEMICAL GASESSHANGHAI SNA ELECTRONIC INFORMATION TECHNOLOGIES CO. LTD.
WO/2021/142766SYSTEMS FOR APPLYING MATERIALS TO COMPONENTSTIANJIN LAIRD TECHNOLOGIES LIMITED
WO/2021/142816WAFER TO WAFER STRUCTURE AND TEST METHOD THEREFOR, AND HIGH  BANDWIDTH MEMORY AND MANUFACTURING METHOD THEREFORHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/146860STACKED CHIP, MANUFACTURING METHOD, IMAGE SENSOR, AND  ELECTRONIC DEVICESHENZHEN GOODIX TECHNOLOGY CO., LTD.
WO/2021/146897THREE-DIMENSIONAL NAND MEMORY DEVICE AND METHOD OF FORMING THE  SAMEYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/159225METAL CONTAMINATION TEST APPARATUS AND METHODYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/142870PIXEL DRIVING CIRCUIT AND MANUFACTURING METHOD THEREFORSHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/159501SYSTEM IN PACKAGE (SIP) CHIP AND ELECTRONIC SHELF LABELHANSHOW TECHNOLOGY CO., LTD.
WO/2021/163823HYBRID WAFER BONDING METHOD AND STRUCTURE THEREOFYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/114476FLEXIBLE DISPLAY PANEL AND MANUFACTURING METHOD THEREFORWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/138974GLASS WAFER SUCTION DEVICEAAC OPTICS (CHANGZHOU) CO., LTD.
WO/2021/134889TRENCH GATE MOSFET POWER SEMICONDUCTOR DEVICE, POLYCRYSTALLINE  SILICON-FILLING METHOD THEREFOR, AND MANURFACTURING METHOD THEREFORHANGZHOU SILAN MICROELECTRONICS CO., LTD.
WO/2021/174395ENCAPSULATION STRUCTURE AND METHOD FOR MANUFACTURING  ENCAPSULATION STRUCTUREHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/051751FERROELECTRIC MEMORY DEVICES WITH REDUCED EDGE DEFECTS AND  METHODS FOR FORMING THE SAMEWUXI PETABYTE TECHNOLOGIES CO., LTD.
WO/2021/179185CHIP STACKING STRUCTURE, MANUFACTURING METHOD, AND ELECTRONIC  DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/179270THREE-DIMENSIONAL INTEGRATED CIRCUIT, AND PROCESS AND DEVICE  FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT ALIGNMENTHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/179273CONTACT STRUCTURES FOR THREE-DIMENSIONAL MEMORYYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/168915BAKING DEVICE USED IN MANUFACTURING PROCESS OF DISPLAY PANELTCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
WO/2021/068456SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREFORSHANGHAI XIANFANG SEMICONDUCTOR CO., LTD
WO/2021/155625THIN FILM TRANSISTOR ARRAY PANEL AND MANUFACTURING METHOD  THEREFORSHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/184175METHODS AND SYSTEMS FOR SEMICONDUCTOR STRUCTURE THICKNESS  MEASUREMENTYANGTZE MEMORY TECHNOLOGIES CO., LTD.
WO/2021/082337METHOD FOR IMPROVING TIP DISCHARGE DEFECT AND MANUFACTURING  METHOD FOR SEMICONDUCTOR DEVICEWUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
WO/2021/093238METAL LEAD, SEMICONDUCTOR DEVICE AND FABRICATION METHOD  THEREFORWUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
WO/2021/155626ARRAY SUBSTRATE, DISPLAY PANEL, AND METHOD FOR FABRICATING  ARRAY SUBSTRATEWUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
WO/2021/184256QUANTUM DOT LIGHT EMITTING DEVICE AND MANUFACTURING METHOD  THEREFOR, AND MANUFACTURING METHOD FOR QUANTUM DOT DISPLAY PANELBOE TECHNOLOGY GROUP CO., LTD.
WO/2021/077673ARRAY SUBSTRATE MANUFACTURING METHOD, AND ARRAY SUBSTRATECHENGDU CEC PANDA DISPLAY TECHNOLOGY CO., LTD.
WO/2021/134940BONDING STRUCTURE AND FABRICATION METHOD THEREFORWUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
WO/2021/195858DOWNWARD ETCHING METHOD FOR MANUFACTURING PEROVSKITE  MICRO-NANO STRUCTUREHARBIN INSTITUTE OF TECHNOLOGY, SHENZHEN (INSTITUTE OF SCIENCE  AND TECHNOLOGY INNOVATION, HARBIN INSTITUTE OF TECHNOLOGY, SHENZHEN)
WO/2021/195893BARE CHIP, PACKAGING STRUCTURE, ELECTRONIC DEVICE, AND  MANUFACTURING METHODHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/189541DISPLAY DEVICE AND MANUFACTURING METHOD THEREFORWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/164113WEIGHT MODULE FOR CHIP COATING PROCESSHIMIT (SHENZHEN) TECHNOLOGY CO LTD
WO/2021/212330METHOD AND APPARATUS FOR REMOVING PARTICLES OR PHOTORESIST ON  SUBSTRATESACM RESEARCH (SHANGHAI) , INC.
WO/2021/196310REPAIRING APPARATUS FOR DISPLAY PANELTCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
WO/2021/196311MICRO LIGHT EMITTING DIODE TRANSFER DEVICE AND TRANSFER  METHOD, AND DISPLAY DEVICETCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
WO/2021/196313MICRO LIGHT-EMITTING DIODE TRANSFER DEVICE AND TRANSFER METHOD  AND DISPLAY DEVICETCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
WO/2021/139043ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREFORTCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
WO/2021/217301SEMICONDUCTOR STRUCTURE MANUFACTURING METHOD AND SEMICONDUCTOR  STRUCTUREENKRIS SEMICONDUCTOR, INC.
WO/2021/217302MANUFACTURING METHOD FOR SEMICONDUCTOR STRUCTURE, AND  SEMICONDUCTOR STRUCTUREENKRIS SEMICONDUCTOR, INC.
WO/2021/217458INTEGRATED CIRCUIT, FABRICATION METHOD, AND ELECTRONIC DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/217546DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND  DISPLAY DEVICEBOE TECHNOLOGY GROUP CO., LTD.
WO/2021/217600MIRRORED FACE DISPLAY PANEL, MANUFACTURING METHOD THEREFOR,  AND DISPLAY APPARATUSBOE TECHNOLOGY GROUP CO., LTD.
WO/2021/203501METHOD FOR FABRICATING ARRAY SUBSTRATE, ARRAY SUBSTRATE, AND  DISPLAY DEVICESHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/212559GOA ARRAY SUBSTRATE, DISPLAY DEVICE, AND MANUFACTURING METHODSHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/226839GROUP III NITRIDE STRUCTURE AND MANUFACTURING METHOD THEREFORENKRIS SEMICONDUCTOR, INC.
WO/2021/226945TRANSFER METHOD AND DISPLAY DEVICECHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
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WO/2021/208177METHOD FOR TESTING ELECTRICAL PERFORMANCE OF PACKAGED CHIPMONTAGE TECHNOLOGY (KUNSHAN) CO., LTD.
WO/2021/135044DEFECT INSPECTION APPARATUS AND METHODSHANGHAI IC R & D CENTER CO., LTD.
WO/2021/232315TRANSFER DEVICE AND TRANSFER METHODCHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/227123METHOD FOR DETERMINING BLOCKING ABILITY OF COPPER DIFFUSION  BARRIER LAYER AND STRUCTURE THEREOFSHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/179437SILICON WAFER TRANSPORT DEVICELINGANG KINGSTONE SEMICONDUCTOR COMPANY LTD.
WO/2021/051853LATERAL DOUBLE-DIFFUSED METAL OXIDE SEMICONDUCTOR DEVICE AND  MANUFACTURING METHOD, AND ELECTRONIC APPARATUSCSMC TECHNOLOGIES FAB2 CO., LTD.
WO/2021/232452MASS TRANSFER DEVICE AND SYSTEM, AND CONTROL METHOD THEREFORCHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/237511TRANSFER SUBSTRATE OF MICRO-LEDS AND PREPARATION METHOD  THEREFORCHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/237528GROUP III NITRIDE STRUCTURE AND PREPARATION METHOD THEREFORENKRIS SEMICONDUCTOR, INC.
WO/2021/237529MASS TRANSFER DEVICE AND TRANSFER METHOD THEREOFCHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/017601LATERALLY DIFFUSED METAL OXIDE SEMICONDUCTOR DEVICE AND  MANUFACTURING METHOD THEREFORCSMC TECHNOLOGIES FAB2 CO., LTD.
WO/2021/237568MASS TRANSFER APPARATUS AND MASS TRANSFER METHODCHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/109504SEMICONDUCTOR MEMORY AND FORMING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/036381LASER LIFT-OFF INTEGRATED DEVICESINO NITRIDE SEMICONDUCTOR CO., LTD.
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WO/2021/243615MASS TRANSFER DEVICE AND METHOD FOR MICRO LIGHT-EMITTING  DIODESCHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/077758METHOD FOR USING MBE TO REGROW P-GAN SINGLE-GATE STRUCTURE  GAN-JFET DEVICEGX OPTOELECTRONIC TECHNOLOGY INSTITUE CO., LTD
WO/2021/012826METHOD FOR STRIPPING SEMICONDUCTOR THIN FILM AND TRANSFERRING  SAME TO SUBSTRATEYIGUAN INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD
WO/2021/068539INSPECTION DEVICE AND METHOD FOR MICRO LIGHT-EMITTING DIODECHENGDU VISTAR OPTOELECTRONICS CO., LTD.
WO/2021/248378METHOD FOR BEOL METAL TO DIELECTRIC ADHESIONAPPLIED MATERIALS, INC.
WO/2021/135081MATERIAL RACK FOR DIODE PACKAGINGTAICANG JIA RUI PRECISION MOULD CO., LTD.
WO/2021/135082RACK EJECTOR ROD FOR DIODE PACKAGINGTAICANG JIA RUI PRECISION MOULD CO., LTD.
WO/2021/073133SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR PACKAGE  STRUCTURE, AND PACKAGE BODYCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/073134SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR PACKAGING  STRUCTURE AND PACKAGING BODYCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/073135SEMICONDUCTOR PACKAGING METHOD, SEMICONDUCTOR PACKAGING  STRUCTURE, AND PACKAGESCHANGXIN MEMORY TECHNOLOGIES, INC.
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WO/2021/253284EPITAXIAL WAFER, LED CHIP, AND DISPLAY SCREENHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/208224METHOD FOR PREPARING ITO THIN FILM BASED ON SOLUTION METHODWUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/088378SEMICONDUCTOR STRUCTURE AND PREPARATION METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/088379SEMICONDUCTOR STRUCTURE, FABRICATION METHOD THEREFOR, AND  SEMICONDUCTOR PACKAGE STRUCTURECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/103505SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/008317THREE-PHASE INVERSION POWER CHIP AND PREPARATION METHOD  THEREFORGREE ELECTRIC APPLIANCES, INC.OF ZHUHAI
WO/2021/017744PACKAGING PROCESS FOR MULTI-CHIP MODULEINNOGRATION (SUZHOU) CO., LTD.
WO/2021/248593MICROARRAY ADSORPTION SUBSTRATE, DRIVING CIRCUIT, AND DISPLAY  DEVICESHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/253513SILICON THROUGH-HOLE STRUCTURE FOR THREE-DIMENSIONAL  INTEGRATED CIRCUIT PACKAGING AND FABRICATION METHOD THEREFORFUDAN UNIVERSITY
WO/2021/243791LASER PACKAGING DEVICESHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/103537SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/004438CHIP FAILURE LOCATING METHODBEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY COMPANY LIMITED
WO/2021/253542SUBSTRATE PROCESSING METHOD AND SEMICONDUCTOR DEVICE  MANUFACTURING METHODFUJIAN JING'AN OPTOELECTRONICS CO., LTD.
WO/2021/013030PACKAGING METHOD FOR SEMICONDUCTOR DEVICE, PACKAGING ASSEMBLY,  AND ELECTRONIC DEVICEINTELLIMICRO MEDICAL CO., LTD.
WO/2021/017895PACKAGING STRUCTURE AND FABRICATION METHOD THEREOFNANTONG TONGFU MICROELECTRONICS CO., LTD
WO/2021/017897PACKAGING STRUCTURE AND FABRICATION METHOD THEREOFNANTONG TONGFU MICROELECTRONICS CO., LTD
WO/2021/013097PACKAGING STRUCTURE AND FORMATION METHOD THEREOFNANTONG TONGFU MICROELECTRONICS CO., LTD.
WO/2021/103602CRITICAL DIMENSION ERROR ANALYSIS METHODSHANGHAI IC R & D CENTER CO., LTD.
WO/2021/135179METHOD FOR PREPARING HEAD-TO-HEAD PATTERNSHANGHAI IC R & D CENTER CO., LTD.
WO/2021/018037THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREFOR,  BIOLOGICAL RECOGNITION DEVICE, AND DISPLAY APPARATUSBOE TECHNOLOGY GROUP CO., LTD.
WO/2021/147284FLEXIBLE SUBSTRATE METAL OXIDE THIN FILM TRANSISTOR AND  PASSIVATION LAYER PREPARATION METHOD THEREOFSOUTH CHINA UNIVERSITY OF TECHNOLOGY
WO/2021/088430MEMORY AND FORMING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/088431MEMORY AND FORMING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/223343METHOD FOR PREPARING GALLIUM NITRIDE-MOLYBDENUM DISULFIDE  HYBRID SCALE PN JUNCTIONNJU OPTOELECTRONICS ENGINEERING RESEARCH INSTITUTE CO., LTD
WO/2021/232604MANUFACTURING METHOD FOR ADVANCED NODE REAR-SECTION METAL  THROUGH HOLENANJING CHENGXIN INSTITUTE OF IC TECHNOLOGY
WO/2021/184683DEVICE FOR HOLDING SEMICONDUCTOR WAFERWAFER WORKS EPITAXIAL CORP.
WO/2021/184684EPITAXIAL METHOD FOR SUPER HEAVILY DOPED RED PHOSPHOROUS  SUBSTRATEWAFER WORKS EPITAXIAL CORP.
WO/2021/098324SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR  DEVICECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/068672IGZO THIN-FILM TRANSISTOR AND METHOD FOR MANUFACTURING SAMESOUTHEAST UNIVERSITY
WO/2021/043167FINAL CLEANING METHOD FOR SILICON CARBIDE SINGLE-CRYSTAL  POLISHED WAFER SUBSTRATESHANXI SEMICORE CRYSTAL CO., LTD.
WO/2021/212722SEMICONDUCTOR TRANSFER APPARATUS, DEVICE AND TRANSFER METHODCHONGQING KONKA PHOTOELECTRIC TECHNOLOGY RESEARCH INSTITUTE  CO., LTD.
WO/2021/258561MEMORY FORMING METHOD AND MEMORYCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/143180SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE PREPARATION  METHODCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/223353MANUFACTURING METHOD FOR SEMICONDUCTOR SUPER-JUNCTION DEVICESUZHOU ORIENTAL SEMICONDUCTOR CO., LTD.
WO/2021/223354METHOD FOR MANUFACTURING SEMICONDUCTOR SUPER-JUNCTION DEVICESUZHOU ORIENTAL SEMICONDUCTOR CO., LTD.
WO/2021/098376INSULATED GATE BIPOLAR TRANSISTOR DEVICE AND MANUFACTURING  METHOD THEREFORSOUTHEAST UNIVERSITY
WO/2021/088568LEAD FRAME FEEDING FRAME HAVING AUTOMATIC FIXING FUNCTIONFOSHAN BLUE ROCKET ELECTRONICS CO., LTD.
WO/2021/189802WAFER CLEANING AND DRYING DEVICEHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC
WO/2021/068805DISPLAY PANEL, MANUFACTURING METHOD THEREFOR, AND DISPLAY  DEVICEBOE TECHNOLOGY GROUP CO., LTD.
WO/2021/058031SEMICONDUCTOR ENCAPSULATION METHOD AND SEMICONDUCTOR  ENCAPSULATION STRUCTURESIPLP MICROELECTRONICS (CHONGQING) CO., LTD.
WO/2021/037282SEMICONDUCTOR TESTING APPARATUS AND TESTING METHODZICHUANG (NANJING) TECHNOLOGY CO., LTD
WO/2021/223365WAFER CONVEYING DEVICE, CONVEYING METHOD AND CMP APPARATUS  CLEANING MODULEHANGZHOU SIZONE ELECTRONIC TECHNOLOGY INC.
WO/2021/082898COF ENCAPSULATION METHODCHIPMORE TECHNOLOGY CORPORATION LIMITED
WO/2021/129052COVER OPENING APPARATUS FOR WAFER CASSETTE AND COVER OPENING  METHOD THEREFORCHIPMORE TECHNOLOGY CORPORATION LIMITED
WO/2021/129053EJECTOR PIN DEVICE FOR CHIP PACKAGINGCHIPMORE TECHNOLOGY CORPORATION LIMITED
WO/2021/143242PACKAGING STRUCTURE AND PREPARATION METHOD THEREFORHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/088670ETCHING METHOD, AIR GAP TYPE DIELECTRIC LAYER, AND DYNAMIC  RANDOM ACCESS MEMORYBEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
WO/2021/248781SELECTOR MATERIAL, SELECTOR UNIT, AND PREPARATION METHOD AND  MEMORY STRUCTURESHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY,  CHINESE ACADEMY OF SCIENCES
WO/2021/258595CRIMPING-TYPE MODULE ELECTRODE CRIMPING DEVICEYANGZHOU SILING ELECTRONICS CO., LTD.
WO/2021/238059MECHANICAL STRIPPING METHOD AND APPARATUS FOR FLEXIBLE  SUBSTRATETRULY SEMICONDUCTORS LIMITED
WO/2021/083304SUBSTRATE STRIPPING METHOD AND EPITAXIAL WAFERHC SEMITEK (ZHEJIANG) CO., LTD.
WO/2021/139366METHOD FOR MANUFACTURING VERTICAL DEVICEENKRIS SEMICONDUCTOR, INC.
WO/2021/103953GALLIUM OXIDE SEMICONDUCTOR STRUCTURE, VERTICAL GALLIUM  OXIDE-BASED POWER DEVICE, AND PREPARATION METHODSHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY,  CHINESE ACADEMY OF SCIENCES
WO/2021/088912THIN FILM TRANSISTOR AND PREPARATION METHOD THEREFOR, ARRAY  SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY PANELBOE TECHNOLOGY GROUP CO., LTD.
WO/2021/129199LIGHT-EMITTING DEVICE, SUBSTRATE THEREOF AND FABRICATION  METHODGUANGDONG JUHUA PRINTED DISPLAY TECHNOLOGY CO., LTD.
WO/2021/164342DIE-TAKING AND DIE-BONDING MECHANISM AND DIE BONDERSUZHOU ACCURACY ASSEMBLY AUTOMATION CO., LTD
WO/2021/164343CHIP REMOVING AND MOUNTING DEVICE AND CHIP MOUNTING MACHINESUZHOU ACCURACY ASSEMBLY AUTOMATION CO., LTD
WO/2021/218125SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAMECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/179672PACKAGING STRUCTURE AND FORMATION METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/104375MOLD FOR MAKING ALKALI METAL WAX PACKET, METHOD FOR PREPARING  SAME, AND METHOD FOR USING SAMEBEIJING VACUUM ELECTONICS RESEARCH INSTITUTE
WO/2021/121024TRAY USED FOR THIN-FILM DEPOSITION DEVICEBEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
WO/2021/135804CLEANING SOLUTION FOR PLASMA ETCHING RESIDUEANJI MICROELECTRONICS TECHNOLOGY (SHANGHAI) CO., LTD
WO/2021/121050METHOD FOR DETERMINING POLISHED EDGE SHAPE OF SEMICONDUCTOR  WAFER, AND METHOD FOR PREDICTING EDGE SHAPE OF SEMICONDUCTOR WAFERXUZHOU XINJING SEMICONDUCTOR TECHNOLOGY CO., LTD.
WO/2021/189942SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING  STRUCTURESIPLP MICROELECTRONICS (CHONGQING) CO., LTD.
WO/2021/212864SILICON CARBIDE DEVICE AND PREPARATION METHOD THEREFORCSMC TECHNOLOGIES FAB2 CO., LTD.
WO/2021/115377PACKAGING METHOD, PACKAGING STRUCTURE AND PACKAGING MODULEZTE CORPORATION
WO/2021/238197TRENCH SIDEWALL GATE WITH LEAD-OUT STRUCTURE, AND METHOD FOR  MANUFACTURING SAMECSMC TECHNOLOGIES FAB2 CO., LTD.
WO/2021/218219MANUFACTURING METHOD FOR TRENCH OF BCD DEVICE, AND BCD DEVICECSMC TECHNOLOGIES FAB2 CO., LTD.
WO/2021/232815SEPARATION DEVICE AND SEPARATION METHODSHENZHEN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY  TECHNOLOGY CO., LTD.
WO/2021/258706SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICESIPLP MICROELECTRONICS (CHONGQING) CO., LTD.
WO/2021/143578CLEANING DEVICEBEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
WO/2021/218268BURIED GATE PREPARATION METHOD AND SEMICONDUCTOR DEVICE  PREPARATION METHODCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/185002PREPARATION METHOD FOR STRAIN SENSITIVE FILM, STRAIN SENSITIVE  FILM, AND PRESSURE SENSORSHENZHEN NEW DEGREE TECHNOLOGY CO.,LTD.
WO/2021/169787DOUBLE-SIDED CAPACITOR STRUCTURE AND METHOD FOR FORMING SAMECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/218281METHOD FOR PREPARING SI SUBSTRATE-ALN TEMPLATE AND METHOD FOR  PREPARING SI SUBSTRATE-GAN EPITAXIAL STRUCTUREXIDIAN UNIVERSITY
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WO/2021/179875SUSPENSION DIRECTIONAL MIGRATION AND SELF-LOADING MASS  TRANSFER METHOD FOR SINGLE AND MULTIPLE TYPES OF TINY OBJECTSGUANGDONG UNIVERSITY OF TECHNOLOGY
WO/2021/164622FABRICATION METHOD FOR SEMICONDUCTOR MEMORYCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/169794SEMICONDUCTOR STRUCTURE MANUFACTURING METHOD AND SEMICONDUCTOR  STRUCTURECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/169796CONDUCTOR LAYER MANUFACTURING METHODCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/169797SEMICONDUCTOR STRUCTURE PREPARATION METHOD AND SEMICONDUCTOR  STRUCTURECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/169798SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/169805SEMICONDUCTOR DEVICE MANUFACTURING METHODCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/164664LOADING/UNLOADING DEVICE OF WAFER CARRYING DISC AND  LOADING/UNLOADING METHOD THEREFORSUNG, Mao-Yen
WO/2021/164667WAFER, AND CALIBRATION APPARATUS AND CALIBRATION METHOD FOR  TRANSFER MECHANISM OF WAFERSUNG, Mao-Yen
WO/2021/169808MACHINE FILE PROCESSING METHOD AND SYSTEMCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/169813SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/169816METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/169860WAFER SUPPORTING MEMBER, WAFER PROCESSING DEVICE AND WAFER  PROCESSING METHODCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/169862SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/164771WAFER PROCESSING SYSTEM, AUTOMATIC LEVELING DEVICE FOR  SEMICONDUCTOR MACHINE TABLE, AND LEVELING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/179896CHUCK STRUCTURE OF SEMICONDUCTOR CLEANING DEVICE AND  SEMICONDUCTOR CLEANING DEVICEBEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
WO/2021/185040SEMICONDUCTOR STRUCTURE FORMING METHOD AND SEMICONDUCTOR  STRUCTURECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/175154CAPACITOR AND FORMING METHOD THEREFOR, AND DRAM AND FORMING  METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/175157METHOD FOR FORMING ACTIVE REGION ARRAY, AND SEMICONDUCTOR  STRUCTURECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/170081MICRO-ELECTRONIC NON-LANDING MIRROR SYSTEMSHENZHEN LIGHTING INSTITUTE
WO/2021/179925METHOD FOR FORMING MEMBRANE WITH UNIFORM THICKNESS  DISTRIBUTION, AND SEMICONDUCTOR STRUCTURECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/179926CAPACITOR ARRAY STRUCTURE AND FORMING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/175193SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/190248TABLE MATCHING DETECTION METHOD AND SYSTEM, AND EARLY WARNING  METHOD AND SYSTEMCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/196945MONITORING WAFER AND MONITORING SYSTEMCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/179934SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAMECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/170145CHIP SEPARATION METHOD AND WAFERFATRI UNITED TESTING & CONTROL (QUANZHOU) TECHNOLOGIES  CO., LTD.
WO/2021/258765SEMICONDUCTOR DEVICE, FABRICATION METHOD, AND ELECTRONIC  DEVICEGUANGDONG ZHINENG TECHNOLOGY CO., LTD.
WO/2021/196974SEMICONDUCTOR EPITAXIAL STRUCTURE AND SEMICONDUCTOR DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/185103SUPPORT DEVICE, SEMICONDUCTOR APPARATUS, AND METHOD OF  DETECTING RESIDUAL CHARGEBEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
WO/2021/203885SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/203887SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/208635MACHINE GAS PATH FLOW ADJUSTMENT SYSTEM AND METHODCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/180102METHOD FOR EVALUATING DEVICE HOT-CARRIER EFFECTCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/203897METHOD FOR MANUFACTURING HIGH-DENSITY THREE-DIMENSIONAL  PROGRAMMABLE MEMORYCHENGDU PBM TECHNOLOGY LTD.
