2021年半导体组件与集成电路领域在欧专利的布局与竞争——LG显示公司、三星显示公司、京东方科技集团公司领先
2022-10-21 17:58
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█武汉大学科教管理与评价研究中心 陈立新 张琳 黄颖
第三部分 2021年欧洲专利统计分析报告
28 各领域的欧洲专利布局和竞争
28.41 半导体组件与集成电路领域的欧洲专利竞争态势
第41个技术领域是半导体组件与集成电路。2021年，欧洲专利局在该领域共授权专利955项（增长率为-10%），占总授权量的0.9%，是专利数量第45多的领域。
2021年，美国在该领域获得专利权199项，占该领域专利授权总量的20.8%。中国在该领域做出专利发明86项，获得专利权86项。日本和韩国获得的专利权数量分别为189和178项。
表28.41-1 2021年各国半导体组件与集成电路领域的在欧专利发明和专利权数量
国家 和地区 | 发明 数量 | 专利权 数量 | 净流失 数量 | 专利 流失率 | 发明 份额 | 专利权 份额 | 份额 流失量 | |
1 | 美国 | 183 | 199 | -16 | -8.7% | 19.2% | 20.8% | -1.7% |
2 | 德国 | 77 | 68 | 9 | 11.7% | 8.1% | 7.1% | 0.9% |
3 | 日本 | 191 | 189 | 2 | 1.0% | 20.0% | 19.8% | 0.2% |
4 | 法国 | 68 | 71 | -3 | -4.4% | 7.1% | 7.4% | -0.3% |
5 | 中国 | 86 | 86 | 0 | 0.0% | 9.0% | 9.0% | 0.0% |
6 | 韩国 | 177 | 178 | -1 | -0.6% | 18.5% | 18.6% | -0.1% |
7 | 英国 | 20 | 12 | 8 | 40.0% | 2.1% | 1.3% | 0.8% |
8 | 意大利 | 13 | 5 | 8 | 61.5% | 1.4% | 0.5% | 0.8% |
9 | 荷兰 | 17 | 25 | -8 | -47.1% | 1.8% | 2.6% | -0.8% |
10 | 瑞士 | 17 | 21 | -4 | -23.5% | 1.8% | 2.2% | -0.4% |
11 | 瑞典 | 4 | 3 | 1 | 25.0% | 0.4% | 0.3% | 0.1% |
12 | 加拿大 | 3 | 2 | 1 | 33.3% | 0.3% | 0.2% | 0.1% |
13 | 以色列 | 5 | 4 | 1 | 20.0% | 0.5% | 0.4% | 0.1% |
14 | 印度 | 1 | 1 | 0 | 0.0% | 0.1% | 0.1% | 0.0% |
15 | 其他 | 93 | 91 | 2 | 2.2% | 9.7% | 9.5% | 0.2% |
小计 | 955 | 955 | 0 | 0% | 100% | 100% | 0% |
注：本表分别按照专利第一发明人和第一权利人进行统计（中国的数据暂未包含香港、澳门、台湾地区的专利）。
图28.41-1 2021年各国半导体组件与集成电路领域的在欧专利发明和专利权数量对比
2021年，在半导体组件与集成电路领域上获得欧洲专利授权最多的机构是LG显示公司、三星显示公司、京东方科技集团公司。
表28.41-2 2021年半导体组件与集成电路领域在欧专利授权前10机构
机构名称 | 国家 | 机构英文名称 | 2021 | |
1 | LG显示公司 | 韩国 | LG DISPLAY CO LTD | 68 |
2 | 三星显示公司 | 韩国 | SAMSUNG DISPLAY CO LTD | 54 |
3 | 京东方科技集团公司 | 中国 | BOE TECHNOLOGY GROUP CO LTD | 43 |
4 | 法国原子能委员会 | 法国 | COMMISSARIAT ENERGIE ATOMIQUE | 23 |
5 | 三星电子公司 | 韩国 | SAMSUNG ELECTRONICS CO LTD | 22 |
6 | 美光科技有限公司 | 美国 | MICRON TECHNOLOGY INC | 18 |
7 | 罗伯特博世公司 | 德国 | BOSCH GMBH ROBERT | 17 |
8 | 高通公司 | 美国 | QUALCOMM INC | 17 |
9 | 英特尔公司 | 美国 | INTEL CORP | 16 |
10 | 索尼公司 | 日本 | SONY CORP | 13 |
注：本表数据按照第一权利人进行统计。
图28.41-2 2021年半导体组件与集成电路领域在欧专利授权前10机构
致谢
感谢大连理工大学刘则渊教授、河南师范大学梁立明教授、科技部中国科学技术发展战略研究院武夷山研究员、大连理工大学丁堃教授、大连理工大学杨中楷教授对本报告的大力支持与帮助。同时，向以不同形式对本报告提出意见和建议的专家学者们表示诚挚的感谢。
如需要中美欧日韩五局及PCT专利数据、专利报告，以及咨询相关专利问题请添加微信号。
附表 2021年该领域欧洲授权专利
| PATENT NO. | TITLE | ASSIGNEE |
| EP1611484 | PHOTOACTIVE COMPONENT COMPRISING ORGANIC LAYERS | UNIV DRESDEN TECH |
| EP1981063 | PROCESS FOR PRODUCING SOI WAFER AND SOI WAFER | SHINETSU CHEMICAL CO |
| EP1981064 | PROCESS FOR PRODUCING SOI WAFER AND SOI WAFER | SHINETSU CHEMICAL CO |
| EP2056359 | PV wind performance enhancing method and apparatus | SUNPOWER CORP SYSTEMS |
| EP2133917 | Semiconductor integrated circuit comprising mutli-threshold CMOS (MTCMOS) and non-MTCMOS circuit cells in the same circuit block | SONY CORP |
| EP2137772 | LIGHT SOURCE DEVICE AND DISPLAY DEVICE HAVING THE SAME | LG INNOTEK CO LTD |