WO/2021/185133TEMPERATURE CALIBRATION METHOD FOR SEMICONDUCTOR MACHINECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/185134TEMPERATURE CALIBRATION PIECE AND APPLICATION METHOD THEREOFCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/180121METHOD FOR PROCESSING SEMICONDUCTOR STRUCTURECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/203900SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/248951SUBSTRATE THINNING METHOD, SUBSTRATE THINNING DEVICE, AND  OPERATING METHOD THEREOFTSINGHUA UNIVERSITY
WO/2021/208649METHOD FOR FORMING ACTIVE AREA ARRAYCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/197025SEMICONDUCTOR STRUCTURE AND PREPARATION METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/185162METHOD FOR MEASURING AND CALIBRATING TEMPERATURE OF WAFER  CHUCK, AND TEMPERATURE MEASUREMENT SYSTEMCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/190406SEMICONDUCTOR ETCHING METHODCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/203945METHOD FOR MANUFACTURING TRENCH ISOLATION STRUCTURE AND METHOD  FOR MANUFACTURING SEMICONDUCTOR DEVICECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/197108CAVITY APPLIED TO SEMICONDUCTOR PROCESSCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/203951SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAMECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/197206MARK DETECTION METHOD AND APPARATUS, AND COMPUTER READABLE  STORAGE MEDIUMCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/197209SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD FOR SEMICONDUCTOR  STRUCTURECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/232936SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/232937METHOD FOR PREPARING SEMICONDUCTOR STRUCTURECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/197322METHOD FOR DEPOSITING NANOSTRUCTURES ON SUBSTRATE AND  NANOSTRUCTURE ARRAYSPEKING UNIVERSITY
WO/2021/204050SEMICONDUCTOR PROCESSING DEVICEBEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
WO/2021/204064MEMORY FORMATION METHOD AND MEMORYCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/227722STAGE APPARATUSCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/227731MANUFACTURING METHOD FOR BURIED WORD LINE STRUCTURE, AND  SEMICONDUCTOR MEMORY COMPRISING BURIED WORD LINE STRUCTURECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/208832SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING SAMECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/204288SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/204291SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/208855SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/227751OXIDATION GAS HOMOGENIZING COVER WITH GAS FEEDING UNIFORMIZING  FUNCTIONGX OPTOELECTRONIC TECHNOLOGY INSTITUE CO., LTD
WO/2021/208997ELECTRODE MANUFACTURING METHOD, ELECTRODE, AND SEMICONDUCTOR  DEVICEDYNAX SEMICONDUCTOR, INC.
WO/2021/223586WET TREATMENT DEVICE AND CONTROL METHOD THEREFOR, STORAGE  MEDIUM, AND ELECTRONIC DEVICECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/213425FAULT MONITORING SYSTEM AND METHOD USED DURING SEMICONDUCTOR  MANUFACTURING PROCESSCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/218941SEMICONDUCTOR DEVICE MEASUREMENT METHODCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/218942WAFER PROCESSING DEVICE AND WAFER TRANSFERRING METHODCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/233111MEMORY FORMING METHOD AND MEMORYCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/227943SEMICONDUCTOR REACTION CHAMBER AND ATOMIC LAYER PLASMA ETCHING  EQUIPMENTBEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
WO/2021/238618METHOD FOR FORMING CAPACITOR HOLECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/233138SEMICONDUCTOR DEVICE AND FORMING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/233139WAFER CLEANING APPARATUS AND WAFER CLEANING METHODCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/244231DESIGN METHOD FOR WAFER LAYOUT AND LITHOGRAPHY MACHINE  EXPOSURE SYSTEMCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/233156MANUFACTURING METHODS OF SEMICONDUCTOR STRUCTURE AND MEMORY,  AND SEMICONDUCTOR STRUCTURECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/233269SEMICONDUCTOR DEVICE HOLES, SEMICONDUCTOR DEVICE PREPARATION  METHOD, AND SEMICONDUCTOR DEVICECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/233333SEMICONDUCTOR ENCAPSULATION STRUCTURE AND ENCAPSULATION METHOD  THEREOFDONGGUAN IC CARRIER TECHNOLOGY CO., LTD.
WO/2021/244305METHOD FOR FORMING AIR SPACER LAYER, AND SEMICONDUCTOR  STRUCTURECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/249175AUXILIARY WAFER, PREPARATION METHOD THEREFOR AND SEMICONDUCTOR  MANUFACTURING PROCESSCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/249179SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAMECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/254108SILICON DIOXIDE THIN FILM FORMING METHOD AND METAL GATE  FORMING METHODCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/249188DEVELOPING DEVICE AND DEVELOPING METHODCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/249194SEMICONDUCTOR ETCHING DEVICECHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/249224METHOD FOR REMOVING BARRIER LAYERACM RESEARCH (SHANGHAI) , INC.
WO/2021/254136SEMICONDUCTOR DEVICE ADJUSTMENT METHOD AND SEMICONDUCTOR  DEVICE PREPARATION METHODCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/254150DISPLAY SUBSTRATE AND MANUFACTURING METHOD THEREFOR, AND  DISPLAY DEVICEBOE TECHNOLOGY GROUP CO., LTD.
WO/2021/249262NANOSHEET GATED DIODEINTERNATIONAL BUSINESS MACHINES CORPORATION
WO/2021/254204CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREFORCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/259120AUTOMATIC OPERATION METHOD AND SYSTEM FOR LASER PLATFORMCHANGXIN MEMORY TECHNOLOGIES, INC.
WO/2021/110220METHOD FOR TREATING A SEMICONDUCTOR WAFERHANWHA Q CELLS GMBH
WO/2021/228298COMPOSITE STRUCTURE WITH AT LEAST ONE ELECTRONIC COMPONENT AND  METHOD FOR PRODUCING SUCH A COMPOSITE STRUCTURELPKF LASER & ELECTRONICS AKTIENGESELLSCHAFT
WO/2021/185413HOLDING DEVICE FOR WAFERS, PECVD DEPOSITION DEVICE AND USE OF  THE HOLDING DEVICEHANWHA Q CELLS GMBH
WO/2021/228323HOLDING DEVICE, AND USE OF THE HOLDING DEVICEHANWHA Q CELLS GMBH
WO/2021/013332ADHESIVE TRANSFER STAMP AND METHOD FOR TRANSFERRING A  SEMICONDUCTOR CHIP USING AN ADHESIVE TRANSFER STAMPOSRAM OPTO SEMICONDUCTORS GMBH
WO/2021/013358SYSTEM AND METHOD TO EVAPORATE AN OLED LAYER STACK IN A  VERTICAL ORIENTATIONAPPLIED MATERIALS, INC.
WO/2021/013359SYSTEM AND METHOD TO EVAPORATE AN OLED LAYER STACK IN A  VERTICAL ORIENTATIONAPPLIED MATERIALS, INC.
WO/2021/028043PATH SWITCH ASSEMBLY, CHAMBER AND SUBSTRATE PROCESSING SYSTEM  HAVING THE SAME, AND METHODS THEREFORAPPLIED MATERIALS, INC.
WO/2021/037328METHOD AND DEVICE FOR ALIGNING SUBSTRATESEV GROUP E. THALLNER GMBH
WO/2021/052559METHOD OF FABRICATING A LATTICE STRUCTUREMICROSOFT TECHNOLOGY LICENSING LLC
WO/2021/089173DEVICE AND METHOD FOR CONNECTING SUBSTRATESEV GROUP E. THALLNER GMBH
WO/2021/104622MAGNETIC LEVITATION SYSTEM, PROCESSING SYSTEM, AND METHOD OF  TRANSPORTING A CARRIERAPPLIED MATERIALS, INC.
WO/2021/110238DEVICE AND METHOD FOR HEATING A SUBSTRATEEV GROUP E. THALLNER GMBH
WO/2021/115574METHOD AND DEVICE FOR ALIGNING SUBSTRATESEV GROUP E. THALLNER GMBH
WO/2021/164855METHOD AND DEVICE FOR TRANSFERRING COMPONENTSEV GROUP E. THALLNER GMBH
WO/2021/170240SUPPORT DEVICE FOR SUPPORTING A SUBSTRATE, METHOD OF  PROCESSING A SUBSTRATE AND SEMICONDUCTOR SUBSTRATEAPPLIED MATERIALS ITALIA S.R.L
WO/2021/170251SHADOW WALLS FOR USE IN FABRICATING DEVICESMICROSOFT TECHNOLOGY LICENSING LLC
WO/2021/001066SEMICONDUCTOR STRUCTURE COMPRISING AN UNDERGROUND POROUS  LAYER, FOR RF APPLICATIONSSOITEC
WO/2021/008742METHOD FOR MANUFACTURING A STRUCTURE COMPRISING A THIN LAYER  TRANSFERRED ONTO A SUPPORT PROVIDED WITH A CHARGE-TRAPPING LAYERSOITEC
WO/2021/197586CARRIER TRANSPORTATION APPARATUS, CARRIER TRANSPORT SYSTEM,  PROCESSING SYSTEM AND METHOD OF TRANSPORTING A CARRIERAPPLIED MATERIALS, INC.
WO/2021/223843APPARATUSES AND METHODS FOR TRANSPORTING A DEVICE IN A VACUUM  PROCESSING SYSTEMAPPLIED MATERIALS, INC.
WO/2021/013401METHOD AND COOLING BODY ARRANGEMENT FOR COOLING SEMIDCONDUCTOR  CHIPS HAVING INTEGRATED ELECTRONIC CIRCUITS FOR POWER ELECTRONIC APPLICATIONSSIEMENS AKTIENGESELLSCHAFT
WO/2021/239253METHOD FOR BONDING AND DEBONDING SUBSTRATESTHALLNER, Erich
WO/2021/018461INSTALLING AN ELECTRONIC ASSEMBLYSIEMENS AKTIENGESELLSCHAFT
WO/2021/018466SYSTEM AND METHOD FOR FORMING SOLDER BUMPSINTERNATIONAL BUSINESS MACHINES CORPORATION
WO/2021/254618METHOD OF FORMING ASYMMETRIC THICKNESS OXIDE TRENCHESDYNEX SEMICONDUCTOR LIMITED
WO/2021/259479SEMICONDUCTOR DEVICE, SEMICONDUCTOR DIE, AND METHOD OF  MANUFACTURING A SEMICONDUCTOR DEVICEHUAWEI TECHNOLOGIES CO., LTD.
WO/2021/037418DETECTING PROCESS PARAMETERS OF AN ASSEMBLY LINESIEMENS AKTIENGESELLSCHAFT
WO/2021/004832SYSTEM AND METHOD FOR SPATIALLY CONTROLLING AN AMOUNT OF  ENERGY DELIVERED TO A PROCESSED SURFACE OF A SUBSTRATELASER SYSTEMS & SOLUTIONS OF EUROPE
WO/2021/001363LITHOGRAPHY PRODUCTION METHODCENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
WO/2021/001537OPEN WEB ELECTRICAL SUPPORT FOR CONTACT PAD AND METHOD OF  MANUFACTUREHYPERTAC S.P.A.
WO/2021/005024METHOD FOR PRODUCING A COOLING ELEMENT, AND COOLING ELEMENT  PRODUCED USING SUCH A METHODROGERS GERMANY GMBH
WO/2021/005093SUBSTRATE CONVEYING DEVICE AND METHOD FOR CONVEYING A  SUBSTRATENICE SOLAR ENERGY GMBH
WO/2021/018568METHOD FOR PRODUCING SEALED FUNCTIONAL ELEMENTSHORST SIEDLE GMBH & CO. KG
WO/2021/013702METHOD AND DEVICE FOR THERMOCOMPRESSION WIRE BONDING BY MEANS  OF A THERMODEMüHLBAUER GMBH & CO. KG
WO/2021/009325NANOWIRE DEVICECRAYONANO AS
WO/2021/013819METHOD FOR OPEN-LOOP OR CLOSED-LOOP CONTROL OF THE TEMPERATURE  OF A CHUCK FOR A WAFER, TEMPERATURE ADJUSTMENT DEVICE, AND WAFER TESTING  SYSTEMATT ADVANCED TEMPERATURE TEST SYSTEMS GMBH
WO/2021/018713METHOD FOR THERMALLY SPRAYING CONDUCTOR PATHS, AND ELECTRONIC  MODULESIEMENS AKTIENGESELLSCHAFT
WO/2021/018714METHOD FOR PRODUCING A CONDUCTOR TRACK BY THERMAL SPRAYING,  METHOD FOR PRODUCING AN ELECTRONIC MODULE, AND ELECTRONIC MODULESIEMENS AKTIENGESELLSCHAFT
WO/2021/028214SYSTEM AND METHOD FOR FABRICATING PHOTONIC DEVICE ELEMENTSPAUL SCHERRER INSTITUT
WO/2021/023591BONDING TOOL, BONDING DEVICE AND BONDING METHODASM AMICRA MICROTECHNOLOGIES GMBH
WO/2021/019018SUBSTRATE HANDLING DEVICE FOR A WAFERSEMSYSCO GMBH
WO/2021/073794METHOD FOR PRODUCING A PROTECTIVE COVERING FOR ELECTRONIC  COMPONENTS ARRANGED ON A SUPPORTING SUBSTRATE, AND APPARATUS FOR CARRYING OUT  THE METHODROBERT BOSCH GMBH
WO/2021/037670SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING  SEMICONDUCTOR APPARATUS, AND MICROELECTRONIC DEVICE PACKAGEROBERT BOSCH GMBH
WO/2021/052745COMPONENT HANDLING DEVICE WITH COMPONENT INSPECTING DEVICEMUEHLBAUER GMBH & CO. KG
WO/2021/052756COMPONENT HANDLING COMPRISING COMPONENT INSPECTIONMUEHLBAUER GMBH & CO. KG
WO/2021/052758METHOD OF FORMING A COHESIVE CONNECTION BETWEEN A  SEMICONDUCTOR WITH AN ALUMINIUM COATED CONTACT SURFACE AND A SHAPED METAL  BODY, AS WELL AS A SEMICONDUCTOR MODULE COMPRISING AND A SHAPED METAL BODY  COHESIVELY ATTACHED TO A SEMICONDUCTORDANFOSS SILICON POWER GMBH
WO/2021/043855SEMIFINISHED PRODUCT FOR POPULATING WITH COMPONENTS, METHOD  FOR POPULATING SAME WITH COMPONENTS, AND USE OF THE SEMIFINISHED PRODUCTSIEMENS AKTIENGESELLSCHAFT
WO/2021/244769TUNABLE STRESS COMPENSATION IN LAYERED STRUCTURESIQE PLC
WO/2021/052917HOMOGENISATION DEVICESEMCO SMARTECH FRANCE
WO/2021/058605COMPOSITION OF MATTERCRAYONANO AS
WO/2021/069328SYSTEM AND METHOD FOR CONNECTING ELECTRONIC ASSEMBLIESPINK GMBH THERMOSYSTEME
WO/2021/069388INTERBONDED COMPONENTS, METHOD FOR DETACHING COMPONENTS FROM  INTERBONDED COMPONENTS, AND METHOD FOR PRODUCING INTERBONDED COMPONENTSOSRAM OPTO SEMICONDUCTORS GMBH
WO/2021/069459CONTACT ASSEMBLY FOR AN ELECTRONIC COMPONENT, AND METHOD FOR  PRODUCING AN ELECTRONIC COMPONENTVITESCO TECHNOLOGIES GMBH
WO/2021/074270ADJUSTMENT DEVICE FOR A VACUUM AREA WITH PRESSURE MEASURING  FUNCTIONALITYVAT HOLDING AG
WO/2021/094052METHOD AND CARRIER ELEMENT FOR PRODUCING A WAFER LAYERNEXWAFE GMBH
WO/2021/078940METHOD OF PRODUCING A SEMICONDUCTOR BODY WITH A TRENCH,  SEMICONDUCTOR BODY WITH AT LEAST ONE TRENCH AND SEMICONDUCTOR DEVICEAMS AG
WO/2021/083971MAGAZINE SYSTEMASYS AUTOMATISIERUNGSSYSTEME GMBH
WO/2021/094176METHODS OF MANUFACTURING SEMICONDUCTOR DEVICESPAUL SCHERRER INSTITUT
WO/2021/110348METHOD FOR FORMING AN ELECTRICAL CONTACT AND METHOD FOR  FORMING A SEMICONDUCTOR DEVICEROBERT BOSCH GMBH
WO/2021/089735LOADING AND UNLOADING DEVICE FOR A SUBSTRATE HOPPER, SUBSTRATE  HOPPER SYSTEMASYS AUTOMATISIERUNGSSYSTEME GMBH
WO/2021/121769RELEASE ELEMENT AND METHOD FOR RELEASING A SEMICONDUCTOR LAYER  FROM A SUBSTRATEFRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN  FORSCHUNG E. V.
WO/2021/099403METHOD FOR MONITORING, DETERMINING THE POSITION OF, AND  POSITIONING A PIN-LIFTING SYSTEMVAT HOLDING AG
WO/2021/105119PERMANENT WAFER HANDLERS WITH THROUGH SILICON VIAS FOR  THERMALIZATION AND QUBIT MODIFICATIONINTERNATIONAL BUSINESS MACHINES CORPORATION
WO/2021/110513METHOD FOR FORMING A HIGH RESISTIVITY HANDLE SUPPORT FOR A  COMPOSITE SUBSTRATESOITEC
WO/2021/105343VAN DER WAALS HETEROSTRUCTURESUNIVERSITY OF EXETER
WO/2021/121901IMPROVED DEVICE FOR DRYING SEMICONDUCTOR SUBSTRATESSILTRONIC AG
WO/2021/121902IMPROVED DEVICE FOR DRYING SEMICONDUCTOR SUBSTRATESSILTRONIC AG
WO/2021/121903IMPROVED DEVICE FOR DRYING SEMICONDUCTOR SUBSTRATESSILTRONIC AG
WO/2021/110631APPARATUS AND METHOD FOR PROCESSING AT LEAST ONE SEMICONDUCTOR  SUBSTRATEROBERT BOSCH GMBH
WO/2021/121949MODULE FOR CHEMICALLY PROCESSING A SUBSTRATESEMSYSCO GMBH
WO/2021/130045PACKAGING OF THREE-DIMENSIONAL INTEGRATED CIRCUIT BY  ENCAPSULATION WITH COPPER POSTS AND DOUBLE SIDED REDISTRIBUTION LAYERROCKLEY PHOTONICS LIMITED
WO/2021/122654CORE MODULE FOR SEMICONDUCTOR PRODUCTION FACILITY MACHINERYBROOKS AUTOMATION (GERMANY) GMBH
WO/2021/122682MASSIVE PARALLEL ASSEMBLY METHODHUAWEI TECHNOLOGIES DUESSELDORF GMBH
WO/2021/139977SUBSTRATE RECEIVING AREA FOR PROCESS CHAMBERSCEMECON AG
WO/2021/122909METHOD FOR BONDING CHIPS TO A SUBSTRATE BY DIRECT BONDINGCOMMISSARIAT à L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
WO/2021/122987INTEGRATED CIRCUIT PACKAGES TO MINIMIZE STRESS ON A  SEMICONDUCTOR DIEANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY
WO/2021/130136LASER TREATMENT DEVICE AND LASER TREATMENT METHODALEDIA
WO/2021/148281MOUNTING METHOD FOR AN INTEGRATED SEMICONDUCTOR WAFER DEVICE,  AND MOUNTING DEVICELPKF LASER & ELECTRONICS AG
WO/2021/170308METHOD FOR PRODUCING A POWER MODULE UNITSIEMENS AKTIENGESELLSCHAFT
WO/2021/151684METHOD OF MANUFACTURING AND PASSIVATING A DIETDK ELECTRONICS AG
WO/2021/148438SENSOR CASING AND METHOD FOR POTTING AN OPEN RECEIVING SPACE  OF A SENSOR CASINGROBERT BOSCH GMBH
WO/2021/160391MOULD DEVICEROBERT BOSCH GMBH
WO/2021/164987METHOD FOR PRODUCING A COOLING ELEMENT, AND COOLING ELEMENT  PRODUCED USING SUCH A METHODROGERS GERMANY GMBH
WO/2021/152020PROCESSING A WAFER OF A SEMICONDUCTOR MATERIALSMART PHOTONICS HOLDING B.V.
WO/2021/156422SEMICONDUCTOR STRUCTURE FOR A SEMICONDUCTOR COMPONENT AND  METHOD FOR PRODUCING SUCH A SEMICONDUCTOR STRUCTUREFRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN  FORSCHUNG E. V.
WO/2021/170373APPARATUS FOR PROCESSING A WAFERLAM RESEARCH AG
WO/2021/160664METHOD FOR PRODUCING ALUMINUM GALLIUM NITRIDE (ALGAN)  NANOSTRUCTURESCENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE
WO/2021/160728A MONOLITHIC MICROWAVE INTEGRATED CIRCUIT FRONT-END MODULEEPINOVATECH AB
WO/2021/180435PROCESS FOR MANUFACTURING AN ELECTRONIC DEVICE WITH A  SENSITIVE AREA AND ELECTRONIC DEVICE WITH A SENSITIVE AREASENSIRION AG
WO/2021/165308METHOD FOR TREATING SUBSTRATES WITH CHEMICALS4TEX GMBH
WO/2021/165450APPARATUS AND METHOD FOR TRANSFERRING ELECTRONIC COMPONENTS  FROM A FIRST TO A SECOND CARRIERMUEHLBAUER GMBH & CO. KG
WO/2021/204452CLAMPING DEVICE AND METHOD FOR SMOOTHING A CURVED SAMPLEFRT GMBH
WO/2021/197713WORKPIECE CARRIER AND MOLD FOR JOINING AN ELECTRIC CIRCUIT  CARRIERSIEMENS AKTIENGESELLSCHAFT
WO/2021/170739METHOD FOR PRODUCING A LAYER OF ALUMINIUM NITRIDE (ALN) ON A  STRUCTURE OF SILICON OR III-V MATERIALSCOMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
WO/2021/185554INSULATED GATE STRUCTURE, WIDE BANDGAP MATERIAL POWER DEVICE  WITH THE SAME AND MANUFACTURING METHOD THEREOFABB POWER GRIDS SWITZERLAND AG
WO/2021/213725METHOD FOR PRODUCING A MICROELECTRONIC DEVICEROBERT BOSCH GMBH
WO/2021/185850COUPON WAFER AND METHOD OF PREPARATION THEREOFROCKLEY PHOTONICS LIMITED
WO/2021/186031METHOD FOR PRODUCING AN OHMIC CONTACT ON A CYRSTALLOGRAPHIC  C-SIDE OF A SILICON CARBIDE SUBSTRATE, AND OHMIC CONTACTROBERT BOSCH GMBH
WO/2021/198009MONOLITHIC ELECTRONIC DEVICEPLESSEY SEMICONDUCTORS LIMITED
WO/2021/219381METHOD AND DEVICE FOR DEPOSITING AN EPITAXIAL LAYER ON A  SUBSTRATE WAFER MADE OF SEMICONDUCTOR MATERIALSILTRONIC AG
WO/2021/239321METHOD FOR WELDING AN ATTACHMENT PIECE TO A SEMICONDUCTOR  METALLISATION BY LASER WELDING, AND ELECTRONICS MODULESIEMENS AKTIENGESELLSCHAFT
WO/2021/214028P+ OR N+ TYPE DOPING PROCESS FOR SEMICONDUCTORSISTITUTO NAZIONALE DI FISICA NUCLEARE (INFN)
WO/2021/233627TEMPERATURE-CONTROL DEVICE, SYSTEM, AND METHOD FOR CONTROLLING  THE TEMPERATURE OF A PROBER TABLE FOR SEMICONDUCTOR WAFERS AND/OR HYBRIDSATT ADVANCED TEMPERATURE TEST SYSTEMS GMBH
WO/2021/259536METHOD FOR CONTACTING A POWER SEMICONDUCTOR WITH A SUBSTRATE,  AND POWER SEMICONDUCTOR MODULE HAVING A POWER SEMICONDUCTOR AND A SUBSTRATESIEMENS AKTIENGESELLSCHAFT
WO/2021/224265POWER MODULEDANFOSS SILICON POWER GMBH
WO/2021/239467USE OF A COMPOSITION CONSISTING OF AMMONIA AND AN ALKANOL FOR  AVOIDING PATTERN COLLAPSE WHEN TREATING PATTERNED MATERIALS WITH LINE-SPACE  DIMENSIONS OF 50 NM OR BELOWBASF SE
WO/2021/239472MICRO-COMPONENT WITH ANTI-STICTION STRUCTURES, AS WELL AS A  DISPENSING METHOD USING THE SAMEX-CELEPRINT LIMITED
WO/2021/239538METHOD FOR SIMULTANEOUSLY BONDING TO AND INSULATING A POWER  ELECTRONIC SEMICONDUCTOR COMPONENT ON AN ORGANIC AND/OR CERAMIC SUBSTRATE,  AND CORRESPONDING COMPOSITE UNITSIEMENS AKTIENGESELLSCHAFT
WO/2021/254714VACUUM TREATMENT APPARATUSEVATEC AG
WO/2021/244946FACILITY AND METHOD FOR DISTRIBUTING A GAS MIXTURE FOR DOPING  SILICON WAFERSAIR LIQUIDE ELECTRONICS SYSTEMS
WO/2021/239984METHOD OF ASSEMBLING A SEMICONDUCTOR COMPONENTDANFOSS SILICON POWER GMBH
WO/2021/245000INSTALLATION AND METHOD FOR DISTRIBUTING A GAS MIXTUREAIR LIQUIDE ELECTRONICS SYSTEMS
WO/2021/255039MICRO-ELECTRONIC DEVICE WITH INSULATED SUBSTRATE AND  ASSOCIATED MANUFACTURING METHODCOMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
WO/2021/255286METHOD FOR PRODUCING A LAYER ON ONLY CERTAIN SURFACES OF A  STRUCTURECOMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
WO/2021/260165MATERIAL DEPOSITION METHODLUXEMBOURG INSTITUTE OF SCIENCE AND TECHNOLOGY (LIST)
WO/2021/260189WAFER BOATS FOR SUPPORTING SEMICONDUCTOR WAFERS IN A FURNACEGLOBALWAFERS CO., LTD.
WO/2021/198559METHOD, SEMICONDUCTOR STRUCTURE, AND VACUUM PROCESSING SYSTEMTURUN YLIOPISTO
WO/2021/019137METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A  THIN LAYER OF MONOCRYSTALLINE SIC ON A CARRIER SUBSTRATE OF POLYCRYSTALLINE  SICSOITEC
WO/2021/009459PROCESS FOR HYDROPHILICALLY BONDING SUBSTRATESSOITEC
WO/2021/048507TREATMENT OF A THIN FILM BY HYDROGEN PLASMA AND POLARISATION  IN ORDER TO IMPROVE THE CRYSTALLINE QUALITY THEREOFCOMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
WO/2021/074540METHOD FOR DIRECTED SELF-ASSEMBLY LITHOGRAPHYARKEMA FRANCE
WO/2021/105575METHOD FOR PRODUCING A COMPOSITE STRUCTURE COMPRISING A THIN  LAYER OF MONOCRYSTALLINE SIC ON A CARRIER SUBSTRATE OF POLYCRYSTALLINE SICSOITEC
WO/2021/105576METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A  THIN LAYER OF MONOCRYSTALLINE SIC ON AN SIC CARRIER SUBSTRATESOITEC
WO/2021/094665TILTABLE AND ROTATABLE SUBSTRATE CARRIER AND MULTI-LAYER  VACUUM DEPOSITION SYSTEM COMPRISING SAMESAFRAN ELECTRONICS & DEFENSE
WO/2021/099713METHOD FOR MANUFACTURING A FUNCTIONAL CHIP SUITABLE FOR BEING  ASSEMBLED TO WIRE ELEMENTSPRIMO1D
WO/2021/105605METHOD FOR BONDING TWO SUBSTRATESSOITEC
WO/2021/111062METHOD FOR FORMING A HANDLING SUBSTRATE FOR A COMPOSITE  STRUCTURE INTENDED FOR RF APPLICATIONS AND HANDLING SUBSTRATESOITEC
WO/2021/123529METHOD FOR ETCHING SUBSTRATES COMPRISING A THIN SURFACE LAYER,  FOR IMPROVING THE UNIFORMITY OF THICKNESS OF SAID LAYERSOITEC
WO/2021/140285METHOD OF JOINING TWO SEMI-CONDUCTOR SUBSTRATESSOITEC
WO/2021/136894METHOD FOR PRODUCING A COMPOSITE STRUCTURE COMPRISING A THIN  MONOCRISTALLINE LAYER ON A CARRIER SUBSTRATESOITEC
WO/2021/140300METHOD FOR MANUFACTURING A SEMICONDUCTOR-ON-INSULATOR  STRUCTURE FOR RADIOFREQUENCY APPLICATIONSSOITEC
WO/2021/191511METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A  THIN LAYER MADE OF MONOCRYSTALLINE SIC ON A CARRIER SUBSTRATE MADE OF SICSOITEC
WO/2021/191512METHOD FOR MANUFACTURING A COMPOSITE STRUCTURE COMPRISING A  THIN LAYER MADE OF MONOCRYSTALLINE SIC ON A CARRIER SUBSTRATE MADE OF SICSOITEC
WO/2021/191513METHOD FOR PREPARING A THIN LAYERSOITEC
WO/2021/191527METHOD FOR PRODUCING A STACKED STRUCTURESOITEC
WO/2021/198576REMOVABLE STRUCTURE USED FOR THE TRANSFER OR MANIPULATION OF  LAYERS, AND METHOD FOR TRANSFER OF A LAYER USING SAID REMOVABLE STRUCTURESOITEC
WO/2021/250333DETACHABLE TEMPORARY SUBSTRATE COMPATIBLE WITH VERY HIGH  TEMPERATURES AND PROCESS FOR TRANSFERRING A WORKING LAYER FROM SAID SUBSTRATESOITEC
WO/2021/234277METHOD FOR MANUFACTURING A SEMICONDUCTOR-ON-INSULATOR  SUBSTRATE FOR RADIOFREQUENCY APPLICATIONSSOITEC
WO/2021/234280METHOD FOR MANUFACTURING A SEMICONDUCTOR-ON-INSULATOR  SUBSTRATE FOR RADIOFREQUENCY APPLICATIONSSOITEC
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WO/2021/181561MANUFACTURING METHOD FOR MOUNTING SUBSTRATE BY  THREE-DIMENSIONAL LAMINATE MOLDINGFUJI CORPORATION
WO/2021/181613PLASMA PROCESSING METHODHITACHI HIGH-TECH CORPORATION
WO/2021/181644SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFORMITSUBISHI ELECTRIC CORPORATION
WO/2021/181685SUBSTRATE PROCESSING DEVICE, HEATING DEVICE, AND METHOD FOR  MANUFACTURING SEMICONDUCTOR DEVICEKOKUSAI ELECTRIC CORPORATION
WO/2021/181697AL BONDING WIRENIPPON MICROMETAL CORPORATION
WO/2021/181700LASER ANNEAL DEVICE AND LASER ANNEAL METHODSAKAI DISPLAY PRODUCTS CORPORATION
WO/2021/186503SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
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WO/2021/038938SEMICONDUCTOR DEVICEDENSO CORPORATION
WO/2021/186651CURRENT-VOLTAGE CONVERSION DEVICENIPPON TELEGRAPH AND TELEPHONE CORPORATION
WO/2021/186652CURRENT-VOLTAGE CONVERSION DEVICENIPPON TELEGRAPH AND TELEPHONE CORPORATION
WO/2021/186653CURRENT-VOLTAGE CONVERSION DEVICENIPPON TELEGRAPH AND TELEPHONE CORPORATION
WO/2021/186666SUBSTRATE WORKING MACHINEFUJI CORPORATION
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WO/2021/192001VACUUM PROCESSING DEVICEHITACHI HIGH-TECH CORPORATION
WO/2021/192005SUBSTRATE PROCESSING DEVICE, SEMICONDUCTOR DEVICE PRODUCTION  METHOD, RECORDING MEDIUM AND INNER TUBEKOKUSAI ELECTRIC CORPORATION
WO/2021/192075METHOD FOR FORMING SEMICONDUCTOR LAYERNIPPON TELEGRAPH AND TELEPHONE CORPORATION
WO/2021/192090SUBSTRATE PROCESSING DEVICE, METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICE, RECORDING MEDIA, AND INNER TUBEKOKUSAI ELECTRIC CORPORATION
WO/2021/192121Al BONDING WIRENIPPON MICROMETAL CORPORATION
WO/2021/084778FILM-LIKE ADHESIVE, METHOD FOR EVALUATING EASE OF CUTTING OF  SAME, DICING/DIE-BONDING INTEGRATED FILM, METHOD FOR MANUFACTURING SAME, AND  SEMICONDUCTOR DEVICESHOWA DENKO MATERIALS CO., LTD.
WO/2021/024548SUBSTRATE PROCESSING APPARATUSEBARA CORPORATION
WO/2021/192207METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE  TREATMENT DEVICE, AND PROGRAMKOKUSAI ELECTRIC CORPORATION
WO/2021/192210METHOD FOR PRODUCING SEMICONDUCTORHITACHI HIGH-TECH CORPORATION
WO/2021/192265SEMICONDUCTOR INTEGRATED CIRCUIT DEVICESOCIONEXT INC.
WO/2021/199126METHOD FOR MEASURING CARBON CONCENTRATION OF SILICON SUBSTRATEMITSUBISHI ELECTRIC CORPORATION
WO/2021/199298CRYSTAL GROWTH CONDITION ANALYSIS METHOD, CRYSTAL GROWTH  CONDITION ANALYSIS SYSTEM, CRYSTAL GROWTH CONDITION ANALYSIS PROGRAM, AND  DATA STRUCTURE FOR CRYSTAL GROWTH DATANIPPON TELEGRAPH AND TELEPHONE CORPORATION
WO/2021/199420PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHODHITACHI HIGH-TECH CORPORATION
WO/2021/199426POLISHING METHOD, AND PRODUCTION METHOD FOR SEMICONDUCTOR  SUBSTRATEMITSUBISHI ELECTRIC CORPORATION
WO/2021/005852JOINED BODY OF JOINING BASE MATERIAL AND METAL LAYERWORLD METAL CO., LTD.
WO/2021/205517SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SEMICONDUCTOR  DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/205532BONDING WIRE AND METHOD FOR MANUFACTURING SAMENIPPON TELEGRAPH AND TELEPHONE CORPORATION
WO/2021/205632ETCHING METHODHITACHI HIGH-TECH CORPORATION
WO/2021/205643METHOD FOR MANUFACTURING NOZZLE SUBSTRATEKONICA MINOLTA, INC.
WO/2021/210047METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENTMITSUBISHI ELECTRIC CORPORATION
WO/2021/214854PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHODHITACHI HIGH-TECH CORPORATION
WO/2021/214866HETEROJUNCTION BIPOLAR TRANSISTOR AND METHOD FOR PRODUCING  SAMENIPPON TELEGRAPH AND TELEPHONE CORPORATION
WO/2021/214868PLASMA PROCESSING DEVICEHITACHI HIGH-TECH CORPORATION
WO/2021/214932SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAMENIPPON TELEGRAPH AND TELEPHONE CORPORATION
WO/2021/019855SEMICONDUCTOR ELEMENT MANUFACTURING METHOD AND SEMICONDUCTOR  ELEMENT MANUFACTURING SYSTEMFILNEX INC.
WO/2021/220329PLASMA TREATMENT DEVICEHITACHI HIGH-TECH CORPORATION
WO/2021/131097MICROWAVE PLASMA TREATMENT DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/229629SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAMENIPPON TELEGRAPH AND TELEPHONE CORPORATION
WO/2021/010004METHOD FOR FORMING INSULATION FILMTOKYO ELECTRON LIMITED
WO/2021/229734SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/229787PLASMA PROCESSING APPARATUS INSPECTION METHODHITACHI HIGH-TECH CORPORATION
WO/2021/234813METHOD FOR FABRICATING FIELD-EFFECT TRANSISTORNIPPON TELEGRAPH AND TELEPHONE CORPORATION
WO/2021/205674GOLD-COATED BONDING WIRE, MANUFACTURING METHOD THEREFOR,  SEMICONDUCTOR WIRE BONDING STRUCTURE, AND SEMICONDUCTOR DEVICETANAKA DENSHI KOGYO K.K.
WO/2021/234928TRANSPORT DEVICE, TRANSPORT METHOD, AND TRANSPORT SYSTEMKABUSHIKI KAISHA YASKAWA DENKI
WO/2021/240572SEMICONDUCTOR APPARATUS MANUFACTURING SYSTEM AND SEMICONDUCTOR  APPARATUS MANUFACTURING METHODHITACHI HIGH-TECH CORPORATION
WO/2021/033386TEMPERATURE MEASUREMENT DEVICE, TEMPERATURE MEASUREMENT  METHOD, AND PROGRAM FOR TEMPERATURE MEASUREMENT DEVICEHORIBA STEC, CO., LTD.
WO/2021/019882SEMICONDUCTOR DEVICEFUJI ELECTRIC CO., LTD.
WO/2021/240598SUBSTRATE HOLDING DEVICE AND SUBSTRATE PROCESSING DEVICEHITACHI HIGH-TECH CORPORATION
WO/2021/053885SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHODSCREEN HOLDINGS CO., LTD.
WO/2021/240603SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/019886INDIUM PHOSPHIDE SUBSTRATE AND METHOD FOR PRODUCING INDIUM  PHOSPHIDE SUBSTRATEJX NIPPON MINING & METALS CORPORATION
WO/2021/019887INDIUM PHOSPHIDE SUBSTRATE AND METHOD FOR MANUFACTURING INDIUM  PHOSPHIDE SUBSTRATEJX NIPPON MINING & METALS CORPORATION
WO/2021/019888SILICON CARBIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD  OF SILICON CARBIDE SEMICONDUCTOR DEVICEFUJI ELECTRIC CO., LTD.
WO/2021/240748SEMICONDUCTOR DEVICE, METHOD FOR PRODUCING SAME, AND ELECTRIC  POWER CONVERTERMITSUBISHI ELECTRIC CORPORATION
WO/2021/245724COMPOSITE SUBSTRATE, METHOD FOR PRODUCING COMPOSITE SUBSTRATE,  SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/245741METHOD FOR EVALUATING OUTER PERIPHERAL DISTORTION OF WAFERSHIN-ETSU HANDOTAI CO., LTD.
WO/2021/014772SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHODSCREEN HOLDINGS CO., LTD.
WO/2021/044682SEMICONDUCTOR SUBSTRATE EVALUATING METHODSHIN-ETSU HANDOTAI CO., LTD.
WO/2021/002141SUCTION DEVICE AND VACUUM PROCESS DEVICEULVAC, INC.
WO/2021/245893SEMICONDUCTOR DEVICETOHOKU UNIVERSITY
WO/2021/250782DISPLAY DEVICE AND METHOD FOR PRODUCING DISPLAY DEVICESHARP KABUSHIKI KAISHA
WO/2021/065086MAINTENANCE APPARATUS, MAINTENANCE METHOD, AND MAINTENANCE  PROGRAMADVANTEST CORPORATION
WO/2021/152879SEMICONDUCTOR DEVICE AND ETCHING METHODSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/255812PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHODHITACHI HIGH-TECH CORPORATION
WO/2021/255842SEMICONDUCTOR WAFERNIPPON TELEGRAPH AND TELEPHONE CORPORATION
WO/2021/044705SOURCE/DRAIN ELECTRODE FOR ORGANIC SEMICONDUCTOR DEVICE,  ORGANIC SEMICONDUCTOR DEVICE USING SAME, AND PRODUCTION METHOD FOR  SOURCE/DRAIN ELECTRODE AND SEMICONDUCTOR DEVICETHE UNIVERSITY OF TOKYO
WO/2021/053906SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAMEHITACHI, LTD.
WO/2021/049127LASER PROCESSING DEVICE AND LASER LIGHT MONITORING METHODTHE JAPAN STEEL WORKS, LTD.
WO/2021/039073FLUID SUPPLY SYSTEMFUJIKIN INCORPORATED
WO/2021/260833METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICENIPPON TELEGRAPH AND TELEPHONE CORPORATION
WO/2021/260869VACUUM PROCESS METHODHITACHI HIGH-TECH CORPORATION
WO/2021/024638CLAMPING TOOL AND CLEANING DEVICEKYOCERA CORPORATION
WO/2021/033427CLEANING METHOD OF HEATING MEMBER AND SUBSTRATE PROCESSING  APPARATUSSCREEN HOLDINGS CO., LTD.
WO/2021/039089SEMICONDUCTOR ELEMENT FORMING METHOD AND SUBSTRATE PROCESSING  DEVICESCREEN HOLDINGS CO., LTD.
WO/2021/006091SEPARATOR AND SEPARATION METHODTOKYO ELECTRON LIMITED
WO/2021/006092SEPARATING DEVICE AND SEPARATING METHODTOKYO ELECTRON LIMITED
WO/2021/024648ELECTRON BEAM INSPECTION DEVICE AND ELECTRON BEAM INSPECTION  METHODNUFLARE TECHNOLOGY, INC.
WO/2021/002367SUBSTRATE TREATMENT SYSTEM AND TREATMENT SOLUTION PREPARATION  METHODTOKYO ELECTRON LIMITED
WO/2021/020008SUBSTRATE TREATMENT DEVICE, METHOD OF PRODUCING SEMICONDUCTOR  DEVICE, PROGRAM, AND GAS SUPPLY SYSTEMKOKUSAI ELECTRIC CORPORATION
WO/2021/024654SUBSTRATE FOR ELECTRONIC DEVICE AND PRODUCTION METHOD THEREFORSHIN-ETSU HANDOTAI CO., LTD.
WO/2021/024659SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHODTOKYO ELECTRON LIMITED
WO/2021/024671EPITAXIAL SUBSTRATE AND PRODUCTION METHOD THEREFORSUMITOMO CHEMICAL COMPANY, LIMITED
WO/2021/049142SOLID-STATE IMAGE-CAPTURING DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/020040METHOD FOR MANUFACTURING STRUCTURE, AND STRUCTURESCIOCS COMPANY LIMITED
WO/2021/020041METHOD FOR PRODUCING STRUCTURAL BODYSCIOCS COMPANY LIMITED
WO/2021/044724METHOD AND DEVICE FOR MANUFACTURING STRUCTURESCIOCS COMPANY LIMITED
WO/2021/010237OXIDE SEMICONDUCTOR FILM AND SEMICONDUCTOR DEVICEFLOSFIA INC.
WO/2021/039148HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUSSCREEN HOLDINGS CO., LTD.
WO/2021/039153BOARD ACCOMMODATION CONTAINERSHIN-ETSU POLYMER CO.,LTD.
WO/2021/015028JOINING DEVICE AND JOINING METHODTOKYO ELECTRON LIMITED
WO/2021/015030SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSTOKYO ELECTRON LIMITED
WO/2021/020084SEMICONDUCTOR DEVICETOKYO ELECTRON LIMITED
WO/2021/033460SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING DEVICEEBARA CORPORATION
WO/2021/010380SEMICONDUCTOR CHIP AND METHODS FOR MANUFACTURING SEMICONDUCTOR  CHIPSUMITOMO ELECTRIC INDUSTRIES, LTD.
WO/2021/010382METHOD FOR MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE  AND SILICON CARBIDE SEMICONDUCTOR DEVICESUMITOMO ELECTRIC INDUSTRIES, LTD.
WO/2021/015045SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHODTOKYO ELECTRON LIMITED
WO/2021/029174WIRE BONDING DEVICESHINKAWA LTD.
WO/2021/033461SUBSTRATE TREATMENT DEVICE, PRODUCTION METHOD FOR  SEMICONDUCTOR DEVICE, PROGRAM, AND RECORDING MEDIUMKOKUSAI ELECTRIC CORPORATION
WO/2021/010405METHOD FOR PRODUCING SILICON CARBIDE SEMICONDUCTOR DEVICE, AND  SILICON CARBIDE SEMICONDUCTOR DEVICESUMITOMO ELECTRIC INDUSTRIES, LTD.
WO/2021/020124MOUNTING DEVICESHINKAWA LTD.
WO/2021/020136SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHODTOKYO ELECTRON LIMITED
WO/2021/029183SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE AND ELECTRONIC  MACHINESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/015142SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE, AND  WIRING PATTERN FORMING SYSTEMTOKYO ELECTRON LIMITED
WO/2021/020213SOLDER-ATTACHED PRODUCT MANUFACTURING DEVICE, AND  SOLDER-ATTACHED PRODUCT MANUFACTURING METHODORIGIN COMPANY, LIMITED
WO/2021/039218METHOD AND DEVICE FOR SUBSTRATE PROCESSINGTOKYO ELECTRON LIMITED
WO/2021/024810SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR  MANUFACTURING SAMESUMITOMO ELECTRIC INDUSTRIES, LTD.
WO/2021/015286MANUFACTURING METHOD FOR ELECTRONIC DEVICE, MANUFACTURING  METHOD FOR MICRONEEDLE, AND MICRONEEDLETHINK-LANDS CO., LTD.
WO/2021/020322TRENCH CAPACITORTAIYO YUDEN CO., LTD.
WO/2021/090542TRANSPORT VEHICLE SYSTEMMURATA MACHINERY, LTD.
WO/2021/024844STAGE AND METHOD FOR CONTROLLING TEMPERATURE OF SUBSTRATENHK SPRING CO., LTD.
WO/2021/020460SUBSTRATE STORAGE CONTAINER AND FILTER UNITMIRAIAL CO., LTD.
WO/2021/020502GAS NOZZLE AND PLASMA PROCESSING DEVICE USING SAMEKYOCERA CORPORATION
WO/2021/039270DEVICE FOR PRODUCING AND METHOD FOR PRODUCING SEMICONDUCTOR  DEVICEKOKUSAI ELECTRIC CORPORATION
WO/2021/039271SEMICONDUCTOR DEVICE FABRICATION METHOD AND FABRICATION  APPARATUSKOKUSAI ELECTRIC CORPORATION
WO/2021/024972SILICON CARBIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD  THEREOFSUMITOMO ELECTRIC INDUSTRIES, LTD.
WO/2021/029285SEMICONDUCTOR DEVICEFUJI ELECTRIC CO., LTD.
WO/2021/044791WAFER DELIVERY DEVICE, WAFER STORAGE CONTAINER, AND WAFER  STORAGE SYSTEMMURATA MACHINERY, LTD.
WO/2021/025044EPITAXIAL SUBSTRATESUMITOMO CHEMICAL COMPANY, LIMITED
WO/2021/053987METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SUBSTRATE  PROCESSING APPARATUS, AND PROGRAMKOKUSAI ELECTRIC CORPORATION
WO/2021/065203HEATING/COOLING DEVICE AND HEATING/COOLING METHODTOKYO ELECTRON LIMITED
WO/2021/033568CLEANING METHOD AND SUBSTRATE PROCESSING APPARATUSTOKYO ELECTRON LIMITED
WO/2021/033572METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR  DEVICE AND PRODUCTION SYSTEMTOKYO ELECTRON LIMITED
WO/2021/039357SUBSTRATE PROCESSING METHODSCREEN HOLDINGS CO., LTD.
WO/2021/044805SUBSTRATE STORAGE CONTAINERSHIN-ETSU POLYMER CO.,LTD.
WO/2021/039365LASER ANNEALING DEVICE AND METHOD FOR FORMING CRYSTALLIZED  FILMV TECHNOLOGY CO., LTD.
WO/2021/033588SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHODTOKYO ELECTRON LIMITED
WO/2021/070469NITRIDE SEMICONDUCTOR DEVICEPANASONIC CORPORATION
WO/2021/039389INFORMATION PROCESSING DEVICE AND SUBSTRATE PROCESSING METHODTOKYO ELECTRON LIMITED
WO/2021/039405BONDING DEVICE, BONDING SYSTEM, AND BONDING METHODTOKYO ELECTRON LIMITED
WO/2021/065216SEMICONDUCTOR ELEMENT, NON-VOLATILE STORAGE DEVICE,  PRODUCT-SUM OPERATION DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR  ELEMENTSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/149286METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/039449SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHODTOKYO ELECTRON LIMITED
WO/2021/140697APPARATUS FOR CLEANING SEMICONDUCTOR WAFER AND METHOD FOR  CLEANING SEMICONDUCTOR WAFERSUMCO CORPORATION
WO/2021/054021SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS,  AND SUBSTRATE PROCESSING LIQUIDSCREEN HOLDINGS CO., LTD.
WO/2021/039631SEMICONDUCTOR DEVICEPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
WO/2021/044882FILM FORMATION METHODTOKYO ELECTRON LIMITED
WO/2021/049283HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUSSCREEN HOLDINGS CO., LTD.
WO/2021/049306FILM FORMING METHOD, FILM FORMING DEVICE, AND FILM FORMING  SYSTEMTOKYO ELECTRON LIMITED
WO/2021/039898INSPECTION JIG AND INSPECTION DEVICENIDEC-READ CORPORATION
WO/2021/049313SEMICONDUCTOR SAMPLE INSPECTION DEVICE AND INSPECTION METHODHAMAMATSU PHOTONICS K.K.
WO/2021/075162SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SAMEFUJI ELECTRIC CO.,LTD.
WO/2021/049330PROCESSING LIQUID, PROCESSING METHODFUJIFILM CORPORATION
WO/2021/049336TEST SYSTEMTOKYO ELECTRON LIMITED
WO/2021/192352METHOD FOR PRODUCING SEMICONDUCTOR DEVICEHITACHI HIGH-TECH CORPORATION
WO/2021/049368SUBSTRATE PROCESSING DEVICE AND METHOD FOR CONCTROLLING  SUBSTRATE PROCESSING DEVICETOKYO ELECTRON LIMITED
WO/2021/079624DRY ETCHING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE,  AND ETCHING DEVICECENTRAL GLASS COMPANY, LIMITED
WO/2021/059900DICING SYSTEM AND DICING METHODPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
WO/2021/045069LOAD LOCK DEVICECANON ANELVA CORPORATION
WO/2021/045070LOAD LOCK DEVICECANON ANELVA CORPORATION
WO/2021/054135VAPORIZED FEED DEVICEFUJIKIN INCORPORATED
WO/2021/045157METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND COLLETSHOWA DENKO MATERIALS CO., LTD.
WO/2021/049442SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHODTOKYO ELECTRON LIMITED
WO/2021/054158SEMICONDUCTOR DEVICE PRODUCTION METHODTOKYO ELECTRON LIMITED
WO/2021/106304JIGYOKOWO CO., LTD.
WO/2021/054185INSPECTION SYSTEM AND INSPECTION METHODTOKYO ELECTRON LIMITED
WO/2021/049499SEMICONDUCTOR DEVICE AND MANUFACTURING METHODFUJI ELECTRIC CO., LTD.