| EP2164269 | SOLID-STATE IMAGE SENSOR AND IMAGING APPARATUS EQUIPPED WITH SOLID-STATE IMAGE SENSOR | NIKON CORP |
| EP2225783 | SEMICONDUCTOR LIGHT EMITTING DEVICE | LG INNOTEK CO LTD |
| EP2239776 | High voltage low current surface emitting LED | CREE INC |
| EP2284897 | Demodulation pixel incorporating majority carrier current, buried channel and high-low junction | BUETTGEN BERNHARD |
| EP2311092 | LIGHT FIELD IMAGE SENSOR, METHOD AND APPLICATIONS | UNIV CORNELL |
| EP2313900 | SUBSTRATE WITH EMBEDDED PATTERNED CAPACITANCE | KEMET ELECTRONICS CORP |
| EP2313924 | GROUNDING SYSTEM AND APPARATUS | JOHNSON CONTROLS TECH CO |
| EP2319081 | METHOD AND APPARATUS FOR FORMING I/O CLUSTERS IN INTEGRATED CIRCUITS | QUALCOMM INC |
| EP2320464 | Photodiode array, method for manufacturing photodiode array, epitaxial wafer, and method for manufacturing epitaxial wafer | SUMITOMO ELECTRIC INDUSTRIES |
| EP2348545 | Manufacturing method for flexible device, flexible device, solar cell, and light emitting device | LG SILTRON INC |
| EP2351872 | TREATMENT METHOD USING PLASMA | TOKYO INST TECH |
| EP2365530 | Organic light-emitting display apparatus | SAMSUNG MOBILE DISPLAY CO LTD |
| EP2372767 | Method and apparatus for forming I/O clusters in integrated circuits | QUALCOMM INC |
| EP2385556 | Photoactive device with organic layers | HELIATEK GMBH |
| EP2392029 | MAGNETIC TUNNEL JUNCTION COMPRISING A TUNNEL BARRIER, PINNED LAYER AND TOP ELECTRODE FORMED IN A DAMASCENE-TYPE PROCESS | QUALCOMM INC |
| EP2407013 | ELECTRICALLY CONDUCTIVE PINS FOR MICROCIRCUIT TESTER | JOHNSTECH INT CORP |
| EP2409330 | SELECTIVE FABRICATION OF HIGH-CAPACITANCE INSULATOR FOR A METAL-OXIDE-METAL CAPACITOR | QUALCOMM INC |
| EP2413355 | An interconnect that eliminates routing congestion and manages simultaneous transactions | SONICS INC |
| EP2413361 | BACK-ILLUMINATED SOLID-STATE IMAGE PICKUP DEVICE | HAMAMATSU PHOTONICS KK |
| EP2427909 | PANELIZED BACKSIDE PROCESSING FOR THIN SEMICONDUCTORS | QUALCOMM INC |
| EP2463962 | Contact element, connecting system and method for electrically connecting a contact wire with a conductor board | BOSCH GMBH ROBERT |
| EP2469591 | Method for fabricating a semiconductor device package | GEN ELECTRIC |
| EP2499639 | MEMORY ARRAYS AND ASSOCIATED METHODS OF MANUFACTURING | MICRON TECHNOLOGY INC |
| EP2517459 | INTENSITY ESTIMATION USING BINARY SENSOR ARRAY WITH SPATIALLY VARYING THRESHOLDS | NOKIA CORP |
| EP2534690 | SYSTEMS AND METHODS FOR A CONTINUOUS-WELL DECOUPLING CAPACITOR | ADVANCED MICRO DEVICES INC |
| EP2548227 | TECHNIQUES FOR PROVIDING A SEMICONDUCTOR MEMORY DEVICE | MICRON TECHNOLOGY INC |
| EP2551905 | SRAM with driver transistor distributed over different active areas | RENESAS ELECTRONICS CORP |
| EP2553727 | SURFACE-EMITTING SEMICONDUCTOR LIGHT-EMITTING DIODE | JENOPTIK POLYMER SYSTEMS GMBH |