WO/2021/065393IMPRINTING MOLD, IMPRINTING METHOD, AND METHOD FOR  MANUFACTURING ARTICLECANON KABUSHIKI KAISHA
WO/2021/054227METHOD FOR FORMING METAL OXIDE FILM AND FILM-FORMING DEVICETOKYO ELECTRON LIMITED
WO/2021/054230METHOD FOR FORMING METAL OXIDE FILM AND FILM FORMATION  APPARATUSTOKYO ELECTRON LIMITED
WO/2021/084933INSPECTION DEVICE, METHOD, AND PROGRAMALITECS CORPORATION
WO/2021/054260VACUUM TRANSFER DEVICE AND METHOD FOR CONTROLLING VACUUM  TRANSFER DEVICETOKYO ELECTRON LIMITED
WO/2021/054265JOINING DEVICE AND JOINING METHODTOKYO ELECTRON LIMITED
WO/2021/065428HYDROFLUOROETHER-CONTAINING SOLVENT AND METHOD FOR TREATING  SUBSTRATE USING HYDROFLUOROETHER-CONTAINING SOLVENTCENTRAL GLASS COMPANY, LIMITED
WO/2021/084939SEMICONDUCTOR WAFER EVALUATION METHOD, SEMICONDUCTOR WAFER  SORTING METHOD, AND DEVICE MANUFACTURING METHODSHIN-ETSU HANDOTAI CO., LTD.
WO/2021/060036PROCESSING LIQUID NOZZLE AND CLEANING DEVICETOKYO ELECTRON LIMITED
WO/2021/060037SUBSTRATE LIQUID TREATMENT METHOD AND SUBSTRATE LIQUID  TREATMENT DEVICETOKYO ELECTRON LIMITED
WO/2021/181730DILUTE CHEMICAL SUPPLY DEVICEKURITA WATER INDUSTRIES LTD.
WO/2021/060084RAW MATERIAL SUPPLY APPARATUS AND RAW MATERIAL SUPPLY METHODTOKYO ELECTRON LIMITED
WO/2021/060092FILM FORMING METHOD AND FILM FORMING APPARATUSTOKYO ELECTRON LIMITED
WO/2021/070584SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICEFUJI ELECTRIC CO., LTD.
WO/2021/060109FILM FORMATION METHODTOKYO ELECTRON LIMITED
WO/2021/060110FILM-FORMING METHODTOKYO ELECTRON LIMITED
WO/2021/060111FILM-FORMING METHODTOKYO ELECTRON LIMITED
WO/2021/079659ELECTRICALLY CONDUCTIVE PILLAR, BONDING STRUCTURE, ELECTRONIC  EQUIPMENT, AND METHOD FOR MANUFACTURING ELECTRICALLY CONDUCTIVE PILLARDIC CORPORATION
WO/2021/060140SUBSTRATE PROCESSING DEVICE, MANUFACTURING METHOD OF  SEMICONDUCTOR DEVICE, AND PROGRAMKOKUSAI ELECTRIC CORPORATION
WO/2021/084959IMAGING DEVICE AND ELECTRONIC DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/070599METHOD AND DEVICE FOR MANUFACTURING GLASS PLATE PACKAGENIPPON ELECTRIC GLASS CO., LTD.
WO/2021/065590SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF  MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICESOCIONEXT INC.
WO/2021/131186CONVEYANCE SYSTEMSINFONIA TECHNOLOGY CO., LTD.
WO/2021/060259TRANSPORT SYSTEMSINFONIA TECHNOLOGY CO., LTD.
WO/2021/070624BONDING DEVICE AND BONDING METHODTOKYO ELECTRON LIMITED
WO/2021/095374SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR  DEVICE, AND IMAGE-CAPTURING DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/070661BONDING SYSTEM AND METHOD FOR INSPECTING MULTILAYER SUBSTRATETOKYO ELECTRON LIMITED
WO/2021/065803METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT, AND  SEMICONDUCTOR DEVICEKYOCERA CORPORATION
WO/2021/065843MAINTENANCE APPARATUS, MAINTENANCE METHOD, AND MAINTENANCE  PROGRAMADVANTEST CORPORATION
WO/2021/065897HOLDING TOOL AND MANUFACTURING METHODFUDOW COMPANY LIMITED
WO/2021/065919MEMBER FOR PLASMA PROCESSING APPARATUSES AND PLASMA PROCESSING  APPARATUS PROVIDED WITH SAMEKYOCERA CORPORATION
WO/2021/070682SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICETOKYO ELECTRON LIMITED
WO/2021/100332SEMICONDUCTOR DEVICE, SOLID-STATE IMAGE CAPTURING DEVICE, AND  ELECTRONIC DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/066137SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICEFLOSFIA INC.
WO/2021/079724MEMBER FOR SEMICONDUCTOR CLEANING APPARATUSDAIKIN INDUSTRIES, LTD.
WO/2021/070782ELECTRONIC COMPONENT PROCESSING DEVICEUENO SEIKI CO., LTD.
WO/2021/090624METHOD FOR CALIBRATING COORDINATE POSITION IDENTIFICATION  PRECISION OF LASER SURFACE INSPECTION DEVICE, AND SEMICONDUCTOR WAFER  EVALUATION METHODSUMCO CORPORATION
WO/2021/186773SEMICONDUCTOR DEVICEHITACHI POWER SEMICONDUCTOR DEVICE, LTD.
WO/2021/075330SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICEFUJI ELECTRIC CO., LTD.
WO/2021/161582SUBSTRATE CONVEYING DEVICE, AND SUBSTRATE POSITIONAL  DISPLACEMENT MEASURING METHODKAWASAKI JUKOGYO KABUSHIKI KAISHA
WO/2021/070910NITRIDE SEMICONDUCTOR STRUCTURE, NITRIDE SEMICONDUCTOR DEVICE,  AND METHOD FOR MANUFACTURING SAMEPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
WO/2021/075353SEMICONDUCTOR INTEGRATED CIRCUIT DEVICESOCIONEXT INC.
WO/2021/079779SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING DEVICETOKYO ELECTRON LIMITED
WO/2021/079780ETCHING METHOD FOR SILICON NITRIDE AND PRODUCTION METHOD FOR  SEMICONDUCTOR ELEMENTSHOWA DENKO K.K.
WO/2021/095420SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/075434SEMICONDUCTOR INTEGRATED CIRCUIT DEVICESOCIONEXT INC.
WO/2021/075475DEVICE MANAGEMENT SYSTEMUHURU CORPORATION
WO/2021/131253VAPOR PHASE GROWTH DEVICESUMCO CORPORATION
WO/2021/090657SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUSSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/095433SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUSSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/085160SUBSTRATE PROCESSING METHODSCREEN HOLDINGS CO., LTD.
WO/2021/075540SEMICONDUCTOR INTEGRATED CIRCUIT DEVICESOCIONEXT INC.
WO/2021/117341MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING SAMEAGC INC.
WO/2021/085212SUBSTRATE CLEANING APPARATUS AND METHOD FOR CLEANING SUBSTRATETOKYO ELECTRON LIMITED
WO/2021/085213SUBSTRATE CLEANING APPARATUS AND METHOD FOR CLEANING SUBSTRATETOKYO ELECTRON LIMITED
WO/2021/079879SEMICONDUCTOR DEVICE AND DICING METHODNUVOTON TECHNOLOGY CORPORATION JAPAN
WO/2021/117351WAFER MANUFACTURING SYSTEMSUMCO CORPORATION
WO/2021/131276HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHODSCREEN HOLDINGS CO., LTD.
WO/2021/095474METHOD FOR ETCHING CRYSTALLINE OXIDE, METHOD FOR FORMING  TRENCH, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICEFLOSFIA INC.
WO/2021/152934PASSIVE COMPONENT WITH ELECTRODE AND ASSEMBLY OF PASSIVE  COMPONENT WITH ELECTRODEMURATA MANUFACTURING CO., LTD.
WO/2021/079955FILM FOR FORMING PROTECTIVE FILM, COMPOSITE SHEET FOR FORMING  PROTECTIVE FILM, AND PRODUCTION METHOD OF SMALL PIECE WITH PROTECTIVE FILMLINTEC CORPORATION
WO/2021/124689OPTICAL SENSORJAPAN DISPLAY INC.
WO/2021/090737EXHAUST GAS TREATMENT DEVICEEDWARDS JAPAN LIMITED
WO/2021/085463ELECTRONIC COMPONENT CONVEYING DEVICEUENO SEIKI CO., LTD.
WO/2021/100427FILM FORMING METHOD AND FILM FORMING APPARATUSTOKYO ELECTRON LIMITED
WO/2021/124693METHOD FOR PRODUCING EPITAXIAL SILICON WAFERSUMCO CORPORATION
WO/2021/152943IMAGING DEVICEPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
WO/2021/085556SEMICONDUCTOR ELEMENT AND METHOD FOR PRODUCING SEMICONDUCTOR  ELEMENTKYOCERA CORPORATION
WO/2021/085558SEMICONDUCTOR DEVICEPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
WO/2021/095553TRANSPORT DEVICE AND TRANSPORT METHODMCK CO., LTD.
WO/2021/152945STORAGE ELEMENT, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING  SEMICONDUCTOR DEVICESONY GROUP CORPORATION
WO/2021/100446SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUSSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/240840PICKUP DEVICE AND PICKUP METHODCANON MACHINERY INC.
WO/2021/090798ETCHING METHODTOKYO ELECTRON LIMITED
WO/2021/100466METHOD FOR REMOVING ADHERING MATERIAL AND FILM FORMING METHODSHOWA DENKO K.K.
WO/2021/090848METHOD FOR MANUFACTURING EPITAXIAL SUBSTRATE, AND EPITAXIAL  SUBSTRATESUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
WO/2021/149324SUBSTRATE PROCESSING APPARATUSJ.E.T. CO., LTD.
WO/2021/181747SEMICONDUCTOR DEVICEHITACHI POWER SEMICONDUCTOR DEVICE, LTD.
WO/2021/106527SUBSTRATE BONDING DEVICE AND METHODNIKON CORPORATION
WO/2021/090944SEMICONDUCTOR DEVICENEW JAPAN RADIO CO., LTD.
WO/2021/149330WAFER CONVEYANCE UNIT AND WAFER CONVEYANCE METHODHAMAMATSU PHOTONICS K.K.
WO/2021/111818SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING SAMESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/117402SEMICONDUCTOR DEVICESUMITOMO ELECTRIC INDUSTRIES, LTD.
WO/2021/124732APPARATUS FOR PRODUCING SEMICONDUCTOR DEVICE, AND METHOD FOR  PRODUCING SEMICONDUCTOR DEVICESHINKAWA LTD.
WO/2021/106580CHEMICAL SOLUTION FOR FORMING PROTECTIVE FILM, AND METHOD FOR  CLEANING WAFERCENTRAL GLASS CO., LTD.
WO/2021/100579IMAGING ELEMENT AND METHOD FOR MANUFACTURING IMAGING ELEMENTSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/106581CONTROL DEVICE, SUBSTRATE PROCESSING SYSTEM, AND CONTROL  METHODTOKYO ELECTRON LIMITED
WO/2021/100583Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICENIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
WO/2021/100591SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING  METHODSHINKAWA LTD.
WO/2021/106597SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHODTOKYO ELECTRON LIMITED
WO/2021/100605SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING  SOLID-STATE IMAGE PICKUP DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/095823CLEANING SHEET, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE,  AND METHOD FOR MANUFACTURING CLEANING SHEETTOHOKU BUTSURYU CO., LTD.
WO/2021/100625SEMICONDUCTOR DEVICE, ELECTRICAL CIRCUIT AND WIRELESS  COMMUNICATION DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/124756VAPOR PHASE GROWTH APPARATUS AND VAPOR PHASE GROWTH METHODSUMCO CORPORATION
WO/2021/100675SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/166345SEMICONDUCTOR FAILURE ANALYSIS DEVICE AND SEMICONDUCTOR  FAILURE ANALYSIS METHODHAMAMATSU PHOTONICS K.K.
WO/2021/106704FILM-FORMING APPARATUS AND METHOD OF USING FILM-FORMING  APPARATUSAIR WATER INC.
WO/2021/106717METHOD FOR CONTROLLING SUBSTRATE PROCESSING SYSTEM, AND  SUBSTRATE PROCESSING SYSTEMTOKYO ELECTRON LIMITED
WO/2021/117448SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUSSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/131449CLEANING SOLUTION AND CLEANING METHODFUJIFILM ELECTRONIC MATERIALS CO., LTD.
WO/2021/131451CLEANING METHOD AND CLEANING FLUIDFUJIFILM ELECTRONIC MATERIALS CO., LTD.
WO/2021/124800SILICON CARBIDE SEMICONDUCTOR DEVICESUMITOMO ELECTRIC INDUSTRIES, LTD.
WO/2021/106809SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR SYSTEM HAVING  SEMICONDUCTOR DEVICEFLOSFIA INC.
WO/2021/106811SEMICONDUCTOR DEVICE AND SEMICONDUCTOR SYSTEMFLOSFIA INC.
WO/2021/140763EPITAXIAL WAFER MANUFACTURING METHOD AND EPITAXIAL WAFERSHIN-ETSU HANDOTAI CO., LTD.
WO/2021/111918FOREIGN MATTER INSPECTION DEVICE, FOREIGN MATTER INSPECTION  METHOD, PROCESSING DEVICE, AND ARTICLE MANUFACTURING METHODCANON KABUSHIKI KAISHA
WO/2021/124810METHOD FOR MANUFACTURING PASSIVATION FILMSHOWA DENKO K.K.
WO/2021/117485SUBSTRATE CLEANING SYSTEM AND SUBSTRATE CLEANING METHODEBARA CORPORATION
WO/2021/152983TREATMENT CONDITION SPECIFICATION METHOD, SUBSTRATE TREATMENT  METHOD, SUBSTRATE PRODUCT MANUFACTURING METHOD, COMPUTER PROGRAM, STORAGE  MEDIUM, TREATMENT CONDITION SPECIFICATION DEVICE, AND SUBSTRATE TREATMENT  DEVICESCREEN HOLDINGS CO., LTD.
WO/2021/106939SEMICONDUCTOR APPARATUSROHM CO., LTD.
WO/2021/131472PROTECTIVE FILM FORMATION AGENT, AND METHOD FOR MANUFACTURING  SEMICONDUCTOR CHIPTOKYO OHKA KOGYO CO., LTD.
WO/2021/149350IMAGING ELEMENT AND IMAGING DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/140776COMPOUND SEMICONDUCTOR APPARATUS, AMD METHOD FOR MANUFACTURING  COMPOUND SEMICONDUCTOR APPARATUSSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/107115CIRCUIT SUBSTRATE, SUBSTRATE FOR PROBE CARD, AND PROBE CARDKYOCERA CORPORATION
WO/2021/112022SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHODTOKYO ELECTRON LIMITED
WO/2021/145079SEMICONDUCTOR DEVICEFUJI ELECTRIC CO., LTD.
WO/2021/145080SEMICONDUCTOR APPARATUSFUJI ELECTRIC CO., LTD.
WO/2021/117534SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSTOKYO ELECTRON LIMITED
WO/2021/117556SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODTOKYO ELECTRON LIMITED
WO/2021/112130WAFER PROCESSING DEVICEREXXAM CO., LTD.
WO/2021/117585IMAGING ELEMENT PACKAGE AND METHOD OF MANUFACTURING IMAGING  ELEMENT PACKAGESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/124900SUBSTRATE PROCESSING METHODTOKYO ELECTRON LIMITED
WO/2021/181768CLEANING METHOD OF ELECTRONIC COMPONENT AND MANUFACTURING  METHOD OF ELEMENT CHIPPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
WO/2021/161635SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAMEJAPAN DISPLAY INC.
WO/2021/131671SUBSTRATE PROCESSING APPARATUSSCREEN HOLDINGS CO., LTD.
WO/2021/117728SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE TREATMENT  DEVICE, AND PROGRAMKOKUSAI ELECTRIC CORPORATION
WO/2021/145110HOLDING DEVICENGK SPARK PLUG CO., LTD.
WO/2021/153033SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICESCREEN HOLDINGS CO., LTD.
WO/2021/125094SEMICONDUCTOR STORAGE DEVICESOCIONEXT INC.
WO/2021/131808METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR  DEVICEKYOCERA CORPORATION
WO/2021/117898METHOD FOR MANUFACTURING ELECTRONIC COMPONENTCONNECTEC AMERICA, INC.
WO/2021/131832SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHODTOKYO ELECTRON LIMITED
WO/2021/125138SEMICONDUCTOR STORAGE DEVICESOCIONEXT INC.
WO/2021/131873FILM FORMATION METHOD AND FILM FORMATION APPARATUSTOKYO ELECTRON LIMITED
WO/2021/131891TRENCH TYPE MOSFETNOVEL CRYSTAL TECHNOLOGY, INC.
WO/2021/131893TRENCH-TYPE MESFETNOVEL CRYSTAL TECHNOLOGY, INC.
WO/2021/131897SOLDER BUMP FORMING MEMBER, METHOD FOR MANUFACTURING SOLDER  BUMP FORMING MEMBER, AND METHOD FOR MANUFACTURING ELECTRODE SUBSTRATE  PROVIDED WITH SOLDER BUMPSHOWA DENKO MATERIALS CO., LTD.
WO/2021/140849POLYCRYSTALLINE FILM, METHOD FOR FORMING POLYCRYSTALLINE FILM,  LASER CRYSTALLIZATION DEVICE AND SEMICONDUCTOR DEVICEV TECHNOLOGY CO., LTD.
WO/2021/131905SOLDER BUMP FORMING MEMBER, METHOD FOR MANUFACTURING SOLDER  BUMP FORMING MEMBER, AND METHOD FOR MANUFACTURING ELECTRODE SUBSTRATE  PROVIDED WITH SOLDER BUMPSHOWA DENKO MATERIALS CO., LTD.
WO/2021/131972SUBSTRATE PROCESSING APPARATUSSCREEN HOLDINGS CO., LTD.
WO/2021/132010FILM FORMING METHOD AND FILM FORMING SYSTEMTOKYO ELECTRON LIMITED
WO/2021/132122CLEANING DEVICE, POLISHING DEVICE, AND DEVICE AND METHOD FOR  CALCULATING ROTATIONAL RATE OF SUBSTRATE IN CLEANING DEVICEEBARA CORPORATION
WO/2021/132133SEMICONDUCTOR CHIP CLEANING METHOD AND SEMICONDUCTOR CHIP  CLEANING DEVICEYAMAHA ROBOTICS HOLDINGS CO., LTD.
WO/2021/132142IMPRINTING DEVICE AND IMPRINTING METHODSCIVAX CORPORATION
WO/2021/132145SEMICONDUCTOR ELEMENT, METHOD FOR MANUFACTURING SEMICONDUCTOR  ELEMENT, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR  DEVICETAMURA CORPORATION
WO/2021/140898NITRIDE SEMICONDUCTOR DEVICEPANASONIC CORPORATION
WO/2021/132163FILM FORMATION METHOD AND FILM FORMATION DEVICETOKYO ELECTRON LIMITED
WO/2021/125358GAS SUPPLY METHOD, SUBSTRATE PROCESSING METHOD, AND GAS SUPPLY  DEVICESHINWA CONTROLS CO., LTD
WO/2021/140904CONTACTOR, INSPECTION JIG, INSPECTION DEVICE, AND METHOD FOR  MANUFACTURING SAID CONTACTORNIDEC READ CORPORATION
WO/2021/171764PLASMA PROCESSING METHODHITACHI HIGH-TECH CORPORATION
WO/2021/161668SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFORFUJI ELECTRIC CO., LTD.
WO/2021/145182OPTICAL PROBE, PROBE CARD, MEASURING SYSTEM, AND MEASURING  METHODKABUSHIKI KAISHA NIHON MICRONICS
WO/2021/132443SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHODSCREEN HOLDINGS CO., LTD.
WO/2021/220551PLASMA TREATMENT DEVICEHITACHI HIGH-TECH CORPORATION
WO/2021/132481RESISTIVITY MEASURING METHOD, SEMICONDUCTOR DEVICE  MANUFACTURING METHOD, RESISTIVITY MEASURING PROGRAM, AND RESISTIVITY  MEASURING DEVICEKOKUSAI ELECTRIC SEMICONDUCTOR SERVICE INC.
WO/2021/132611IC CHIP-MOUNTING DEVICE AND IC CHIP-MOUNTING METHODSATO HOLDINGS KABUSHIKI KAISHA
WO/2021/132613IC CHIP MOUNTING DEVICE, AND IC CHIP MOUNTING METHODSATO HOLDINGS KABUSHIKI KAISHA
WO/2021/132614IC CHIP MOUNTING DEVICE AND IC CHIP MOUNTING METHODSATO HOLDINGS KABUSHIKI KAISHA
WO/2021/171785SEMICONDUCTOR DEVICE, AND TEST SYSTEMSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/192481METHOD OF MANUFACTURING ELECTRODE PLATE FOR PLASMA PROCESSING  DEVICE AND ELECTRODE PLATE FOR PLASMA PROCESSING DEVICEMITSUBISHI MATERIALS CORPORATION
WO/2021/153169SEMICONDUCTOR STORAGE DEVICESOCIONEXT INC.
WO/2021/153171COMPOSITION, AND SUBSTRATE PROCESSING METHODFUJIFILM CORPORATION
WO/2021/171798IMAGING DEVICE AND LIGHT DETECTION DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/149532SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHODTOKYO ELECTRON LIMITED
WO/2021/153219ETCHING METHODSHOWA DENKO K.K.
WO/2021/171806SUBSTRATE PROCESSING APPARATUSSCREEN HOLDINGS CO., LTD.
WO/2021/171810SUBSTRATE TREATMENT DEVICE AND SUBSTRATE TREATMENT METHODSCREEN HOLDINGS CO., LTD.
WO/2021/192502SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICESCREEN HOLDINGS CO., LTD.
WO/2021/149551TRANSFER DEVICE, PROCESSING SYSTEM, AND TRANSFER METHODTOKYO ELECTRON LIMITED
WO/2021/166496SEMICONDUCTOR FAULT ANALYSIS DEVICE AND SEMICONDUCTOR FAULT  ANALYSIS METHODHAMAMATSU PHOTONICS K.K.
WO/2021/157316SUCTIONING ASSISTANCE FILM AND METHOD FOR SUCTIONING  SEMICONDUCTOR WAFERMITSUI CHEMICALS TOHCELLO, INC.
WO/2021/181863ASSESSMENT DEVICE, TEST SYSTEM, ASSESSMENT METHOD, AND  ASSESSMENT PROGRAMADVANTEST CORPORATION
WO/2021/145397SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICEFUJI ELECTRIC CO., LTD.
WO/2021/149599METHOD FOR MANUFACTURING NITRIDE SEMICONDUCTOR DEVICE AND  NITRIDE SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/171823TERMINAL AND CONNECTION METHODSONY GROUP CORPORATION
WO/2021/220559SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR  SEMICONDUCTOR DEVICEHAMAMATSU PHOTONICS K.K.
WO/2021/153361METHOD FOR REMOVING SEMICONDUCTOR CHIP WITH PROTECTIVE FILMLINTEC CORPORATION
WO/2021/192551METHOD FOR FORMING SEMICONDUCTOR LAYERNIPPON TELEGRAPH AND TELEPHONE CORPORATION
WO/2021/153404SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/153416JOINING DEVICE AND JOINING METHODTOKYO ELECTRON LIMITED
WO/2021/199611WAFER PROCESSING DEVICE, FLUID DISCHARGE DEVICE, FLUID SUPPLY  DEVICE, AND FLUID SUPPLY METHODREXXAM CO., LTD.
WO/2021/153452SUBSTRATE HOLDING APPARATUSV TECHNOLOGY CO., LTD.
WO/2021/176879SUBSTRATE PROCESSING DEVICE, JIG, CALIBRATION METHOD FOR  SUBSTRATE PROCESSING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR  DEVICEKOKUSAI ELECTRIC CORPORATION
WO/2021/157440FILTER CLEANING SYSTEM AND FILTER CLEANING METHODTOKYO ELECTRON LIMITED
WO/2021/181923GRIPPER DEVICE, CONVEYANCE VEHICLE, AND CONVEYANCE METHODMURATA MACHINERY, LTD.
WO/2021/181924GRIPPER DEVICE, CONVEYANCE VEHICLE, AND CONVEYANCE METHODMURATA MACHINERY, LTD.
WO/2021/229860MANUFACTURING ASSIST SYSTEM AND MANUFACTURING ASSIST METHODTOWA CORPORATION
WO/2021/176903TREATMENT LIQUIDFUJIFILM CORPORATION
WO/2021/157470CUTTING DEVICE, BONDING MATERIAL TRANSFER DEVICE, AND MOUNTING  DEVICETORAY ENGINEERING CO., LTD.
WO/2021/161824SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICETOKYO ELECTRON LIMITED
WO/2021/176913PROCESSING SOLUTION AND PROCESSING SOLUTION CONTAINERFUJIFILM CORPORATION
WO/2021/157523SAMPLE HOLDERKYOCERA CORPORATION
WO/2021/157544HEAT TREATMENT APPARATUSSCREEN HOLDINGS CO., LTD.
WO/2021/171931SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICESCREEN HOLDINGS CO., LTD.
WO/2021/161855SOLID-STATE IMAGING ELEMENT AND IMAGING SYSTEMSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/157578OPTICAL DEVICE MANUFACTURING METHOD AND MANUFACTURING  APPARATUS THAT USE LOCAL ETCHINGNTT ELECTRONICS CORPORATION
WO/2021/171935HEAT TREATMENT METHODSCREEN HOLDINGS CO., LTD.
WO/2021/166645SEMICONDUCTOR STORAGE DEVICESOCIONEXT INC.