| EP2559066 | DUAL-SIDE INTERCONNECTED CMOS FOR STACKED INTEGRATED CIRCUITS | QUALCOMM INC |
| EP2566313 | MANUFACTURING-WORK MACHINE AND MANUFACTURING-WORK SYSTEM | FUJI MACHINE MFG |
| EP2568505 | Display and electronic unit | SONY CORP |
| EP2572380 | METHOD FOR PRODUCING CHIP STACKS, AND A CARRIER FOR CARRYING OUT THE METHOD | EV GROUP E THALLNER GMBH |
| EP2579313 | Organic light emitting diode display device and method of fabricating the same | LG DISPLAY CO LTD |
| EP2582213 | FLOW CHANNEL MEMBER, HEAT EXCHANGER USING SAME, AND ELECTRONIC COMPONENT DEVICE | KYOCERA CORP |
| EP2587531 | CURRENT CONTROL SEMICONDUCTOR DEVICE AND CONTROL APPARATUS USING SAME | HITACHI AUTOMOTIVE SYSTEMS LTD |
| EP2592913 | Direct contacting of an energy storage device or a load with an electronic load switch | FRAUNHOFER GES FORSCHUNG |
| EP2595462 | Layered composite circuit with integrated components which are accessible from outside | HOFMANN THOMAS |
| EP2598804 | ARRAY COLUMN INTEGRATOR | LIFE TECHNOLOGIES CORP |
| EP2599126 | SEMICONDUCTOR DEVICES WITH 2DEG AND 2DHG | UNIV SHEFFIELD |
| EP2608641 | Device for protecting an electronic printed circuit board. | INGENICO SA |
| EP2612358 | BUFFER DIE IN STACKS OF MEMORY DIES AND METHODS | MICRON TECHNOLOGY INC |
| EP2618376 | Solid-state image sensor | CANON KK |
| EP2618379 | Organic light emitting display device | SAMSUNG DISPLAY CO LTD |
| EP2628196 | LIGHT EMITTING DEVICES AND METHODS | CREE INC |
| EP2629340 | Semiconductor structure for a radiation detector based on the avalanche effect and radiation detector | FIRST SENSOR AG |
| EP2635097 | An electric and/or electronic circuit including a printed circuit board, a separate circuit board and a power connector | ELECTROLUX HOME PROD CORP |
| EP2639828 | Circuit support assembly | BOSCH GMBH ROBERT |
| EP2642517 | SEMICONDUCTOR DEVICE | FUJI ELECTRIC CO LTD |
| EP2642520 | Embedded flash memory | BROADCOM CORP |
| EP2654192 | Control chip for a power inverter comprising voltage level shifters | INT RECTIFIER CORP |
| EP2654387 | Printed circuit board | CANON KK |
| EP2656383 | SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING | TESSERA INC |
| EP2656385 | INTEGRATED DIGITAL- AND RADIO-FREQUENCY SYSTEM-ON-CHIP DEVICES WITH INTEGRAL PASSIVE DEVICES IN PACKAGE SUBSTRATES, AND METHODS OF MAKING SAME | INTEL CORP |
| EP2656703 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME | LG INNOTEK CO LTD |
| EP2658356 | MANUFACTURING METHOD FOR PRINTED CIRCUIT BOARD WITH INSULATED MICRO RADIATOR | RAYBEN TECHNOLOGIES ZHU HAI LTD |
| EP2659513 | ARRAY ASSEMBLIES WITH HIGH VOLTAGE SOLID STATE LIGHTING DIES | MICRON TECHNOLOGY INC |
| EP2664002 | OLED LIGHTING DEVICE WITH SHORT TOLERANT STRUCTURE | UNIVERSAL DISPLAY CORP |
| EP2665098 | SOLID STATE IMAGING DEVICE | HAMAMATSU PHOTONICS KK |
| EP2665342 | COMPOSITION FOR ORGANIC ELECTROLUMINESCENT ELEMENT, ORGANIC ELECTROLUMINESCENT ELEMENT, DISPLAY DEVICE, AND ILLUMINATOR | MITSUBISHI CHEM CORP |
| EP2667410 | SOLID-STATE IMAGING DEVICE | HAMAMATSU PHOTONICS KK |
| EP2667411 | Sensing device package structure and method of fabricating the same | |
| EP2667589 | SOLID-STATE IMAGING DEVICE | HAMAMATSU PHOTONICS KK |
| EP2669946 | Light emitting element, illumination device and device frame thereof | |
| EP2669947 | Sapphire substrate configured to form light emitting diode chip providing light in multi-directions, light emitting diode chip, and illumination device | |
| EP2670887 | ADHESION PROMOTING COMPOSITION FOR METAL LEADFRAMES | MACDERMID ACUMEN INC |
| EP2673803 | POWER SEMICONDUCTOR MODULE | ABB RESEARCH LTD |
| EP2674977 | Organic light-emitting display device and method of manufacturing the same | SAMSUNG DISPLAY CO LTD |
| EP2686880 | LED COMPONENT | LUMICHIP LTD |
| EP2693481 | Organic light emitting diode display | SAMSUNG DISPLAY CO LTD |
| EP2695498 | SECURE FLEX RIGID PRINTED CIRCUIT | INGENICO SA |
| EP2706904 | IMPROVED IMAGE SENSOR FOR ENDOSCOPIC USE | OLIVE MEDICAL CORP |
| EP2717666 | BOARD OPERATION ASSISTING DEVICE, AND BOARD OPERATION ASSISTING METHOD | FUJI MACHINE MFG |
| EP2720266 | Luminescence device | LG INNOTEK CO LTD |
| EP2728632 | Light emitting device and light emitting device array | LG INNOTEK CO LTD |
| EP2731154 | Circuit layout for organic transistors in series or parallel | PALO ALTO RES CT INC |
| EP2739126 | Electronic device | AIRBUS OPERATIONS GMBH |
| EP2744007 | Array substrate and fabrication method thereof, display device | BOE TECHNOLOGY GROUP CO LTD |
| EP2744008 | Array substrate, method for fabricating the same, and OLED display device | BOE TECHNOLOGY GROUP CO LTD |
| EP2744311 | Method for producing resonating patterns suitable for the performance of passive RF functions | THALES SA |
| EP2748854 | WAFER-LEVEL FABRICATION OF OPTICAL DEVICES WITH FRONT FOCAL LENGTH CORRECTION | HEPTAGON MICRO OPTICS PTE LTD |
| EP2750179 | Integrated circuit including a clock tree cell | COMMISSARIAT L éNERGIE ATOMIQUE ET AUX éNERGIES ALTERNATIVES |
| EP2750196 | Organic light-emitting display device | SAMSUNG DISPLAY CO LTD |
| EP2752876 | UNIT PIXEL AND LIGHT RECEIVING ELEMENT FOR IMAGE SENSOR | KIM HOON |
| EP2753157 | CONVEYOR | YOKOTA TECHNICA LTD COMPANY |
| EP2754340 | CONDUCTOR TRACK UNIT FOR A MOTOR VEHICLE | KIEKERT AG |
| EP2766931 | STUB MINIMIZATION FOR WIREBOND ASSEMBLIES WITHOUT WINDOWS | INVENSAS CORP |
| EP2774177 | METHOD AND APPARATUS FOR FLOATING OR APPLYING VOLTAGE TO A WELL OF AN INTEGRATED CIRCUIT | SYNOPSYS INC |
| EP2774287 | COMMUNICATION APPARATUS AND METHOD | UNIV EDINBURGH |
| EP2779805 | Method and apparatus pertaining to a cavity-bearing printed circuit board | BLACKBERRY LTD |