WO/2021/199665SOLID-STATE IMAGING DEVICE, PRODUCTION METHOD FOR SOLID-STATE  IMAGING DEVICE, AND ELECTRONIC APPARATUSSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/161897PHOSPHATING LIQUID RECLAMATION DEVICE, SUBSTRATE PROCESSING  DEVICE, PHOSPHATING LIQUID RECLAMATION METHOD AND SUBSTRATE PROCESSING METHODTOKYO ELECTRON LIMITED
WO/2021/166674SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEMTOKYO ELECTRON LIMITED
WO/2021/171969SEMICONDUCTOR INTEGRATED CIRCUIT DEVICESOCIONEXT INC.
WO/2021/166696WORKPIECE CUTTING METHOD AND RESIN APPLYING DEVICEKYORITSU CHEMICAL & CO., LTD.
WO/2021/176952TREATMENT LIQUID AND TREATMENT LIQUID STORAGE BODYFUJIFILM CORPORATION
WO/2021/157719SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICEFLOSFIA INC.
WO/2021/186944METHOD FOR CONTROLLING DONOR CONCENTRATION IN SILICON SINGLE  CRYSTAL SUBSTRATESHIN-ETSU HANDOTAI CO., LTD.
WO/2021/171986DRY ETCHING METHOD, PRODUCTION METHOD FOR SEMICONDUCTOR  ELEMENT, AND CLEANING METHODSHOWA DENKO K.K.
WO/2021/192662SUBSTRATE PROCESSING DEVICE AND SUBSTRATE INVERTING METHODSCREEN HOLDINGS CO., LTD.
WO/2021/199687METHOD FOR CONTROLLING DONOR CONCENTRATION IN SILICON SINGLE  CRYSTAL SUBSTRATESHIN-ETSU HANDOTAI CO., LTD.
WO/2021/186954PROCESSING DEVICE, DISPLAY DEVICE, MANUFACTURING METHOD FOR  SEMICONDUCTOR DEVICE, AND PROGRAMKOKUSAI ELECTRIC CORPORATION
WO/2021/192700JOINED STRUCTUREAGC INC.
WO/2021/186965SURFACE-EMITTING LASER ELEMENT AND SURFACE-EMITTING LASER  ELEMENT MANUFACTURING METHODKYOTO UNIVERSITY
WO/2021/261003ELECTRONIC CONTROL DEVICEHITACHI ASTEMO, LTD.
WO/2021/162083METHOD FOR PRODUCING STRUCTURAL BODY AND APPARAUS FOR  PRODUCING STRUCTURAL BODYSCIOCS COMPANY LIMITED
WO/2021/176996SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/162107METHOD FOR RECYCLING SUBSTRATE, METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICEKYOCERA CORPORATION
WO/2021/172064SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODTOKYO ELECTRON LIMITED
WO/2021/172067SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR, AND FIELD  EFFECT TRANSISTORWASEDA UNIVERSITY
WO/2021/172074PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHODTOKYO ELECTRON LIMITED
WO/2021/245992SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/182046DIAMOND FIELD EFFECT TRANSISTOR AND MEHTOD FOR PRODUCING SAMEWASEDA UNIVERSITY
WO/2021/166963SINGULATION METHODNUVOTON TECHNOLOGY CORPORATION JAPAN
WO/2021/220590SEMICONDUCTOR WAFER CLEANING METHODSHIN-ETSU HANDOTAI CO., LTD.
WO/2021/172176SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUSSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/167060SOLID-STATE IMAGING DEVICETOWER PARTNERS SEMICONDUCTOR CO., LTD.
WO/2021/167083COPPER BONDING WIRENIPPON MICROMETAL CORPORATION
WO/2021/182083INSPECTION JIG AND SUBSTRATE INSPECTION DEVICE COMPRISING SAMENIDEC READ CORPORATION
WO/2021/177078SUBSTRATE PROCESSING METHOD, AND SUBSTRATE PROCESSING DEVICETOKYO ELECTRON LIMITED
WO/2021/172397SEMICONDUCTOR PROCESS LIQUID FOR RUTHENIUMTOKUYAMA CORPORATION
WO/2021/172400SUBSTRATE HOLDING HAND AND SUBSTRATE TRANSFER ROBOTKAWASAKI JUKOGYO KABUSHIKI KAISHA
WO/2021/172427POLISHING COMPOSITION INCLUDING ZIRCONIA PARTICLES AND  OXIDIZING AGENTFUJIMI INCORPORATED
WO/2021/192800SEMICONDUCTOR INTEGRATED CIRCUITKABUSHIKI KAISHA TOKAI-RIKA-DENKI-SEISAKUSHO
WO/2021/192801PROCESS MONITOR AND PROCESS MONITORING METHODSUMITOMO HEAVY INDUSTRIES, LTD.
WO/2021/192832LAMINATE, METHOD FOR MANUFCTURING LAMINATE, AND METHOD FOR  MANUFACTURING SEMICONDUCTOR SUBSTRATETOKYO OHKA KOGYO CO., LTD.
WO/2021/240935ETCHING METHOD FOR SILICON WAFERSHIN-ETSU HANDOTAI CO., LTD.
WO/2021/229894SILICON WAFER ETCHING METHOD AND ETCHING APPARATUSSHIN-ETSU HANDOTAI CO., LTD.
WO/2021/177292SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFORDENSO CORPORATION
WO/2021/192853SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSTOKYO ELECTRON LIMITED
WO/2021/192854SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSTOKYO ELECTRON LIMITED
WO/2021/182189SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSTOKYO ELECTRON LIMITED
WO/2021/182193PROBE  CARDNHK SPRING CO., LTD.
WO/2021/182225SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/187104SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICETOKYO ELECTRON LIMITED
WO/2021/187105GROUP MANAGEMENT DEVICE AND GROUP MANAGEMENT SYSTEMTOKYO ELECTRON LIMITED
WO/2021/229898DRY ETCHING METHOD OF SEMICONDUCTOR SUBSTRATE AND DRY ETCHING  METHOD OF SILICON OXIDE FILMSHIN-ETSU HANDOTAI CO., LTD.
WO/2021/182277POLISHING COMPOSITION AND POLISHING METHODFUJIMI INCORPORATED
WO/2021/182278POLISHING COMPOSITION AND POLISHING METHODFUJIMI INCORPORATED
WO/2021/182292SUBSTRATE-PROCESSING DEVICE, EXHAUST FLOW RATE CONTROL DEVICE,  AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICEKOKUSAI ELECTRIC CORPORATION
WO/2021/177409ELEMENT ARRAY PRESSURIZING DEVICE, MANUFACTURING DEVICE, AND  MANUFACTURING METHODTDK CORPORATION
WO/2021/182311DRY ETCHING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE,  AND DRY ETCHING GAS COMPOSITIONCENTRAL GLASS COMPANY, LIMITED
WO/2021/187163SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSTOKYO ELECTRON LIMITED
WO/2021/199919METHOD FOR PRODUCING ELECTRONIC DEVICEMITSUI CHEMICALS TOHCELLO, INC.
WO/2021/187174SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSTOKYO ELECTRON LIMITED
WO/2021/182352SEMICONDUCTOR DEVICEDENSO CORPORATION
WO/2021/192935ELECTROSTATIC CHUCK DEVICE AND SLEEVE FOR ELECTROSTATIC CHUCK  DEVICETOMOEGAWA CO., LTD.
WO/2021/177466CONTROL DEVICE, CONTROL METHOD, AND PROGRAMNIKON CORPORATION
WO/2021/192938METHOD FOR MANUFACTURING BONDED WAFER AND BONDED WAFERSHIN-ETSU HANDOTAI CO., LTD.
WO/2021/225027METHOD FOR FORMING THERMAL OXIDE FILM OF SEMICONDUCTOR  SUBSTRATESHIN-ETSU HANDOTAI CO., LTD.
WO/2021/240944SEMICONDUCTOR DEVICEHITACHI POWER SEMICONDUCTOR DEVICE, LTD.
WO/2021/192990SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHODTOKYO ELECTRON LIMITED
WO/2021/240945ELECTROSTATIC CHUCKNGK INSULATORS, LTD.
WO/2021/193016METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES, AND SUBSTRATE  PROCESSING SYSTEMTOKYO ELECTRON LIMITED
WO/2021/187263SUBLIMABLE FILM FORMATION COMPOSITION AND METHOD FOR PRODUCING  SUBSTRATECENTRAL GLASS COMPANY, LIMITED
WO/2021/240948METHOD FOR FORMING THERMAL OXIDE FILM OF SEMICONDUCTOR  SUBSTRATESHIN-ETSU HANDOTAI CO., LTD.
WO/2021/182524SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICESUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
WO/2021/187277SUBSTRATE TREATMENT APPARATUS, HEAT INSULATION MATERIAL  ASSEMBLY, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICEKOKUSAI ELECTRIC CORPORATION
WO/2021/182532IMPRINT DEVICESCIVAX CORPORATION
WO/2021/182545PRODUCTION METHOD FOR PATTERNED ORGANIC FILM, PRODUCTION  APPARATUS FOR PATTERNED ORGANIC FILM, ORGANIC SEMICONDUCTOR DEVICE PRODUCED  BY SAME, AND INTEGRATED CIRCUIT INCLUDING ORGANIC SEMICONDUCTOR DEVICETHE UNIVERSITY OF TOKYO
WO/2021/220633SUBSTRATE TREATMENT DEVICE, SUBSTRATE TREATMENT METHOD, METHOD  FOR GENERATING LEARNING DATA, LEARNING METHOD, LEARNING DEVICE, METHOD FOR  GENERATING LEARNED MODEL, AND LEARNED MODELSCREEN HOLDINGS CO., LTD.
WO/2021/187319SUBSTRATE CONVEYANCE MODULE, PROCESSING SYSTEM, AND SUBSTRATE  CONVEYANCE METHODTOKYO ELECTRON LIMITED
WO/2021/187339CONTACT TERMINAL, INSPECTION JIG, AND INSPECTION DEVICENIDEC READ CORPORATION
WO/2021/187340LOAD PORT ADAPTERNIDEC READ CORPORATION
WO/2021/193135MOUNTING METHOD, MOUNTING DEVICE, AND TRANSFER DEVICETORAY ENGINEERING CO., LTD.
WO/2021/193150COMPOSITION FOR PROVISIONAL FIXATION AND METHOD FOR PRODUCING  BONDED STRUCTUREMITSUI MINING & SMELTING CO., LTD.
WO/2021/193160METHOD AND APPARATUS FOR FORMING SILICON CARBIDE-CONTAINING  FILMTOKYO ELECTRON LIMITED
WO/2021/193164METHOD AND DEVICE FOR FORMING SILICON CARBIDE-CONTAINING FILMTOKYO ELECTRON LIMITED
WO/2021/187422SOLID-STATE IMAGING ELEMENT AND ELECTRONIC APPARATUSSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/187425SUBSTRATE PROCESSING DEVICE, EXHAUST DEVICE, METHOD FOR  PRODUCING SEMICONDUCTOR DEVICE, AND PROGRAMKOKUSAI ELECTRIC CORPORATION
WO/2021/200074TRANSFER DEVICE, AND POSITION CORRECTION METHOD FOR TRANSFER  DEVICETORAY ENGINEERING CO., LTD.
WO/2021/215145SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHODTOKYO ELECTRON LIMITED
WO/2021/193302SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUSTOKYO ELECTRON LIMITED
WO/2021/200174IMAGING DEVICE AND ELECTRONIC APPARATUSSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/193338SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/200240ETCHING METHOD AND ETCHING DEVICETOKYO ELECTRON LIMITED
WO/2021/200263MOUNTING DEVICETORAY ENGINEERING CO., LTD.
WO/2021/193473SUBSTRATE PROCESSING APPARATUS, SUBSTRATE STAGE COVER, AND  METHOD FOR PRODUCING SEMICONDUCTOR DEVICEKOKUSAI ELECTRIC CORPORATION
WO/2021/193480SUBSTRATE PROCESSING DEVICE, METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICE, AND PROGRAMKOKUSAI ELECTRIC CORPORATION
WO/2021/210350FILM-FORMING DEVICE AND FILM-FORMING METHODSHIN-ETSU CHEMICAL CO., LTD.
WO/2021/205855WORKPIECE SEPARATION DEVICE AND WORKPIECE SEPARATION METHODSHIN-ETSU ENGINEERING CO., LTD.
WO/2021/193516SEMICONDUCTOR SUBSTRATE CLEANING METHOD, PROCESSED  SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD, AND COMPOSITION FOR PEELINGNISSAN CHEMICAL CORPORATION
WO/2021/193535SEMICONDUCTOR DEVICESUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
WO/2021/256040SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAMESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/193629WIDE GAP SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  WIDE GAP SEMICONDUCTOR DEVICESHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
WO/2021/215178SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAMEROHM CO., LTD.
WO/2021/205884SEMICONDUCTOR DEVICEKABUSHIKI KAISHA TOKAI-RIKA-DENKI-SEISAKUSHO
WO/2021/210368ETCHING METHOD AND METHOD FOR PRODUCING SEMICONDUCTOR ELEMENTSSHOWA DENKO K.K.
WO/2021/200660WAFER PROCESSING SHEET AND WAFER PROCESSING METHODDENKA COMPANY LIMITED
WO/2021/205909SUBSTRATE PROCESSING METHOD, AND SUBSTRATE PROCESSING DEVICETOKYO ELECTRON LIMITED
WO/2021/205918SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHODTOKYO ELECTRON LIMITED
WO/2021/200786ADHESIVE SHEETLINTEC CORPORATION
WO/2021/200810CERAMIC CIRCUIT BOARD WITH RESIST CURED FILM, MANUFACTURING  METHOD THEREFOR, AND CERAMIC CIRCUIT BOARD MANUFACTURING METHODDENKA COMPANY LIMITED
WO/2021/205925INTEGRATED CIRCUITMINEBEA MITSUMI INC.
WO/2021/220696SELECTIVE FILM FORMATION MEHTODTOKYO ELECTRON LIMITED
WO/2021/225047DEPOSITION DEVICE AND PLATENUFLARE TECHNOLOGY, INC.
WO/2021/205931AG ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE, AND  SEMICONDUCTOR DEVICENIPPON MICROMETAL CORPORATION
WO/2021/200861BONDED SUBSTRATEKYOCERA CORPORATION
WO/2021/210380JOINING SYSTEMTOKYO ELECTRON LIMITED
WO/2021/210385SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHODTOKYO ELECTRON LIMITED
WO/2021/201037STAMP TOOL , TRANSFER DEVICE , AND ELEMENT ARRAY MANUFACTURING  METHODTDK CORPORATION
WO/2021/201038STAMP TOOL HOLDING APPARATUS, STAMP TOOL POSITIONING  APPARATUS, MULTI-COMPONENT TRANSFER APPARATUS, AND METHOD FOR MANUFACTURING  ELEMENT ARRAYTDK CORPORATION
WO/2021/250984SEMICONDUCTOR INSPECTING METHOD AND SEMICONDUCTOR INSPECTING  DEVICEHAMAMATSU PHOTONICS K.K.
WO/2021/201108FLOW PATH MEMBER AND METHOD FOR MANUFACTURING SAMEKYOCERA CORPORATION
WO/2021/240990SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND ELECTRONIC  APPARATUSSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/201216SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SEMICONDUCTOR  DEVICEFUJI ELECTRIC CO., LTD.
WO/2021/201219COMPOSITE SUBSTRATE AND PRODUCTION METHOD THEREFORSHIN-ETSU CHEMICAL CO., LTD.
WO/2021/201220COMPOSITE SUBSTRATE AND PRODUCTION METHOD THEREFORSHIN-ETSU CHEMICAL CO., LTD.
WO/2021/201235SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING  SEMICONDUCTOR DEVICEFUJI ELECTRIC CO., LTD.
WO/2021/205994SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICETOKYO ELECTRON LIMITED
WO/2021/240998SOLID-STATE IMAGING ELEMENTSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/210431SUBSTRATE TREATMENT SYSTEM AND SUBSTRATE TREATMENT METHODTOKYO ELECTRON LIMITED
WO/2021/210451SUBSTRATE ARRANGEMENT DEVICE, TRANSPORT DEVICE, SUBSTRATE  PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHODTOKYO ELECTRON LIMITED
WO/2021/241017JOINING JIG AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICEHITACHI POWER SEMICONDUCTOR DEVICE, LTD.
WO/2021/215247BACK-GRINDING ADHESIVE FILM, AND ELECTRONIC DEVICE  MANUFACTURING METHODMITSUI CHEMICALS TOHCELLO, INC.
WO/2021/220768SHEET DETACHMENT METHOD AND SHEET DETACHMENT DEVICE, AND  DIVIDING METHOD AND DIVIDING DEVICELINTEC CORPORATION
WO/2021/220772POWER AMPLIFYING DEVICENUVOTON TECHNOLOGY CORPORATION JAPAN
WO/2021/241044METHOD FOR MANUFACTURING SOI WAFERSHIN-ETSU HANDOTAI CO., LTD.
WO/2021/250996PROCESSING DEVICE AND METHODTOKYO SEIMITSU CO., LTD.
WO/2021/241058SEMICONDUCTOR DEVICE AND ELECTRONIC EQUIPMENTSONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/220834ETCHING METHOD AND ETCHING DEVICETOKYO ELECTRON LIMITED
WO/2021/220841PRE-COATING METHOD AND TREATMENT DEVICETOKYO ELECTRON LIMITED
WO/2021/241059SEMICONDUCTOR DEVICESONY GROUP CORPORATION
WO/2021/225066SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING  METHODSHINKAWA LTD.
WO/2021/241065SUCTION-ATTRACTING MECHANISM, ARTICLE MANUFACTURING DEVICE,  AND SEMICONDUCTOR MANUFACTURING DEVICECANON KABUSHIKI KAISHA
WO/2021/220865CLEANING METHOD FOR CUP OF SUBSTRATE PROCESSING APPARATUS AND  SUBSTRATE PROCESSING APPARATUSTOKYO ELECTRON LIMITED
WO/2021/206185INSPECTION JIG AND INSPECTION DEVICENIDEC-READ CORPORATION
WO/2021/215445SEMICONDUCTOR DEVICEDENSO CORPORATION
WO/2021/215466BONDED SUBSTRATEKYOCERA CORPORATION
WO/2021/220906PATTERN DEFECT DETECTION METHODTASMIT, INC.
WO/2021/241095DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICESHINKAWA LTD.
WO/2021/220965SEMICONDUCTOR DEVICEDENSO CORPORATION
WO/2021/230060METHOD FOR MANUFACTURING BARRIER METAL-FREE METAL WIRING  STRUCTURE, AND BARRIER METAL-FREE METAL WIRING STRUCTUREEBARA CORPORATION
WO/2021/225091FILM FORMING METHOD AND FILM FORMING DEVICETOKYO ELECTRON LIMITED
WO/2021/221092SEMICONDUCTOR DEVICEFUJI ELECTRIC CO., LTD.
WO/2021/241124SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD,  METHOD FOR GENERATING LEARNING DATA, LEARNING METHOD, LEARNING DEVICE, METHOD  FOR GENERATING LEARNED MODEL, AND LEARNED MODELSCREEN HOLDINGS CO., LTD.
WO/2021/235227PATTERN MEASUREMENT METHODTASMIT, INC.
WO/2021/235269BONDING DEVICE AND ADJUSTMENT METHOD FOR BONDING HEADSHINKAWA LTD.
WO/2021/230283SEMICONDUCTOR DEVICE FOR POWER AMPLIFICATIONNUVOTON TECHNOLOGY CORPORATION JAPAN
WO/2021/241231SUBSTRATE TREATMENT DEVICE, SUBSTRATE TREATMENT METHOD, METHOD  FOR GENERATING TRAINING DATA, LEARNING METHOD, LEARNING DEVICE, METHOD FOR  GENERATING TRAINED MODEL, AND TRAINED MODELSCREEN HOLDINGS CO., LTD.
WO/2021/261102ELECTRONIC COMPONENTROHM CO., LTD.
WO/2021/251050SUBSTRATE PROCESSING DEVICE, COMPUTER-READABLE RECORDING  MEDIUM WITH PROGRAM RECORDED THEREIN, AND SUBSTRATE PROCESSING METHODEBARA CORPORATION
WO/2021/241242SEMICONDUCTOR DEVICE MANUFACTURING SYSTEM AND SEMICONDUCTOR  DEVICE MANUFACTURING METHODHITACHI HIGH-TECH CORPORATION
WO/2021/256133PROBE  CARDYOKOWO CO., LTD.
WO/2021/241256PLASMA TREATMENT DEVICETOKYO ELECTRON LIMITED
WO/2021/230344CLEANING DEVICE AND CLEANING METHODEBARA CORPORATION
WO/2021/256142IMAGING DEVICESONY SEMICONDUCTOR SOLUTIONS CORPORATION
WO/2021/256162IMAGING ELEMENT, IMAGING DEVICE, AND IMAGING SYSTEMPANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
WO/2021/246202SEMICONDUCTOR DEVICEMITSUBISHI ELECTRIC CORPORATION
WO/2021/241448SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE  PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE, AND PROGRAMKOKUSAI ELECTRIC CORPORATION
WO/2021/246227SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SEMICONDUCTOR  DEVICENUVOTON TECHNOLOGY CORPORATION JAPAN
WO/2021/256182SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFORDENSO CORPORATION
WO/2021/241561HEAT TREATMENT APPARATUSSCREEN HOLDINGS CO., LTD.
WO/2021/251128SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/246241SEMICONDUCTOR ELEMENT AND MANUFACTURING METHOD FOR  SEMICONDUCTOR ELEMENTMITSUBISHI ELECTRIC CORPORATION
WO/2021/246279SUPPORT SUBSTRATE FOR BONDED WAFERSUMCO CORPORATION
WO/2021/246280SIC SEMICONDUCTOR ELEMENT MANUFACTURING METHOD AND SIC  SEMICONDUCTOR ELEMENTKYOTO UNIVERSITY
WO/2021/241722SOLID-STATE IMAGING DEVICETOWER PARTNERS SEMICONDUCTOR CO., LTD.
WO/2021/251174SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICESCREEN HOLDINGS CO., LTD.
WO/2021/246328OPERATION METHOD FOR SUBSTRATE PROCESSING DEVICETOKYO ELECTRON LIMITED
WO/2021/246361SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/251197SUBSTRATE HOLDING APPARATUSKAWASAKI JUKOGYO KABUSHIKI KAISHA
WO/2021/246396WIRE BONDING DEVICESHINKAWA LTD.
WO/2021/256308FILM FORMATION METHOD AND PLASMA TREATMENT DEVICETOKYO ELECTRON LIMITED
WO/2021/256317PRESSURIZING SUCTION-ATTACHMENT TABLE AND PRESSURIZING DEVICE  EQUIPPED WITH SAMEHITACHI ZOSEN CORPORATION
WO/2021/256327PLANARIZATION METHOD AND PHOTOCURABLE COMPOSITIONCANON KABUSHIKI KAISHA
WO/2021/256383SUBSTRATE SOLUTION TREATMENT DEVICE AND SUBSTRATE SOLUTION  TREATMENT METHODTOKYO ELECTRON LIMITED
WO/2021/256433SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING  METHODSHINKAWA LTD.
WO/2021/256434CONTROL DEVICE FOR LASER ANNEALING APPARATUS AND LASER  ANNEALING METHODSUMITOMO HEAVY INDUSTRIES, LTD.
WO/2021/261352SUBSTRATE PROCESSING SYSTEM, SUBSTRATE PROCESSING METHOD, AND  MAP CREATING DEVICETOKYO ELECTRON LIMITED
WO/2021/261397SEMICONDUCTOR DEVICEROHM CO., LTD.
WO/2021/261494METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR  DEVICE, ELECTRONIC DEVICE, METHOD FOR PRODUCING SEMICONDUCTOR EPITAXIAL  SUBSTRATE, AND SEMICONDUCTOR EPITAXIAL SUBSTRATEKYOCERA CORPORATION
WO/2021/006408PUMP BACKSTREAM PREVENTING STRUCTURE FOR SEMICONDUCTOR  MANUFACTURING DEVICEKIM, Tae Wha
WO/2021/020602WAFER PROCESSING APPARATUS INCLUDING PARTICLE SENSORSEMICON TECH GLOBAL LIMITED
WO/2021/025184MODULE FOR REMOVING MISASSEMBLED SEMICONDUCTOR LIGHT-EMITTING  ELEMENT, AND METHOD USING SAME TO REMOVE MISASSEMBLED SEMICONDUCTOR  LIGHT-EMITTING ELEMENTLG ELECTRONICS INC.
WO/2021/040111APPARATUS AND METHOD FOR COLLECTING SEMICONDUCTOR LIGHT  EMITTING DIODESLG ELECTRONICS INC.
WO/2021/054507SELF-ASSEMBLY APPARATUS FOR SEMICONDUCTOR LIGHT-EMITTING  ELEMENTSLG ELECTRONICS INC.
WO/2021/054508SELF-ASSEMBLY APPARATUS FOR SEMICONDUCTOR LIGHT-EMITTING  ELEMENTSLG ELECTRONICS INC.
WO/2021/029493LARGE-AREA HEATERPOWER CUBESEMI INC.
WO/2021/090999SUBSTRATE PROCESSING DEVICE HAVING HEAT HOLEHANWHA CORPORATION
WO/2021/054541METHOD FOR DRY ETCHING COPPER THIN FILMINHA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
WO/2021/137335LIFT PIN, WAFER PROCESSING APPARATUS COMPRISING SAME, AND  METHOD FOR PRODUCING WAFERSSK SILTRON CO., LTD.
WO/2021/117974SEMICONDUCTOR LIGHT-EMITTING ELEMENT SUPPLY DEVICE AND SUPPLY  METHODLG ELECTRONICS INC.