| EP2784840 | Organic device and manufacturing method thereof | FRAUNHOFER GES FORSCHUNG |
| EP2786411 | ACCESS-RESISTANT DIODE ARRAY DEVICE HAVING ENHANCED STABILITY | COMMISSARIAT L éNERGIE ATOMIQUE ET AUX éNERGIES ALTERNATIVES |
| EP2786412 | OPTICAL DETECTOR UNIT | THALES SA |
| EP2795674 | OPTO-ELECTRONIC MODULES, IN PARTICULAR FLASH MODULES, AND METHOD FOR MANUFACTURING THE SAME | HEPTAGON MICRO OPTICS PTE LTD |
| EP2797115 | Organic light emitting diode display and mask unit | SAMSUNG DISPLAY CO LTD |
| EP2802009 | Integrated imaging device for infrared radiation and method of production | AMS AG |
| EP2805352 | VERTICAL INTEGRATION OF CMOS ELECTRONICS WITH PHOTONIC DEVICES | SKORPIOS TECHNOLOGIES INC |
| EP2809136 | A method of assembling a transducer assembly | SONION NEDERLAND BV |
| EP2810308 | PACKAGING PHOTON BUILDING BLOCKS HAVING ONLY TOP SIDE CONNECTIONS IN A MOLDED INTERCONNECT STRUCTURE | BRIDGELUX INC |
| EP2815429 | MAINTAINING ALIGNMENT IN A MULTI-CHIP MODULE USING A COMPRESSIBLE STRUCTURE | ORACLE INT CORP |
| EP2816604 | Array substrate and organic light-emitting display including the same | SAMSUNG DISPLAY CO LTD |
| EP2816627 | Display device and method for manufacturing display device | SAMSUNG DISPLAY CO LTD |
| EP2817825 | INTEGRATED CIRCUITRY COMPONENTS, SWITCHES, AND MEMORY CELLS | MICRON TECHNOLOGY INC |
| EP2819164 | Semiconductor device | TOSHIBA KK |
| EP2822037 | Organic light emitting diode display device | LG DISPLAY CO LTD |
| EP2831933 | OPTICAL CAVITY INCLUDING A LIGHT EMITTING DEVICE AND WAVELENGTH CONVERTING MATERIAL | KONINKLIJKE PHILIPS NV |
| EP2834847 | THIN-FILM PHOTOVOLTAIC DEVICE WITH WAVY MONOLITHIC INTERCONNECTS | FLISOM AG |
| EP2837032 | A PHOTOVOLTAIC MODULE | UNIV DANMARKS TEKNISKE |
| EP2838325 | Ceramic circuit board and electronic device | NGK INSULATORS LTD |
| EP2845229 | IMAGING DETECTOR WITH ANTI-ALIASING FILTER IN THE READOUT ELECTRONICS AND/OR PHOTOSENSOR | KONINKLIJKE PHILIPS NV |
| EP2846538 | IMAGING DEVICE | NIKON CORP |
| EP2849223 | Semiconductor substrate including a cooling channel and method of forming a semiconductor substrate including a cooling channel | HAMILTON SUNDSTRAND CORP |
| EP2849548 | Method for creating a soldered connection and circuit component | BOSCH GMBH ROBERT |
| EP2850659 | INFRARED SENSOR DEVICE AND METHOD FOR PRODUCING AN INFRARED SENSOR DEVICE | BOSCH GMBH ROBERT |
| EP2860777 | LED ILLUMINATION MODULE AND LED ILLUMINATION APPARATUS | SHIKOKU INSTRUMENTATION CO LTD |
| EP2862173 | MEMORY CELLS, SEMICONDUCTOR DEVICE STRUCTURES, MEMORY SYSTEMS, AND METHODS OF FABRICATION | MICRON TECHNOLOGY INC |
| EP2862204 | MULTICHIP PACKAGING FOR IMAGING SYSTEM | RAYTHEON CO |
| EP2862426 | METHOD FOR CONNECTING A COMPONENT TO A CARRIER VIA SOLDERING AND COMPONENT FOR CONNECTION TO A CARRIER | ENDRESS & HAUSER GMBH & CO KG |