WO/2021/149842STATE MEASUREMENT APPARATUS EMPLOYING CAPACITIVE SCHEMEJD CO.,LTD.
WO/2021/149858SEMICONDUCTOR LIGHT-EMITTING ELEMENT COLLECTING METHOD AND  SEMICONDUCTOR LIGHT-EMITTING ELEMENT COLLECTING METHOD USING SAMELG ELECTRONICS INC.
WO/2021/157750CAPACITANCE-TYPE STATE MEASURING DEVICE USING SENSOR-MOUNTED  WAFERJD CO.,LTD.
WO/2021/054546ASSEMBLY CHAMBER FOR SELF-ASSEMBLY OF SEMICONDUCTOR  LIGHT-EMITTING DIODESLG ELECTRONICS INC.
WO/2021/054547CHIP TRAY FOR SELF-ASSEMBLY AND METHOD FOR SUPPLYING  SEMICONDUCTOR LIGHT EMITTING DIODELG ELECTRONICS INC.
WO/2021/162152SEMICONDUCTOR LIGHT-EMITTING DEVICE SELF-ASSEMBLY APPARATUS  AND METHODLG ELECTRONICS INC.
WO/2021/054548SUBSTRATE CHUCK FOR SELF-ASSEMBLING SEMICONDUCTOR  LIGHT-EMITTING DIODESLG ELECTRONICS INC.
WO/2021/054549DEVICE FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT-EMITTING DIODESLG ELECTRONICS INC.
WO/2021/054550DEVICE FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT-EMITTING DIODESLG ELECTRONICS INC.
WO/2021/162158CHIP TRAY FOR SELF-ASSEMBLY, AND METHOD FOR SUPPLYING  SEMICONDUCTOR LIGHT EMITTING ELEMENTSLG ELECTRONICS INC.
WO/2021/162160CHIP DISPENSER FOR SELF-ASSEMBLYLG ELECTRONICS INC.
WO/2021/172613SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHODENH KOREA CO., LTD.
WO/2021/006453PUMP BACKSTREAM PREVENTING STRUCTURE FOR SEMICONDUCTOR  MANUFACTURING DEVICEKIM, Tae Wha
WO/2021/100978SIDE WIRING MANUFACTURING APPARATUS, SIDE WIRING MANUFACTURING  METHOD, AND DISPLAY APPARATUS MANUFACTURING METHODLG DISPLAY CO.,LTD.
WO/2021/172652INSPECTION DEVICE AND METHOD FOR INSPECTING AND REPAIRING  DISPLAY PANEL BY USING SAMESAMSUNG DISPLAY CO., LTD.
WO/2021/182675LOGISTICS AUTOMATION EQUIPMENT FOR SEMICONDUCTOR WAFER  MANUFACTURING DEVICESK SILTRON CO., LTD.
WO/2021/153846INGOT TEMPERATURE CONTROLLER AND WIRE SAWING DEVICE HAVING  SAMESK SILTRON CO., LTD.
WO/2021/002590GAS SUPPLY DEVICE FOR SUBSTRATE PROCESSING DEVICE, AND  SUBSTRATE PROCESSING DEVICEJUSUNG ENGINEERING CO., LTD.
WO/2021/246536DISPLAY DEVICE MANUFACTURING SUBSTRATE, AND METHOD FOR  MANUFACTURING DISPLAY DEVICE BY USING SAMELG ELECTRONICS INC.
WO/2021/033884PLASMA ETCHING METHODAJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
WO/2021/117991ETCHING AND/OR DRILLING APPARATUS USING RESONANCE FREQUENCY OF  WATER DROPLET, AND ETCHING AND/OR DRILLING METHOD USING SAMEGACHON UNIVERSITY OF INDUSTRY-ACADEMIC COOPERATION FOUNDATION
WO/2021/010593LED TRANSFER METHOD AND DISPLAY MODULE MANUFACTURED THEREBYSAMSUNG ELECTRONICS CO., LTD.
WO/2021/020714DIPOLE ALIGNMENT DEVICE, DIPOLE ALIGNMENT METHOD AND DISPLAY  DEVICE MANUFACTURING METHODSAMSUNG DISPLAY CO., LTD.
WO/2021/145516INSPECTION APPARATUS AND INSPECTION METHOD FOR WAFER EDGE  DEFECTSCOMIZOA CO.,LTD.
WO/2021/251527CLOSED CHAMBERLG ELECTRONICS INC.
WO/2021/002605SUBSTRATE PROCESSING APPARATUSJUSUNG ENGINEERING CO., LTD.
WO/2021/172665TELLURIUM OXIDE, AND THIN FILM TRANSISTOR COMPRISING SAME AS  CHANNEL LAYERINDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY
WO/2021/025287ELECTROSTATIC CHUCK HEATER AND MANUFACTURING METHOD THEREFORMICO CERAMICS LTD.
WO/2021/002653METHOD AND APPARATUS FOR MANUFACTURING LED PANELSAMSUNG ELECTRONICS CO., LTD.
WO/2021/002717COMBINED SILICONE RING FOR SEMICONDUCTOR ETCHING APPARATUSTECHNOLOGY MAKERS CO., LTD.
WO/2021/040227LASER TRANSFER APPARATUS AND TRANSFER METHOD USING THE SAMESAMSUNG ELECTRONICS CO., LTD.
WO/2021/015474PLASMA ETCHING APPARATUS COMPONENT FOR MANUFACTURING  SEMICONDUCTOR COMPRISING COMPOSITE SINTERED BODY AND MANUFACTURING METHOD  THEREFORKOREA INSTITUTE OF MACHINERY AND MATERIALS
WO/2021/025314DEPOSITION METHOD FOR CARBON-CONTAINING THIN FILMINDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY
WO/2021/033934SUBSTRATE SUPPORT ASSEMBLY AND SUBSTRATE PROCESSING APPARATUSEUGENE TECHNOLOGY CO., LTD.
WO/2021/025460LED SPIN CHUCKHS HI-TECH CO., LTD.
WO/2021/025498GAS INFLOW DEVICE AND SUBSTRATE PROCESSING DEVICE USING SAMEJUSUNG ENGINEERING CO., LTD.
WO/2021/034008HUMIDITY REDUCTION DEVICE PROVIDED IN LOAD PORT MODULE TO  REDUCE HUMIDITY IN WAFER CONTAINER, AND SEMICONDUCTOR PROCESSING DEVICE  INCLUDING SAMEJUSTEM CO., LTD.
WO/2021/040391MICRO LED TRANSFER METHODDIFLAT CO.,LTD.
WO/2021/075708SELECTIVE DROPLET FLOW SURFACE AND METHOD FOR MANUFACTURING  SAMETHE INDUSTRY & ACADEMIC COOPERPATION IN CHUNGNAM NATIONAL  UNIVERSITY (IAC)
WO/2021/045587RAPID THERMAL PROCESSING EQUIPMENT COOLING SYSTEMNEWYOUNG SYSTEM CO., LTD.
WO/2021/054670METHOD AND SYSTEM FOR REMOVING L-FC IN PLASMA ETCHING PROCESSDAEJEON UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION
WO/2021/132849APPARATUS FOR TRANSFERRING LEDLG DISPLAY CO.,LTD.
WO/2021/246579SUBSTRATE HEAT-TREATMENT APPARATUS USING VCSELVIATRON CO., LTD.
WO/2021/060860METHOD FOR MANUFACTURING THIN FILMSOULBRAIN CO., LTD.
WO/2021/060864THIN FILM FABRICATION METHODSOULBRAIN CO., LTD.
WO/2021/096067METHOD FOR PROCESSING SEMICONDUCTOR WAFEROPTO ELECTRONICS SOLUTIONS
WO/2021/080327SELECTIVE LASER TRANSFER DEVICE AND TRANSFER METHODKOREA INSTITUTE OF MACHINERY & MATERIALS
WO/2021/112404VIA FORMATION METHOD, SEMICONDUCTOR DEVICE PREPARATION METHOD  ON BASIS THEREOF, AND SEMICONDUCTOR DEVICEKOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION
WO/2021/096114METHOD OF MANUFACTURING SOI SUBSTRATETHE SHUM
WO/2021/096126SUBSTRATE PROCESSING APPARATUSJUSUNG ENGINEERING CO., LTD.
WO/2021/091218APPARATUS FOR TRANSFERRING PLURALITY OF CHIPS AND METHOD OF  TRANSFERRING PLURALITY OF CHIPSYANG, Jin Sok
WO/2021/091219METHOD FOR SORTING CHIPSYANG, Jin Sok
WO/2021/112417SUBSTRATE PROCESSING DEVICE COMPRISING DOOR UNIT HAVING  INCLINED SURFACEKCTECH CO.,LTD.
WO/2021/101288TRANSISTOR, METHOD FOR MANUFACTURING SAME, AND TERNARY  INVERTER COMPRISING SAMEUNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
WO/2021/137432TRANSISTOR, TERNARY INVERTER COMPRISING SAME, AND TRANSISTOR  MANUFACTURING METHODUNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
WO/2021/101289TRANSISTOR, TERNARY INVERTER INCLUDING SAME, AND TRANSISTOR  MANUFACTURING METHODUNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
WO/2021/137433TUNNEL FIELD EFFECT TRANSISTOR AND TERNARY INVERTER COMPRISING  SAMEUNIST(ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
WO/2021/157825GALLIUM NITRIDE/DIAMOND WAFERRFHIC CORPORATION
WO/2021/157826GALLIUM NITRIDE/DIAMOND WAFERRFHIC CORPORATION
WO/2021/157827GALLIUM NITRIDE/DIAMOND WAFERRFHIC CORPORATION
WO/2021/157828GALLIUM NITRIDE/DIAMOND WAFERRFHIC CORPORATION
WO/2021/101341ELEMENT TRANSFER METHOD, AND ELECTRONIC PANEL MANUFACTURING  METHOD USING SAMEKOREA INSTITUTE OF MACHINERY & MATERIALS
WO/2021/112471METHOD FOR FORMING ELECTRODEJUSUNG ENGINEERING CO., LTD.
WO/2021/206261METHOD FOR MANUFACTURING TWO-DIMENSIONAL MATERIAL HAVING  VERTICALLY ALIGNED NANOPATTERNSKOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
WO/2021/112569BYPRODUCT COLLECTION DEVICE INTEGRATED WITH COOLING WATER  CIRCULATION SYSTEMJ-SOLUTION CO., LTD.
WO/2021/112611SUBSTRATE PROCESSING DEVICE, METHOD FOR PREPARING SUBSTRATE  PROCESSING DEVICE, AND SUBSTRATE PROCESSING METHODJUSUNG ENGINEERING CO., LTD.
WO/2021/118305LAMP APPARATUS FOR WAFER CLEANING APPARATUS AND CLEANING  APPARATUS USING SAMECTLAB CO., LTD.
WO/2021/118317LIQUID CHEMICAL SUPPLY DEVICE SYSTEM AND METHOD THEREOF  CAPABLE OF PROCESSING GASES CONTAINED THEREINVERSUM MATERIALS HYT INC.
WO/2021/210751ANTI-SLIP PAD FOR TEMPORARY BONDING, INCLUDING PATTERN PART ON  BOTH SIDES THEREOFGLINT MATERIALS CO., LTD.
WO/2021/210752SEMICONDUCTOR WAFER TRANSPORTING CARRIER COMPRISING ANTI-SLIP  PADSGLINT MATERIALS CO., LTD.
WO/2021/230453SLIP PREVENTION PAD PREVENTING POPPING PHENOMENON FOR  CONVEYING SEMICONDUCTOR WAFER, AND ROBOT ARM BLADE EQUIPPED WITH SAMEGLINT MATERIALS CO., LTD.
WO/2021/125775MICRO-LED TRANSFER METHOD AND MICRO-LED TRANSFER APPARATUSSEOUL VIOSYS CO., LTD.
WO/2021/125778MICRO LED BONDING EVALUATION DEVICE AND MICRO LED BONDING  EVALUATION METHOD USING SAMESEOUL VIOSYS CO., LTD.
WO/2021/167218GAS COLLECTING SYSTEM AND GAS COLLECTING METHODHANYANG TECHNOLOGY INDUSTRY CO.,LTD.
WO/2021/133003LIGHT EMITTING DIODE TRANSFER SYSTEM AND CONTROL METHOD  THEREOFSAMSUNG ELECTRONICS CO., LTD.
WO/2021/137595METHOD FOR FORMING MATERIAL FILM USING SURFACE PROTECTION  MATERIALEUGENE TECHNOLOGY MATERIALS
WO/2021/187735SAW AND PLACEMENT SYSTEMTONITEC CO., LTD.
WO/2021/145695THIN FILM FOR ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING  SAMEINDUSTRY FOUNDATION OF CHONNAM NATIONAL UNIVERSITY
WO/2021/162252REVERSIBLE COATING METHOD AND ENCAPSULATION METHOD FOR  STRUCTURAL FILLING OF SUBSTRATENANOIN INC.
WO/2021/145716SYSTEM FOR STABILIZING FLOW OF GAS INTRODUCED INTO SENSORATIKOREA CO., LTD.
WO/2021/201393SYSTEM AND METHOD FOR CONFIRMING MOUNTED STATE OF PICKER  MOUNTSINTEKPLUS CO.,LTD.
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WO/2021/241869SUBSTRATE PROCESSING DEVICEJUSUNG ENGINEERING CO., LTD.
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WO/2021/016042METHOD FOR TUNING STRESS TRANSITIONS OF FILMS ON A SUBSTRATETOKYO ELECTRON LIMITED
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WO/2021/041002SEMICONDUCTOR PROCESSING APPARATUS WITH IMPROVED UNIFORMITYAPPLIED MATERIALS, INC.
WO/2021/030199METHOD AND SYSTEM FOR CAPPING OF CORES FOR SELF-ALIGNED  MULTIPLE PATTERNINGTOKYO ELECTRON LIMITED
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WO/2021/030310NON-CONFORMAL HIGH SELECTIVITY FILM FOR ETCH CRITICAL  DIMENSION CONTROLAPPLIED MATERIALS, INC.
WO/2021/030332PEALD TITANIUM NITRIDE WITH DIRECT MICROWAVE PLASMAAPPLIED MATERIALS, INC.
WO/2021/034595HEATED SUBSTRATE SUPPORT WITH THERMAL BAFFLESAPPLIED MATERIALS, INC.
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WO/2021/034641SILICON COMPOUNDS AND METHODS FOR DEPOSITING FILMS USING SAMEVERSUM MATERIALS US, LLC
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WO/2021/034857MAPPING OF A REPLACEMENT PARTS STORAGE CONTAINERAPPLIED MATERIALS, INC.
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WO/2021/041389METHODS FOR PROCESSING A WORKPIECE USING FLUORINE RADICALSMATTSON TECHNOLOGY, INC.
WO/2021/041462SILICON OXIDE SELECTIVE DRY ETCH PROCESSMATTSON TECHNOLOGY, INC.
WO/2021/041593SELECTIVE COBALT DEPOSITION ON COPPER SURFACESAPPLIED MATERIALS, INC.
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WO/2021/046061SMALL MOLECULE FILMS FOR SACRIFICIAL BRACING, SURFACE  PROTECTION, AND QUEUE-TIME MANAGEMENTLAM RESEARCH CORPORATION
WO/2021/055166ATOMIC LAYER ETCHING OF METALSAPPLIED MATERIALS, INC.
WO/2021/050333ETCHING COMPOSITIONFUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
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WO/2021/046212INTERCONNECTION STRUCTURE OF SELECTIVE DEPOSITION PROCESSAPPLIED MATERIALS, INC.
WO/2021/046269MULTI-REGIONAL EPITAXIAL GROWTH AND RELATED SYSTEMS AND  ARTICLESMASSACHUSETTS INSTITUTE OF TECHNOLOGY
WO/2021/262208WAVELET SYSTEM AND METHOD FOR AMELIORATING MISREGISTRATION AND  ASYMMETRY OF SEMICONDUCTOR DEVICESKLA CORPORATION
WO/2021/046301COMMON ELECTROSTATIC CHUCK FOR DIFFERING SUBSTRATESAPPLIED MATERIALS, INC.
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WO/2021/061376REVERSE CONTACT AND SILICIDE PROCESS FOR THREE-DIMENSIONAL  LOGIC DEVICESTOKYO ELECTRON LIMITED
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WO/2021/050453LITHOGRAPHICALLY DEFINED ELECTRICAL INTERCONNECTS FROM  CONDUCTIVE PASTESORMET CIRCUITS, INC.
WO/2021/050489PROCESSING SYSTEM AND METHOD OF DELIVERING A REACTANT GASAPPLIED MATERIALS, INC.
WO/2021/050602ELECTROSTATIC PUCK AND METHOD OF MANUFACTUREWATLOW ELECTRIC MANUFACTURING COMPANY
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WO/2021/050731METHOD FOR RELAXING SEMICONDUCTOR FILMS INCLUDING THE  FABRICATION OF PSEUDO-SUBSTRATESTHE REGENTS OF THE UNIVERSITY OF CALIFORNIA
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WO/2021/055399METHOD OF BOTTOM-UP METALLIZATION IN A RECESSED FEATURETOKYO ELECTRON LIMITED
WO/2021/055542METHOD OF FORMING A NARROW TRENCHTOKYO ELECTRON LIMITED
WO/2021/061480CLEAVE SYSTEMS HAVING SPRING MEMBERS FOR CLEAVING A  SEMICONDUCTOR STRUCTURE AND METHODS FOR CLEAVING SUCH STRUCTURESGLOBALWAFERS CO., LTD.
WO/2021/055606PLASMA IMMERSION METHODS FOR ION IMPLANTATIONENTEGRIS, INC.
WO/2021/061499UNSUPERVISED LEARNING-BASED REFERENCE SELECTION FOR ENHANCED  DEFECT INSPECTION SENSITIVITYKLA CORPORATION
WO/2021/061501PATTERN-TO-DESIGN ALIGNMENT FOR ONE-DIMENSIONAL UNIQUE  STRUCTURESKLA CORPORATION
WO/2021/055693METHODS FOR THE TREATMENT OF WORKPIECESMATTSON TECHNOLOGY, INC.
WO/2021/076269METHODS FOR FORMING MICROELECTRONIC DEVICES WITH SELF-ALIGNED  INTERCONNECTS, AND RELATED DEVICES AND SYSTEMSMICRON TECHNOLOGY, INC.
WO/2021/055755SEAMLESS GAPFILL WITH DIELECTRIC ALD FILMSAPPLIED MATERIALS, INC.
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WO/2021/061585VARIATION-BASED SEGMENTATION FOR WAFER DEFECT DETECTIONKLA CORPORATION
WO/2021/055991MULTI-WAFER VOLUME SINGLE TRANSFER CHAMBER FACETAPPLIED MATERIALS, INC.
WO/2021/067092MASK ENCAPSULATION TO PREVENT DEGRADATION DURING FABRICATION  OF HIGH ASPECT RATIO FEATURESLAM RESEARCH CORPORATION
WO/2021/061907TUNABLE AND NON-TUNABLE HEAT SHIELDS TO AFFECT TEMPERATURE  DISTRIBUTION PROFILES OF SUBSTRATE SUPPORTSLAM RESEARCH CORPORATION
WO/2021/080726METHOD OF DEPOSITING LAYERSAPPLIED MATERIALS, INC.
WO/2021/062069EQUI-PROBABILITY DEFECT DETECTIONKLA CORPORATION
WO/2021/062145SELECTIVE AND SELF-LIMITING TUNGSTEN ETCH PROCESSAPPLIED MATERIALS, INC.
WO/2021/062188PATTERNING A SUBSTRATETOKYO ELECTRON LIMITED
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WO/2021/062349ULTRATHIN CONFORMAL COATINGS FOR ELECTROSTATIC DISSIPATION IN  SEMICONDUCTOR PROCESS TOOLSAPPLIED MATERIALS, INC.
WO/2021/062367NANOPARTICLE MATRIX FOR BACKSIDE HEAT SPREADINGTEXAS INSTRUMENTS INCORPORATED
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WO/2021/067239METROLOGY MODULE WITH PARALLEL ACQUISITION OF BROADBAND  POLARIZED SPECTRALAM RESEARCH CORPORATION
WO/2021/076320SYSTEMS AND METHODS FOR MONITORING ONE OR MORE CHARACTERISTICS  OF A SUBSTRATETOKYO ELECTRON LIMITED
WO/2021/091634SYSTEM AND METHOD TO CALIBRATE A PLURALITY OF WAFER INSPECTION  SYSTEM (WIS) MODULESTOKYO ELECTRON LIMITED
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WO/2021/141648HARDWARE IMPROVEMENTS AND METHODS FOR THE ANALYSIS OF SPINNING  REFLECTIVE SUBSTRATESTOKYO ELECTRON LIMITED
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WO/2021/067362SELECTIVE COBALT VERTICAL ETCHAPPLIED MATERIALS, INC.
WO/2021/067813NOVEL METHODS FOR GATE INTERFACE ENGINEERINGAPPLIED MATERIALS, INC.
WO/2021/067909INTEGRATED CIRCUIT WITH SCRIBE LANE PATTERNS FOR DEFECT  REDUCTIONTEXAS INSTRUMENTS INCORPORATED
WO/2021/071767AUTOCLEAN FOR LOAD LOCKS IN SUBSTRATE PROCESSING SYSTEMSLAM RESEARCH CORPORATION
WO/2021/071777METHODS AND APPARATUSES FOR FORMING INTERCONNECTION STRUCTURESAPPLIED MATERIALS, INC.
WO/2021/076387SIGNAL-DOMAIN ADAPTATION FOR METROLOGYKLA CORPORATION
WO/2021/071999SEMICONDUCTOR SUBSTRATE BEVEL CLEANINGLAM RESEARCH CORPORATION
WO/2021/086577METHOD AND APPARATUS FOR LOW RESISTANCE CONTACT  INTERCONNECTIONAPPLIED MATERIALS, INC.
WO/2021/072199PEDESTAL HEATER FOR SPATIAL MULTI-WAFER PROCESSING TOOLAPPLIED MATERIALS, INC.
WO/2021/072200WAFER HEATER WITH BACKSIDE AND INTEGRATED BEVEL PURGEAPPLIED MATERIALS, INC.
WO/2021/076613DOPED THROUGH-CONTACT STRUCTURESAPPLIED MATERIALS, INC.
WO/2021/076636MOLYBDENUM FILLLAM RESEARCH CORPORATION
WO/2021/076746SELECTIVE ATTACHMENT TO ENHANCE  SIO<sb>2</sb>:SIN<sb>X</sb> ETCH SELECTIVITYLAM RESEARCH CORPORATION
WO/2021/076843SELECTIVE ETCH PROCESS USING HYDROFLUORIC ACID AND OZONE GASESMATTSON TECHNOLOGY, INC.
WO/2021/076854MULTILAYER REFLECTOR AND METHODS OF MANUFACTURE AND PATTERNINGAPPLIED MATERIALS, INC.
WO/2021/080953MONOLITHIC ANISOTROPIC SUBSTRATE SUPPORTSLAM RESEARCH CORPORATION
WO/2021/118688APPARATUS FOR MEASURING TEMPERATURE IN A VACUUM AND MICROWAVE  ENVIRONMENTAPPLIED MATERIALS, INC.
WO/2021/081027WAFER CARRIER FOR SEMICONDUCTOR PROCESSINGMOMENTIVE PERFORMANCE MATERIALS QUARTZ, INC.
WO/2021/081155METHODS FOR GAA I/O FORMATION BY SELECTIVE EPI REGROWTHAPPLIED MATERIALS, INC.
WO/2021/118695METHODS AND APPARATUS FOR MEASURING EDGE RING TEMPERATUREAPPLIED MATERIALS, INC.
WO/2021/096653MODULAR LED HEATERAPPLIED MATERIALS, INC.
WO/2021/081308METHOD OF FABRICATING A RESONANT CAVITY AND DISTRIBUTED BRAGG  REFLECTOR MIRRORS FOR A VERTICAL CAVITY SURFACE EMITTING LASER ON A WING OF  AN EPITAXIAL LATERAL OVERGROWTH REGIONTHE REGENTS OF THE UNIVERSITY OF CALIFORNIA
WO/2021/086745WAFER HANDLING ROBOT WITH GRAVITATIONAL FIELD SENSORLAM RESEARCH CORPORATION
WO/2021/081379METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICEAPPLIED MATERIALS, INC.
WO/2021/150280METHODS AND DEVICES FOR SUBTRACTIVE SELF-ALIGNMENTAPPLIED MATERIALS, INC.
WO/2021/091708DEFLECTABLE PLATEN AND ASSOCIATED METHODAPPLIED MATERIALS, INC.
WO/2021/081477METAL-COVERED CHIP SCALE PACKAGESTEXAS INSTRUMENTS INCORPORATED
WO/2021/081482HIGH-SILICON-CONTENT WET-REMOVABLE PLANARIZING LAYERBREWER SCIENCE, INC.
WO/2021/086788CAP OXIDATION FOR FINFET FORMATIONAPPLIED MATERIALS, INC.
WO/2021/086822AMORPHOUS SILICON-BASED FILMS RESISTANT TO CRYSTALLIZATIONAPPLIED MATERIALS, INC.
WO/2021/086860SURFACE ENCASING MATERIAL LAYERAPPLIED MATERIALS, INC.
WO/2021/101681COIN-SLOT AND BALL-LOCK CERAMIC LIFT PIN HOLDERSLAM RESEARCH CORPORATION
WO/2021/112976HYBRID LOW RESISTANCE METAL LINESQUALCOMM INCORPORATED
WO/2021/087053CONTROL SYSTEM FOR ADAPTIVE CONTROL OF A THERMAL PROCESSING  SYSTEMMATTSON TECHNOLOGY, INC.
WO/2021/087132METHODS TO ENABLE SEAMLESS HIGH QUALITY GAPFILLLAM RESEARCH CORPORATION
WO/2021/091786SYSTEMS AND METHODS FOR SUBSTRATE SUPPORT TEMPERATURE CONTROLAPPLIED MATERIALS, INC.
WO/2021/087274METHOD TO IMPROVE THE PERFORMANCE OF GALLIUM-CONTAINING  LIGHT-EMITTING DEVICESTHE REGENTS OF THE UNIVERSITY OF CALIFORNIA
WO/2021/087315POROUS III-NITRIDES AND METHODS OF USING AND MAKING THEREOFYALE UNIVERSITY
WO/2021/087427TESTING SEMICONDUCTOR COMPONENTSTEXAS INSTRUMENTS INCORPORATED
WO/2021/096712AN APPARATUS AND METHOD FOR THE MINIMIZATION OF UNDERCUT  DURING A UBM ETCH PROCESSVEECO INSTRUMENTS INC.
WO/2021/087452FLUID-INFUSED ENCAPSULATION OF WATER-SENSITIVE MATERIALS WITH  REPLENISHABLE, MULTISCALE WATER REPELLENCYPRESIDENT AND FELLOWS OF HARVARD COLLEGE
WO/2021/091835METHODS TO REDUCE MATERIAL SURFACE ROUGHNESSAPPLIED MATERIALS, INC.
WO/2021/150289IN-SITU LIGHT DETECTION METHODS AND APPARATUS FOR ULTRAVIOLET  SEMICONDUCTOR SUBSTRATE PROCESSINGAPPLIED MATERIALS, INC.
WO/2021/101700METHODS AND APPARATUS FOR SMOOTHING DYNAMIC RANDOM ACCESS  MEMORY BIT LINE METALAPPLIED MATERIALS, INC.
WO/2021/101701SPLIT ASH PROCESSES FOR VIA FORMATION TO SUPPRESS DAMAGE TO  LOW-K LAYERSTOKYO ELECTRON LIMITED
WO/2021/092396ENVIRONMENTAL CONTROL MATERIAL HOLDERENTEGRIS, INC.
WO/2021/113030METHOD OF MAKING 3D CIRCUITS WITH INTEGRATED STACKED 3D METAL  LINES FOR HIGH DENSITY CIRCUITSTOKYO ELECTRON LIMITED
WO/2021/096865SYSTEMS AND METHODS FOR CONTROLLING NON-UNIFORMITYAPPLIED MATERIALS, INC.
WO/2021/096907GAS DELIVERY SYSTEMS AND METHODSAPPLIED MATERIALS, INC.
WO/2021/096914REDUCED HYDROGEN DEPOSITION PROCESSESAPPLIED MATERIALS, INC.
WO/2021/096987MULTI-FINGER ROBOT APPARATUS, ELECTRONIC DEVICE MANUFACTURING  APPARATUS, AND METHODS ADAPTED TO TRANSPORT MULTIPLE SUBSTRATES IN ELECTRONIC  DEVICE MANUFACTURINGAPPLIED MATERIALS, INC.
WO/2021/097022SILYL PSEUDOHALIDES FOR SILICON CONTAINING FILMSAPPLIED MATERIALS, INC.
WO/2021/097032TRANSFER MATERIAL LAYERS FOR GRAPHENE FABRICATION PROCESSREGENTS OF THE UNIVERSITY OF MINNESOTA
WO/2021/097134PORE MEASUREMENT DEVICETHE REGENTS OF THE UNIVERSITY OF CALIFORNIA
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WO/2021/141665AUTOCONFIGURATION OF HARDWARE COMPONENTS OF VARIOUS MODULES OF  A SUBSTRATE PROCESSING TOOLLAM RESEARCH CORPORATION
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WO/2021/101852CLUSTERING SUB-CARE AREAS BASED ON NOISE CHARACTERISTICSKLA CORPORATION
WO/2021/101866SEMICONDUCTORS WITH IMPROVED THERMAL BUDGET AND PROCESS OF  MAKING SEMICONDUCTORS WITH IMPROVED THERMAL BUDGETCREE, INC.
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WO/2021/108175WAFER PROCESS, APPARATUS AND METHOD OF MANUFACTURING AN  ARTICLECANON KABUSHIKI KAISHA
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WO/2021/102106RECYCLED GLASS AND GLASS-CERAMIC CARRIER SUSTRATESCORNING INCORPORATED
WO/2021/102181CRYOGENIC WAFER TESTING SYSTEMHIGH PRECISION DEVICES INC.
WO/2021/102198INDIUM-GALLIUM-NITRIDE STRUCTURES AND DEVICESOPNOVIX CORP.
WO/2021/108252DOPING PROCESSES IN METAL INTERCONNECT STRUCTURESLAM RESEARCH CORPORATION
WO/2021/108393GLASS WAFERS FOR SEMICONDUCTOR DEVICE FABRICATIONCORNING INCORPORATED
WO/2021/108400MULTIZONE FLOW GASBOX FOR PROCESSING CHAMBERAPPLIED MATERIALS, INC.
WO/2021/113128RECONFIGURABLE MAINFRAME WITH REPLACEABLE INTERFACE PLATEAPPLIED MATERIALS, INC.
WO/2021/108724STUD BUMPED PRINTED CIRCUIT ASSEMBLYHSIO TECHNOLOGIES, LLC
WO/2021/108772DEVICES COMPRISING DISTRIBUTED BRAGG REFLECTORS AND METHODS OF  MAKING THE DEVICESUNM RAINFOREST INNOVATIONS
WO/2021/118815OXYGEN RADICAL ASSISTED DIELECTRIC FILM DENSIFICATIONAPPLIED MATERIALS, INC.
WO/2021/118818METHODS FOR REMOVING AN OXIDE FILM FROM A SOI STRUCTURE AND  METHODS FOR PREPARING A SOI STRUCTUREGLOBALWAFERS CO., LTD.
WO/2021/113178CHAMBER DEPOSITION AND ETCH PROCESSAPPLIED MATERIALS, INC.
WO/2021/113191TOMOGRAPHY BASED SEMICONDUCTOR MEASUREMENTS USING SIMPLIFIED  MODELSKLA CORPORATION
WO/2021/113204HIGH BORON-CONTENT HARD MASK MATERIALSAPPLIED MATERIALS, INC.
WO/2021/118831ELECTROSTATIC CHUCK WITH REDUCED CURRENT LEAKAGE FOR HYBRID  LASER SCRIBING AND PLASMA ETCH WAFER SINGULATION PROCESSAPPLIED MATERIALS, INC.
WO/2021/113338SUBSTRATE PROCESSING APPARATUSBROOKS AUTOMATION, INC.
WO/2021/118862MULTI-STATE PULSING FOR ACHIEVING A BALANCE BETWEEN BOW  CONTROL AND MASK SELECTIVITYLAM RESEARCH CORPORATION
WO/2021/162770FILLING EMPTY STRUCTURES WITH DEPOSITION UNDER HIGH-ENERGY SEM  FOR UNIFORM DE LAYERINGAPPLIED MATERIALS ISRAEL LTD.
WO/2021/188168HALIDE PEROVSKITE NANOCRYSTAL ARRAY AND METHODS OF MAKING THE  SAMENORTHWESTERN UNIVERSITY
WO/2021/126580ADHESIVE TAPES FOR RECEIVING DISCRETE COMPONENTSUNIQARTA, INC.
WO/2021/118993SELF-ASSEMBLED MONOLAYERS AS SACRIFICIAL CAPPING LAYERSTOKYO ELECTRON LIMITED
WO/2021/138006SYSTEMS AND METHODS FOR REMOVAL OF HARDMASKMATTSON TECHNOLOGY, INC.
WO/2021/119180AUTOTEACH ENCLOSURE SYSTEMAPPLIED MATERIALS, INC.
WO/2021/138018STATION-TO-STATION CONTROL OF BACKSIDE BOW COMPENSATION  DEPOSITIONLAM RESEARCH CORPORATION
WO/2021/126696ENCAPSULATED RFID IN CONSUMABLE CHAMBER PARTSLAM RESEARCH CORPORATION
WO/2021/126697BAKE DEVICES FOR HANDLING AND UNIFORM BAKING OF SUBSTRATESAPPLIED MATERIALS, INC.
WO/2021/178019SYSTEM AND METHOD FOR MANAGING SUBSTRATE OUTGASSINGAPPLIED MATERIALS, INC.
WO/2021/188174SUBSTRATE SUPPORT ASSEMBLY WITH ARC RESISTANT COOLANT CONDUITAPPLIED MATERIALS, INC.
WO/2021/126848ASYMMETRIC PURGED BLOCK BENEATH WAFER PLANE TO MANAGE  NON-UNIFORMITYLAM RESEARCH CORPORATION
WO/2021/126857MULTI-ZONE ELECTROSTATIC CHUCKAPPLIED MATERIALS, INC.
WO/2021/126889SURFACE PROFILING AND TEXTURING OF CHAMBER COMPONENTSAPPLIED MATERIALS, INC.
WO/2021/126919PURGING SPINDLE ARMS TO PREVENT DEPOSITION AND WAFER SLIDINGLAM RESEARCH CORPORATION
WO/2021/126965SYSTEMS AND METHODS FOR PROVIDING MAINTENANCE ACCESS TO  ELECTRONIC DEVICE MANUFACTURING TOOLSAPPLIED MATERIALS, INC.
WO/2021/126996VAPOR DELIVERY SYSTEMS FOR SOLID AND LIQUID MATERIALSL'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION  DES PROCEDES GEORGES CLAUDE
WO/2021/133612TARGETED HEAT CONTROL SYSTEMSAPPLIED MATERIALS, INC.
WO/2021/127086OPTICAL SENSOR WITH TRENCH ETCHED THROUGH DIELECTRIC OVER  SILICONTEXAS INSTRUMENTS INCORPORATED
WO/2021/127218PROCESS FOR PREPARING A CHANNEL REGION OF A THIN-FILM  TRANSISTORSUNRISE MEMORY CORPORATION
WO/2021/221728COOLED SUBSTRATE SUPPORT ASSEMBLY FOR RADIO FREQUENCY  ENVIRONMENTSAPPLIED MATERIALS, INC.
WO/2021/127272SEMICONDUCTOR PROCESSING CHUCKS FEATURING RECESSED REGIONS  NEAR OUTER PERIMETER OF WAFER FOR MITIGATION OF EDGE/CENTER NONUNIFORMITYLAM RESEARCH CORPORATION
WO/2021/146025METHOD OF MAKING A CONTINUOUS CHANNEL BETWEEN 3D CMOSTOKYO ELECTRON LIMITED
WO/2021/127464ULTRA-LOW TEMPERATURE ALD TO FORM HIGH-QUALITY SI-CONTAINING  FILML'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION  DES PROCEDES GEORGES CLAUDE
WO/2021/127467GROUP V ELEMENT-CONTAINING FILM FORMING COMPOSITIONS AND VAPOR  DEPOSITION OF GROUP V ELEMENT-CONTAINING FILML'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION  DES PROCEDES GEORGES CLAUDE
WO/2021/127470AREA SELECTIVE DEPOSITION OF METAL CONTAINING FILMSL'AIR LIQUIDE, SOCIETE ANONYME POUR L'ETUDE ET L'EXPLOITATION  DES PROCEDES GEORGES CLAUDE
WO/2021/127616THROUGH-GATE CO-IMPLANT SPECIES TO CONTROL DOPANT PROFILE IN  TRANSISTORSTEXAS INSTRUMENTS INCORPORATED
WO/2021/150337CARBON NANOTUBE ELECTROSTATIC CHUCKAPPLIED MATERIALS, INC.
WO/2021/188180SIDEWALL PROTECTION LAYER FORMATION FOR SUBSTRATE PROCESSINGTOKYO ELECTRON LIMITED
WO/2021/138132HIGH-THROUGHPUT MULTI-STAGE MANUFACTURING PLATFORM AND METHOD  FOR PROCESSING A PLURALITY OF SUBSTRATESTOKYO ELECTRON LIMITED
WO/2021/138134METHODS AND APPARATUS FOR DIGITAL MATERIAL DEPOSITION ONTO  SEMICONDUCTOR WAFERSTEXAS INSTRUMENTS INCORPORATED
WO/2021/188181METHODS FOR EUV INVERSE PATTERNING IN PROCESSING OF  MICROELECTRONIC WORKPIECESTOKYO ELECTRON LIMITED
WO/2021/194593METHODS TO REDUCE MICROBRIDGE DEFECTS IN EUV PATTERNING FOR  MICROELECTRONIC WORKPIECESTOKYO ELECTRON LIMITED
WO/2021/150346METHODS FOR MAKING DOUBLE-SIDED SEMICONDUCTOR DEVICES AND  RELATED DEVICES, ASSEMBLIES, PACKAGES AND SYSTEMSMICRON TECHNOLOGY, INC.
WO/2021/262236THREE-DIMENSIONAL MEMORY DEVICE CONTAINING LOW RESISTANCE  SOURCE-LEVEL CONTACT AND METHOD OF MAKING THEREOFSANDISK TECHNOLOGIES LLC
WO/2021/252019METHOD AND APPARATUS FOR DEPOSITING A MULTI-SECTOR FILM ON  BACKSIDE OF A SEMICONDUCTOR WAFERSANDISK TECHNOLOGIES LLC
WO/2021/141798CHIP SCALE PACKAGE WITH REDISTRIBUTION LAYER INTERRUPTSTEXAS INSTRUMENTS INCORPORATED
WO/2021/242321SEMICONDUCTOR DIE INCLUDING DIFFUSION BARRIER LAYERS EMBEDDING  BONDING PADS AND METHODS OF FORMING THE SAMESANDISK TECHNOLOGIES LLC
WO/2021/141806AUTOMATED CLEANING OF ROBOT ARMS OF SUBSTRATE PROCESSING  SYSTEMSLAM RESEARCH CORPORATION
WO/2021/236168THREE-DIMENSIONAL MEMORY DEVICE INCLUDING WRAP AROUND WORD  LINES AND METHODS OF FORMING THE SAMESANDISK TECHNOLOGIES LLC
WO/2021/221738THREE-DIMENSIONAL MEMORY DEVICE EMPLOYING THINNED INSULATING  LAYERS AND METHODS FOR FORMING THE SAMESANDISK TECHNOLOGIES LLC
WO/2021/1385283D COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (CMOS) DEVICE AND  METHOD OF FORMING THE SAMETOKYO ELECTRON LIMITED
WO/2021/011945INTEGRATION OF VERTICAL GAN VARACTOR WITH HEMTQUALCOMM INCORPORATED
WO/2021/022275FINFET SEMICONDUCTOR DEVICEQUALCOMM INCORPORATED
WO/2021/011946INTEGRATION OF VERTICAL GAN VARACTOR WITH HEMTQUALCOMM INCORPORATED
WO/2021/007585MELT DETECTION SYSTEMS AND METHODS OF USING THE SAMEVEECO INSTRUMENTS INC.
WO/2021/011950MODULATION OF OXIDATION PROFILE FOR SUBSTRATE PROCESSINGLAM RESEARCH CORPORATION
WO/2021/030822PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING  AN ARTICLECANON KABUSHIKI KAISHA
WO/2021/030823PLANARIZATION PROCESS, APPARATUS AND METHOD OF MANUFACTURING  AN ARTICLECANON KABUSHIKI KAISHA
WO/2021/022291INTEGRATED ADAPTIVE POSITIONING SYSTEMS AND ROUTINES FOR  AUTOMATED WAFER-HANDLING ROBOT TEACH AND HEALTH CHECKLAM RESEARCH CORPORATION
WO/2021/030833MODEL BASED CONTROL OF WAFER NON-UNIFORMITYLAM RESEARCH CORPORATION
WO/2021/035236SUBSTANTIALLY CARBON-FREE MOLYBDENUM-CONTAINING AND  TUNGSTEN-CONTAINING FILMS IN SEMICONDUCTOR DEVICE MANUFACTURINGLAM RESEARCH CORPORATION
WO/2021/030836TUNGSTEN DEPOSITIONLAM RESEARCH CORPORATION
WO/2021/035254REDUCING LINE BENDING DURING METAL FILL PROCESSLAM RESEARCH CORPORATION
WO/2021/046572STIMULUS RESPONSIVE POLYMER FILMS AND FORMULATIONSLAM RESEARCH CORPORATION
WO/2021/141835PROJECTION AND DISTANCE SEGMENTATION ALGORITHM FOR WAFER  DEFECT DETECTIONKLA CORPORATION
WO/2021/201940CYCLIC SELF-LIMITING ETCH PROCESSTOKYO ELECTRON LIMITED
WO/2021/154468WATER SOLUBLE ORGANIC-INORGANIC HYBRID MASK FORMULATIONS AND  THEIR APPLICATIONSAPPLIED MATERIALS, INC.
WO/2021/262249THREE-DIMENSIONAL MEMORY DEVICE INCLUDING III-V COMPOUND  SEMICONDUCTOR CHANNEL LAYER AND METHOD OF MAKING THE SAMESANDISK TECHNOLOGIES LLC
WO/2021/146098MIXED METAL BASEPLATES FOR IMPROVED THERMAL EXPANSION MATCHING  WITH THERMAL OXIDE SPRAYCOATLAM RESEARCH CORPORATION
WO/2021/142357TSV PROCESS WINDOW AND FILL PERFORMANCE ENHANCEMENT BY LONG  PULSING AND RAMPINGLAM RESEARCH CORPORATION
WO/2021/142400ADVANCED IN-LINE PART AVERAGE TESTINGKLA CORPORATION
WO/2021/146123MULTIPLE PATTERNING WITH SELECTIVE MANDREL FORMATIONTOKYO ELECTRON LIMITED
WO/2021/150392GATE ALL AROUND TRANSISTORS WITH HIGH CHARGE MOBILITY CHANNEL  MATERIALSQUALCOMM INCORPORATED
WO/2021/150397FLEXIBLE GAA NANOSHEET HEIGHT AND CHANNEL MATERIALSQUALCOMM INCORPORATED
WO/2021/146229GROUP III HEMT AND CAPACITOR THAT SHARE STRUCTURAL FEATURESCREE, INC.
WO/2021/173243COMPLEMENTARY CELL CIRCUITS EMPLOYING ISOLATION STRUCTURES FOR  DEFECT REDUCTION AND RELATED METHODS OF FABRICATIONQUALCOMM INCORPORATED
WO/2021/150419HIGH-THROUGHPUT DRY ETCHING OF SILICON OXIDE AND SILICON  NITRIDE MATERIALS BY IN-SITU AUTOCATALYST FORMATIONTOKYO ELECTRON LIMITED
WO/2021/158346SHOWERHEAD ASSEMBLYAPPLIED MATERIALS, INC.
WO/2021/146623METHOD FOR ETCHING OR DEPOSITIONENTEGRIS, INC.
WO/2021/178052CAPACITIVE SENSOR FOR CHAMBER CONDITION MONITORINGAPPLIED MATERIALS, INC.
WO/2021/150548EDGE RING TRANSFER WITH AUTOMATED ROTATIONAL PRE-ALIGNMENTLAM RESEARCH CORPORATION
WO/2021/178062NANOWIRE WITH REDUCED DEFECTSMICROSOFT TECHNOLOGY LICENSING, LLC
WO/2021/150625METHOD OF CLEANING A STRUCTURE AND METHOD OF DEPOSITIING A  CAPPING LAYER IN A STRUCTUREAPPLIED MATERIALS, INC.
WO/2021/151067SELECTIVE DEPOSITION OF SICON BY PLASMA ALDAPPLIED MATERIALS, INC.
WO/2021/154640SUBSTRATE TRANSPORT APPARATUSBROOKS AUTOMATION, INC.
WO/2021/154641UV CURE FOR LOCAL STRESS MODULATIONLAM RESEARCH CORPORATION
WO/2021/154653ALLOY FILM ETCHLAM RESEARCH CORPORATION
WO/2021/167754MULTI-STEP PROCESS FOR FLOWABLE GAP-FILL FILMAPPLIED MATERIALS, INC.
WO/2021/154747PERFORMANCE PREDICTORS FOR SEMICONDUCTOR-MANUFACTURING  PROCESSESLAM RESEARCH CORPORATION
WO/2021/154754COMPONENT WITH PROTECTIVE SURFACE FOR PROCESSING CHAMBERLAM RESEARCH CORPORATION
WO/2021/154765SYSTEM AND METHOD FOR SEMICONDUCTOR DEVICE PRINT CHECK  ALIGNMENTKLA CORPORATION
WO/2021/158402ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR  PHOTORESIST-FREE FORMATION OF METAL FEATURESLAM RESEARCH CORPORATION
WO/2021/154899SYSTEM AND METHOD FOR IDENTIFYING LATENT RELIABILITY DEFECTS  IN SEMICONDUCTOR DEVICESKLA CORPORATION
WO/2021/154949WAFER CHUCK WITH THERMAL TUNING CAVITY FEATURESLAM RESEARCH CORPORATION
WO/2021/154957SEMICONDUCTOR CHIP PACKAGE AND METHOD OF ASSEMBLYLITTELFUSE, INC.
WO/2021/178078INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SPLIT, DOUBLE-SIDED  METALLIZATION STRUCTURES TO FACILITATE A SEMICONDUCTOR DIE ("DIE")  MODULE EMPLOYING STACKED DICE, AND RELATED FABRICATION METHODSQUALCOMM INCORPORATED
WO/2021/162871HIGH ASPECT RATIO ETCH WITH INFINITE SELECTIVITYLAM RESEARCH CORPORATION
WO/2021/158482METHOD FOR USING ULTRA-THIN ETCH STOP LAYERS IN SELECTIVE  ATOMIC LAYER ETCHINGTOKYO ELECTRON LIMITED
WO/2021/158608LIGHT-DRIVEN TRANSITION FROM INSULATOR TO CONDUCTORBOWLING GREEN STATE UNIVERSITY
WO/2021/158727METHODS OF FORMING INTEGRATED CIRCUIT DEVICES USING CUTTING  TOOLS TO EXPOSE METALIZATION PADS THROUGH A CAP STRUCTURE AND RELATED CUTTING  DEVICESAKOUSTIS, INC.
WO/2021/158748SELECTIVE DEPOSITION OF CONDUCTIVE CAP FOR FULLY-ALIGNED-VIA  (FAV)TOKYO ELECTRON LIMITED
WO/2021/162932METHODS AND APPARATUS FOR IMPROVING FLOW UNIFORMITY IN A  PROCESS CHAMBERAPPLIED MATERIALS, INC.
WO/2021/158846METHODS FOR PRESSURE RAMPED PLASMA PURGEAPPLIED MATERIALS, INC.
WO/2021/158942SUBSTRATE PROCESSING APPARATUSBROOKS AUTOMATION, INC.
WO/2021/167809CORE REMOVALLAM RESEARCH CORPORATION
WO/2021/188226PLANARIZATION OF SPIN-ON FILMSTOKYO ELECTRON LIMITED
WO/2021/201989HIGH TEMPERATURE MICRO-ZONE ELECTROSTATIC CHUCKAPPLIED MATERIALS, INC.
WO/2021/163202METHOD FOR FORMING COMPONENTS WITHOUT ADDING TABS DURING  ETCHINGHUTCHINSON TECHNOLOGY INCORPORATED
WO/2021/163221OXIDATION INHIBITING GAS IN A MANUFACTURING SYSTEMAPPLIED MATERIALS, INC.
WO/2021/163230LARGE AREA GROUP III NITRIDE CRYSTALS AND SUBSTRATES, METHODS  OF MAKING, AND METHODS OF USESLT TECHNOLOGIES, INC.
WO/2021/216170NITROGEN-DOPED CARBON HARDMASK FILMSAPPLIED MATERIALS, INC.
WO/2021/173360BATCH PROCESSING OVEN AND METHODYIELD ENGINEERING SYSTEMS, INC.
WO/2021/167836HYDROGEN FREE SILICON DIOXIDEAPPLIED MATERIALS, INC.
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WO/2021/163553APPARATUS, SYSTEM AND METHOD FOR PROVIDING A FLIPPER FOR  IN-PROCESS SUBSTRATESJABIL INC.
WO/2021/163664APPARATUS, SYSTEM AND METHOD FOR PROVIDING A SUBSTRATE CHUCKJABIL INC.
WO/2021/167904PARTIAL DISCHARGE SUPPRESSION IN HIGH VOLTAGE SOLID-STATE  DEVICESSAMPAYAN, Stephen
WO/2021/173400FORMING A SEMICONDUCTOR FEATURE USING ATOMIC LAYER ETCHTOKYO ELECTRON LIMITED
WO/2021/168025WAFER LIFT PIN MECHANISM FOR PREVENTING LOCAL BACKSIDE  DEPOSITIONLAM RESEARCH CORPORATION
WO/2021/173421DIELECTRIC ETCH STOP LAYER FOR REACTIVE ION ETCH (RIE) LAG  REDUCTION AND CHAMFER CORNER PROTECTIONTOKYO ELECTRON LIMITED
WO/2021/168134GRAPHENE INTEGRATIONLAM RESEARCH CORPORATION
WO/2021/183270METHODS FOR GAPFILL IN SUBSTRATESAPPLIED MATERIALS, INC.
WO/2021/173498SEMICONDUCTOR PROCESSING CHAMBER WITH DUAL-LIFT MECHANISM FOR  EDGE RING ELEVATION MANAGEMENTLAM RESEARCH CORPORATION
WO/2021/183279SUBSTRATE SUPPORTS INCLUDING BONDING LAYERS WITH STUD ARRAYS  FOR SUBSTRATE PROCESSING SYSTEMSLAM RESEARCH CORPORATION
WO/2021/173557MULTI-LAYER HARDMASK FOR DEFECT REDUCTION IN EUV PATTERNINGLAM RESEARCH CORPORATION
WO/2021/173607RAISED PAD FORMATIONS FOR CONTACTS IN THREE-DIMENSIONAL  STRUCTURES ON MICROELECTRONIC WORKPIECESTOKYO ELECTRON LIMITED
WO/2021/173682TRANSMISSION-BASED TEMPERATURE MEASUREMENT OF A WORKPIECE IN A  THERMAL PROCESSING SYSTEMMATTSON TECHNOLOGY, INC.
WO/2021/173685SUPPORT STRUCTURE FOR THERMAL PROCESSING SYSTEMSMATTSON TECHNOLOGY, INC.
WO/2021/178192CHILLER MAKE-BREAK CONNECTOR FOR SUBSTRATE PROCESSING SYSTEMSLAM RESEARCH CORPORATION
WO/2021/173788CU<sb>3</sb>SN VIA METALLIZATION IN ELECTRICAL  DEVICES FOR LOW-TEMPERATURE 3D-INTEGRATIONRAYTHEON COMPANY
WO/2021/173876SERVO CONTROL OF A LIFT APPARATUS AND METHODS OF USE THEREOFAPPLIED MATERIALS, INC.
WO/2021/173886THERMAL ICEFILL AND RECESS ETCH MATCHINGLAM RESEARCH CORPORATION
WO/2021/178249METHOD TO PRODUCE GRAPHENE AND METAL-GRAPHENE COMPOSITE FILMS  USING MICROPLASMA-BASED SYNTHESISWEST VIRGINIA UNIVERSITY
WO/2021/174137LOW ETCH PIT DENSITY, LOW SLIP LINE DENSITY, AND LOW STRAIN  INDIUM PHOSPHIDEAXT, INC.
WO/2021/178266LINEAR ARRANGEMENT FOR SUBSTRATE PROCESSING TOOLSLAM RESEARCH CORPORATION
WO/2021/178267PEDESTAL INCLUDING PEDESTAL PLATES FOR SEMICONDUCTOR FAB TOOLS  AND METHOD FOR ORIENTING THE PEDESTAL PLATESLAM RESEARCH CORPORATION
WO/2021/178270ADAPTER PLATE TO ATTACH TURBO PUMPS TO PROCESS MODULESLAM RESEARCH CORPORATION
WO/2021/178310CONTROL OF WAFER BOW DURING INTEGRATED CIRCUIT PROCESSINGLAM RESEARCH CORPORATION
WO/2021/178341LAMINATE STACKED ON DIE FOR HIGH VOLTAGE ISOLATION CAPACITORTEXAS INSTRUMENTS INCORPORATED
WO/2021/202029INSPECTION SYSTEMAPPLIED MATERIALS, INC.
WO/2021/178399ATOMIC LAYER ETCHING OF MOLYBDENUMLAM RESEARCH CORPORATION
WO/2021/242345SAG NANOWIRE GROWTH WITH ION IMPLANTATIONMICROSOFT TECHNOLOGY LICENSING, LLC
WO/2021/242346SAG NANOWIRE GROWTH WITH A PLANARIZATION PROCESSMICROSOFT TECHNOLOGY LICENSING, LLC
WO/2021/178436DISPENSING APPARATUSILLINOIS TOOL WORKS INC.
WO/2021/183332LONG WAVE INFRARED THERMAL SENSOR FOR INTEGRATION INTO TRACK  SYSTEMTOKYO ELECTRON LIMITED
WO/2021/178478LOW TEMPERATURE STEAM FREE OXIDE GAPFILLAPPLIED MATERIALS, INC.
WO/2021/178703MANIFOLD FOR A SUBSTRATE CONTAINERENTEGRIS, INC.
WO/2021/194724LOAD LOCK WITH INTEGRATED FEATURESAPPLIED MATERIALS, INC.
WO/2021/202059LIGHT EMITTING DEVICE WITH SMALL FOOTPRINTHERNER, Scott, Brad
WO/2021/183472METAL DEPOSITION PROCESSESFUJIFILM ELECTRONIC MATERIALS U.S.A., INC.
WO/2021/188325DETERMINING METROLOGY-LIKE INFORMATION FOR A SPECIMEN USING AN  INSPECTION TOOLKLA CORPORATION
WO/2021/183621SELECTIVE OXIDATION AND SIMPLIFIED PRE-CLEANAPPLIED MATERIALS, INC.
WO/2021/188339SYSTEM AND METHODS FOR WAFER DRYINGTOKYO ELECTRON LIMITED
WO/2021/202070HIGH ASPECT RATIO DIELECTRIC ETCH WITH CHLORINELAM RESEARCH CORPORATION
WO/2021/183728GAP FILL METHODS USING CATALYZED DEPOSITIONAPPLIED MATERIALS, INC.
WO/2021/194752LOAD LOCK WITH INTEGRATED FEATURESAPPLIED MATERIALS, INC.
WO/2021/188352PLANARIZING ORGANIC FILMSTOKYO ELECTRON LIMITED
WO/2021/242355METHODS OF MODIFYING PORTIONS OF LAYER STACKSAPPLIED MATERIALS, INC.
WO/2021/202080EDGE RING FOR LOCALIZED DELIVERY OF TUNING GASLAM RESEARCH CORPORATION
WO/2021/194768FEATURE FILL WITH NUCLEATION INHIBITIONLAM RESEARCH CORPORATION
WO/2021/194776CATALYTIC FORMATION OF BORON AND CARBON FILMSAPPLIED MATERIALS, INC.
WO/2021/194780SUBSTRATE HOLDER FOR USE WITH INTERFEROMETERCORNING INCORPORATED
WO/2021/194782POSITIONING DEVICES FOR RADIALLY POSITIONING SUBSTRATES WITH  RESPECT TO AN AIR BEARING DEVICECORNING INCORPORATED
WO/2021/236213BACKSIDE DEPOSITON TUNING OF STRESS TO CONTROL WAFER BOW IN  SEMICONDUCTOR PROCESSINGTOKYO ELECTRON LIMITED
WO/2021/188581CALIBRATION OF AN ELECTRONICS PROCESSING SYSTEMAPPLIED MATERIALS, INC.
WO/2021/188605SHEATH AND TEMPERATURE CONTROL OF A PROCESS KIT IN A SUBSTRATE  PROCESSING CHAMBERAPPLIED MATERIALS, INC.
WO/2021/230980SELECTIVE DEPOSITION OF CARBON ON PHOTORESIST LAYER FOR  LITHOGRAPHY APPLICATIONSAPPLIED MATERIALS, INC.
WO/2021/188752MOLDED SEMICONDUCTOR CHIP PACKAGE WITH STAIR-STEP MOLDING  LAYERADVANCED MICRO DEVICES, INC.
WO/2021/189000SUBSTRATE TRANSFER SYSTEMS AND METHODS OF USE THEREOFAPPLIED MATERIALS, INC.
WO/2021/202136COOLED EDGE RING WITH INTEGRATED SEALSLAM RESEARCH CORPORATION
WO/2021/194974SUBSTRATE PROCESSING SYSTEM CARRIERAPPLIED MATERIALS, INC.
WO/2021/194977ENCLOSURE SYSTEM SHELFAPPLIED MATERIALS, INC.
WO/2021/206898BOTTOM PURGE FOR SEMICONDUCTOR PROCESSING SYSTEMAPPLIED MATERIALS, INC.
WO/2021/202171RAPID AND PRECISE TEMPERATURE CONTROL FOR THERMAL ETCHINGLAM RESEARCH CORPORATION
WO/2021/195190IN-SITU WAFER THICKNESS AND GAP MONITORING USING THROUGH BEAM  LASER SENSORLAM RESEARCH CORPORATION
WO/2021/202193METHOD OF PATTERNING A METAL FILM WITH IMPROVED SIDEWALL  ROUGHNESSTOKYO ELECTRON LIMITED
WO/2021/202229PROCESSING OF WORKPIECES USING FLUOROCARBON PLASMAMATTSON TECHNOLOGY, INC.
WO/2021/195463PACKAGED ELECTRONIC DEVICE WITH SPLIT DIE PAD IN ROBUST  PACKAGE SUBSTRATETEXAS INSTRUMENTS INCORPORATED
WO/2021/195476DECK BOARD APPARATUS AND METHOD OF MAKING SAMESTRONGWELL CORPORATION
WO/2021/221839ELECTROSTATIC CLAMPING SYSTEM AND METHODAPPLIED MATERIALS, INC.
WO/2021/221841SYSTEM AND METHOD FOR LIQUID DISPENSE AND COVERAGE CONTROLTOKYO ELECTRON LIMITED
WO/2021/195595INDIUM GALLIUM NITRIDE LIGHT EMITTING DIODES WITH REDUCED  STRAINGOOGLE LLC
WO/2021/206939SEMICONDUCTOR SUBSTRATE SUPPORT WITH INTERNAL CHANNELSAPPLIED MATERIALS, INC.
WO/2021/206940SLIDE AND PIVOT ASSEMBLIES FOR PROCESS MODULE BIAS ASSEMBLIES  OF SUBSTRATE PROCESSING SYSTEMSLAM RESEARCH CORPORATION
WO/2021/195607HIGH VOLTAGE ISOLATION BARRIER WITH ELECTRIC OVERSTRESS  INTEGRITYTEXAS INSTRUMENTS INCORPORATED
WO/2021/202411SELECTIVE PRECISION ETCHING OF SEMICONDUCTOR MATERIALSLAM RESEARCH CORPORATION
WO/2021/206950CERAMIC ADDITIVE MANUFACTURING TECHNIQUES FOR GAS INJECTORSLAM RESEARCH CORPORATION
WO/2021/202611SLIT VALVE PNEUMATIC CONTROLAPPLIED MATERIALS, INC.
WO/2021/221849HIGH PERFORMANCE MULTI-DIMENSIONAL DEVICE AND LOGIC  INTEGRATIONTOKYO ELECTRON LIMITED
WO/2021/221850ADAPTIVE GEOMETRY FOR OPTIMAL FOCUSED ION BEAM ETCHINGAPPLIED MATERIALS ISRAEL LTD.
WO/2021/202741METHODS AND SYSTEMS OF FORMING METAL INTERCONNECT LAYERSMAVLIEV, Rashid
WO/2021/202808SEAM MITIGATION AND INTEGRATED LINER FOR GAP FILLLAM RESEARCH CORPORATION
WO/2021/202911METHOD OF FORMING HOLES FROM BOTH SIDES OF SUBSTRATEAPPLIED MATERIALS, INC.
WO/2021/203000DUAL GATE AND SINGLE ACTUATOR SYSTEMAPPLIED MATERIALS, INC.
WO/2021/203021PROGRAMMABLE NANOLITHOGRAPHY MASKMASSACHUSETTS INSTITUTE OF TECHNOLOGY
WO/2021/221862SYSTEMS AND METHODS TO CONTROL CRITICAL DIMENSION (CD) SHRINK  RATIO THROUGH RADIO FREQUENCY (RF) PULSINGTOKYO ELECTRON LIMITED
WO/2021/207286SELECTIVE ETCH USING DEPOSITION OF A METALLOID OR METAL  CONTAINING HARDMASKLAM RESEARCH CORPORATION
WO/2021/216283NOVEL METHODS FOR GAS PHASE SELECTIVE ETCHING OF  SILICON-GERMANIUM LAYERSPRAXAIR TECHNOLOGY, INC.
WO/2021/207537METHODS FOR SELECTIVE DEPOSITION OF TUNGSTEN ATOP A DIELECTRIC  LAYER FOR BOTTOM UP GAPFILLAPPLIED MATERIALS, INC.
WO/2021/207608HIGH TEMPERATURE VACUUM SEALAPPLIED MATERIALS, INC.
WO/2021/221886HEATER COVER PLATE FOR UNIFORMITY IMPROVEMENTAPPLIED MATERIALS, INC.
WO/2021/211397THERMALLY CONTROLLED LID STACK COMPONENTSAPPLIED MATERIALS, INC.
WO/2021/231008FLOATING PIN FOR SUBSTRATE TRANSFERAPPLIED MATERIALS, INC.
WO/2021/211429SYSTEMS FOR INTEGRATED DECOMPOSITION AND SCANNING OF A  SEMICONDUCTING WAFERELEMENTAL SCIENTIFIC, INC.
WO/2021/211480MINI-ENVIRONMENT SYSTEM FOR CONTROLLING OXYGEN AND HUMIDITY  LEVELS WITHIN A SAMPLE TRANSPORT DEVICEKLA CORPORATION
WO/2021/211486METHODS AND APPARATUS FOR INTEGRATED COBALT DISILICIDE  FORMATIONAPPLIED MATERIALS, INC.
WO/2021/225759MULTI-ZONE PLATEN TEMPERATURE CONTROLAPPLIED MATERIALS, INC.
WO/2021/211528METHODS OF DIELECTRIC MATERIAL FILL AND TREATMENTAPPLIED MATERIALS, INC.
WO/2021/211536VALVE APPARATUSES AND RELATED METHODS FOR REACTIVE PROCESS GAS  ISOLATION AND FACILITATING PURGE DURING ISOLATIONMKS INSTRUMENTS, INC.
WO/2021/211844INTEGRATED SYSTEM-IN-PACKAGE WITH RADIATION SHIELDINGTEXAS INSTRUMENTS INCORPORATED
WO/2021/242433GENERATING A LOW-TEMPERATURE SUBSTRATE PROTECTIVE LAYERLAM RESEARCH CORPORATION
WO/2021/211988TARGET FOR OPTICAL MEASUREMENT OF TRENCHESONTO INNOVATION INC.
WO/2021/216453COMPLIANCE COMPONENTS FOR SEMICONDUCTOR PROCESSING SYSTEMAPPLIED MATERIALS, INC.
WO/2021/216455CRYSTALLINE DIELECTRIC SYSTEMS FOR INTERCONNECT CIRCUIT  MANUFACTURINGTOKYO ELECTRON LIMITED
WO/2021/216462ENHANCED CLOSED LOOP GAS BASED HEAT EXCHANGELAM RESEARCH CORPORATION
WO/2021/225774EXPANDABLE DOPED OXIDE FILMS FOR ADVANCED SEMICONDUCTOR  APPLICATIONSLAM RESEARCH CORPORATION
WO/2021/216520THERMAL INTERFACE FOR THERMAL LEVELERMOMENTIVE PERFORMANCE MATERIALS QUARTZ, INC.
WO/2021/216557METHODS AND APPARATUS FOR REDUCING DEFECTS IN PRECLEAN  CHAMBERSAPPLIED MATERIALS, INC.
WO/2021/231046METHOD OF TUNING FILM PROPERTIES OF METAL NITRIDE USING PLASMAAPPLIED MATERIALS, INC.
WO/2021/225790INERT GAS IMPLANTATION FOR HARD MASK SELECTIVITY IMPROVEMENTLAM RESEARCH CORPORATION
WO/2021/257180INTEGRATED TRANSISTORS WITH SHARED ELECTRODEMACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC.
WO/2021/225818III-V COMPOUND SEMICONDUCTOR DIES WITH STRESS-TREATED INACTIVE  SURFACES AND MANUFACTURING METHODS THEREOFQUALCOMM INCORPORATED
WO/2021/257185CRYOGENIC ATOMIC LAYER ETCH WITH NOBLE GASESAPPLIED MATERIALS, INC.
WO/2021/247168METHODS AND APPARATUS FOR PRECLEANING AND TREATING WAFER  SURFACESAPPLIED MATERIALS, INC.
WO/2021/225860PACKAGED TRANSISTOR WITH CHANNELED DIE ATTACH MATERIALS AND  PROCESS OF IMPLEMENTING THE SAMEWOLFSPEED, INC.
WO/2021/222603RETICLE POD SEALINGENTEGRIS, INC.
WO/2021/225880SELECTIVE MOLD PLACEMENT ON INTEGRATED CIRCUIT (IC) PACKAGES  AND METHODS OF FABRICATINGQUALCOMM INCORPORATED
WO/2021/225883SEAMLESS GAP FILL WITH DIELECTRIC ALD FILMSAPPLIED MATERIALS, INC.
WO/2021/247175MID-CHAMBER FLOW OPTIMIZERLAM RESEARCH CORPORATION
WO/2021/231122METHODS TO IMPROVE WAFER WETTABILITY FOR PLATING - ENHANCEMENT  THROUGH SENSORS AND CONTROL ALGORITHMSLAM RESEARCH CORPORATION
WO/2021/231127EVAPORATIVE COOLING OF ELECTROSTATIC CHUCKSLAM RESEARCH CORPORATION
WO/2021/226016MULTIPLE PATTERNING WITH ORGANOMETALLIC PHOTOPATTERNABLE  LAYERS WITH INTERMEDIATE FREEZE STEPSINPRIA CORPORATION
WO/2021/231138AUTOMATED FEEDFORWARD AND FEEDBACK SEQUENCE FOR PATTERNING CD  CONTROLLAM RESEARCH CORPORATION
WO/2021/226170BINARY METAL LINER LAYERSAPPLIED MATERIALS, INC.
WO/2021/226203MULTI-STEP PRE-CLEAN FOR SELECTIVE METAL GAP FILLAPPLIED MATERIALS, INC.
WO/2021/252104SUBSTRATE COMPRISING A HIGH-DENSITY INTERCONNECT PORTION  EMBEDDED IN A CORE LAYERQUALCOMM INCORPORATED
WO/2021/252107METHOD TO FORM NARROW SLOT CONTACTSTOKYO ELECTRON LIMITED
WO/2021/252108METHOD OF MAKING 3D ISOLATIONTOKYO ELECTRON LIMITED
WO/2021/226280FRONT SURFACE AND BACK SURFACE ORIENTATION DETECTION OF  TRANSPARENT SUBSTRATEAPPLIED MATERIALS, INC.
WO/2021/226287METHODS AND SYSTEMS FOR TEMPERATURE CONTROL FOR A SUBSTRATEAPPLIED MATERIALS, INC.
WO/2021/231157SYSTEM, METHOD, AND TARGET FOR WAFER ALIGNMENTKLA CORPORATION
WO/2021/236359SYSTEMS AND METHODS FOR SELECTIVE ION MASS SEGREGATION IN  PULSED PLASMA ATOMIC LAYER ETCHINGTOKYO ELECTRON LIMITED
WO/2021/231215APPARATUS AND METHODS FOR REAL-TIME WAFER CHUCKING DETECTIONAPPLIED MATERIALS, INC.
WO/2021/231306RESIDUE-FREE REMOVAL OF STIMULUS RESPONSIVE POLYMERS FROM  SUBSTRATESLAM RESEARCH CORPORATION
WO/2021/231307CONTROLLED DEGRADATION OF A STIMULI-RESPONSIVE POLYMER FILMLAM RESEARCH CORPORATION
WO/2021/231456METHOD FOR DRY ETCHING SILICON CARBIDE FILMS FOR RESIST  UNDERLAYER APPLICATIONSTOKYO ELECTRON LIMITED
WO/2021/231469ELECTROSTATIC CHUCK HAVING A GAS FLOW FEATURE, AND RELATED  METHODSENTEGRIS, INC.
WO/2021/231525SOLDER TRENCHNOKIA TECHNOLOGIES OY
WO/2021/231537SEAL RETAINER FOR A COMPONENT ASSEMBLY AND METHOD OF  INSTALLING A COMPONENT INTO AN APPARATUS FOR CONTROLLING FLOWICHOR SYSTEMS, INC.
WO/2021/257208METHOD FOR REDUCING LATERAL FILM FORMATION IN AREA SELECTIVE  DEPOSITIONTOKYO ELECTRON LIMITED
WO/2021/231629HIGH FREQUENCY RF GENERATOR AND DC PULSINGEAGLE HARBOR TECHNOLOGIES, INC.
WO/2021/236406SEAL INSERTION TOOL FOR A FLUID DELIVERY MODULE AND METHOD OF  INSTALLING A SEAL INTO A FLUID DELIVERY MODULEICHOR SYSTEMS, INC.
WO/2021/262340RADIATION OF SUBSTRATES DURING PROCESSING AND SYSTEMS THEREOFTOKYO ELECTRON LIMITED
WO/2021/236493DIRECTIONAL SELECTIVE JUNCTION CLEAN WITH FIELD POLYMER  PROTECTIONSAPPLIED MATERIALS, INC.
WO/2021/236886WET FUNCTIONALIZATION OF DIELECTRIC SURFACESLAM RESEARCH CORPORATION
WO/2021/262352AUTOMATIC KERF OFFSET MAPPING AND CORRECTION SYSTEM FOR LASER  DICINGAPPLIED MATERIALS, INC.
WO/2021/237032LOW RESISTIVITY CONTACTS AND INTERCONNECTSLAM RESEARCH CORPORATION
WO/2021/262361LASER SCRIBING TRENCH OPENING CONTROL IN WAFER DICING USING  HYBRID LASER SCRIBING AND PLASMA ETCH APPROACHAPPLIED MATERIALS, INC.
WO/2021/237175METHOD FOR PATTERN REDUCTION USING A STAIRCASE SPACERTOKYO ELECTRON LIMITED
WO/2021/242658TRANSFERRING LARGE-AREA GROUP III-NITRIDE SEMICONDUCTOR  MATERIAL AND DEVICES TO ARBITRARY SUBSTRATESTHE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED  BY THE SECRETARY OF THE NAVY
WO/2021/257254SEMICONDUCTOR SUBSTRATE POLISHING WITH POLISHING PAD  TEMPERATURE CONTROLGLOBALWAFERS CO., LTD.
WO/2021/262371SURFACE MODIFICATION FOR METAL-CONTAINING PHOTORESIST  DEPOSITIONLAM RESEARCH CORPORATION
WO/2021/242781VARIABLE LOOP CONTROL FEATUREAPPLIED MATERIALS, INC.
WO/2021/243161MECHANICAL PUNCHED VIA FORMATION IN ELECTRONICS PACKAGE AND  ELECTRONICS PACKAGE FORMED THEREBYGENERAL ELECTRIC COMPANY
WO/2021/2432253D ELECTRICAL INTEGRATION USING COMPONENT CARRIER EDGE  CONNECTIONS TO A 2D CONTACT ARRAYFORM FACTOR, INC.
WO/2021/243325ROBOT FOR HIGH-TEMPERATURE APPLICATIONSPERSIMMON TECHNOLOGIES CORPORATION
WO/2021/247573DIAGNOSTIC DISC WITH A HIGH VACUUM AND TEMPERATURE TOLERANT  POWER SOURCEAPPLIED MATERIALS, INC.
WO/2021/247586DIAGNOSTIC DISC WITH A HIGH VACUUM AND TEMPERATURE TOLERANT  POWER SOURCEAPPLIED MATERIALS, INC.
WO/2021/247592IN-FEATURE WET ETCH RATE RATIO REDUCTIONLAM RESEARCH CORPORATION
WO/2021/247627MONOBLOC PEDESTAL FOR EFFICIENT HEAT TRANSFERLAM RESEARCH CORPORATION
WO/2021/252229FULLY SELF-ALIGNED SUBTRACTIVE ETCHAPPLIED MATERIALS, INC.
WO/2021/247633IC DEVICE WITH CHIP TO PACKAGE INTERCONNECTS FROM A COPPER  METAL INTERCONNECT LEVELTEXAS INSTRUMENTS INCORPORATED
WO/2021/252246IMAGE ALIGNMENT SETUP FOR SPECIMENS WITH INTRA- AND  INTER-SPECIMEN VARIATIONS USING UNSUPERVISED LEARNING AND ADAPTIVE DATABASE  GENERATION METHODSKLA CORPORATION
WO/2021/252276PEDESTAL THERMAL PROFILE TUNING USING MULTIPLE HEATED ZONES  AND THERMAL VOIDSLAM RESEARCH CORPORATION
WO/2021/247979FLUORINE-FREE TUNGSTEN ALD FOR DIELECTRIC SELECTIVITY  IMPROVEMENTAPPLIED MATERIALS, INC.
WO/2021/248099A-AXIS JOSEPHSON JUNCTIONS WITH IMPROVED SMOOTHNESSAMBATURE, INC.
WO/2021/257301FORMING A SEMICONDUCTOR DEVICE USING A PROTECTIVE LAYERTOKYO ELECTRON LIMITED
WO/2021/257311A FINFET WITH LATERAL CHARGE BALANCE AT THE DRAIN DRIFT REGIONTEXAS INSTRUMENTS INCORPORATED
WO/2021/257317GATE INTERFACE ENGINEERING WITH DOPED LAYERAPPLIED MATERIALS, INC.
WO/2021/252758FLAT BOTTOM SHADOW RINGLAM RESEARCH CORPORATION
WO/2021/252826SURFACE PROFILE MAPPING FOR EVALUATING III-N DEVICE  PERFORMANCE AND YIELDTHE GOVERNMENT OF THE UNITED STATES OF AMERICA, as represented  by THE SECRETARY OF THE NAVY
WO/2021/257392METHOD FOR AREA SELECTIVE DEPOSITION USING A SURFACE CLEANING  PROCESSTOKYO ELECTRON LIMITED
WO/2021/257396METHOD FOR NUCLEATION OF CONDUCTIVE NITRIDE FILMSENTEGRIS, INC.
WO/2021/252967THIN FILM, IN-SITU MEASUREMENT THROUGH TRANSPARENT CRYSTAL AND  TRANSPARENT SUBSTRATE WITHIN PROCESSING CHAMBER WALLAPPLIED MATERIALS, INC.
WO/2021/257440METHODS AND APPARATUS FOR SEMI-DYNAMIC BOTTOM UP REFLOWAPPLIED MATERIALS, INC.
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