| EP2868168 | PRINTED CIRCUIT BOARD, CONTROL DEVICE, DEVICE WITH AN APPARATUS CONTROLLED BY THE CONTROL DEVICE AND MOTOR VEHICLE THEREWITH AND METHOD FOR PRODUCING THE PRINTED CIRCUIT BOARD, THE CONTROL DEVICE AND THE DEVICE | WABCO GMBH |
| EP2869393 | STRUCTURAL BODY AND WIRING BOARD | NEC CORP |
| EP2869674 | Electronics assembly for vehicle door handle having a flexible circuit board | HUF HüLSBECK & FüRST GMBH & CO KG |
| EP2870836 | PARASITIC CAPACITANCE COMPENSATING TRANSMISSION LINE | CISCO TECH INC |
| EP2871918 | LAMINATE FOR CIRCUIT BOARDS, METAL-BASED CIRCUIT BOARD, AND POWER MODULE | NHK SPRING CO LTD |
| EP2873309 | PRINTED CIRCUIT BOARD HAVING A SOLDER-GUIDING CAPILLARY | BOSCH GMBH ROBERT |
| EP2875528 | IMAGING SENSOR DEVICE | STFC SCIENCE & TECHNOLOGY |
| EP2876684 | Organic electroluminescent device and repairing method thereof | LG DISPLAY CO LTD |
| EP2884552 | ORGANIC ELECTROLUMINESCENT ELEMENT, LIGHTING DEVICE AND DISPLAY DEVICE | KONICA MINOLTA INC |
| EP2885816 | SEMICONDUCTOR COMPONENT AND PROCESS FOR FABRICATING A SEMICONDUCTOR COMPONENT | COMMISSARIAT L éNERGIE ATOMIQUE ET AUX éNERGIES ALTERNATIVES |
| EP2887407 | Method for manufacturing light emitting device and light emitting device | NICHIA CORP |
| EP2889912 | Organic light emitting diode display device | LG DISPLAY CO LTD |
| EP2892079 | Electronic circuits including a MOSFET and a dual-gate JFET | ACCO SEMICONDUCTOR INC |
| EP2893565 | LASER DE-BOND OF CARRIER WAFER FROM DEVICE WAFER | KONINKLIJKE PHILIPS NV |
| EP2893781 | METHOD FOR MAKING FLEXIBLE CIRCUITS | SAATI SPA |
| EP2894687 | Organic light emitting display device | LG DISPLAY CO LTD |
| EP2898758 | A METHOD FOR MAKING PARTIALLY METALLIZED PRECISION SYNTHETIC THREAD SQUARE MESH FABRICS FOR AESTHETIC OR MARKING APPLICATIONS | SAATI SPA |
| EP2909864 | ELECTRONIC DEVICES WITH DISPLAY-INTEGRATED LIGHT SENSORS | APPLE INC |
| EP2914072 | Circuit board and vehicle brake hydraulic pressure control unit | NISSIN KOGYO KK |
| EP2916349 | SEMICONDUCTOR MODULE | NSK LTD |
| EP2916358 | Display device and method of manufacturing the same | SAMSUNG DISPLAY CO LTD |
| EP2916631 | STRUCTURING OF THE SOLDER RESIST MASK OF CIRCUIT BOARDS FOR IMPROVING SOLDERING RESULTS | ZKW ELEKTRONIK GMBH |
| EP2917939 | SHARED-DIFFUSION STANDARD CELL ARCHITECTURE | QUALCOMM INC |
| EP2919267 | ARRAY SUBSTRATE, MANUFACTURING METHOD THEREFOR AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO LTD |
| EP2922063 | Integrated structure comprising neighbouring transistors | ST MICROELECTRONICS ROUSSET |
| EP2924743 | Light emitting device package | LG ELECTRONICS INC |
| EP2927954 | Fastening system for a power module | BRUSA ELEKTRONIK AG |
| EP2929562 | SEMICONDUCTOR ASSEMBLY | ABB TECHNOLOGY LTD |
| EP2932529 | SEGMENTED FOCAL PLANE ARRAY ARCHITECTURE | FLIR SYSTEMS |
| EP2936554 | DIE-STACKED DEVICE WITH PARTITIONED MULTI-HOP NETWORK | ADVANCED MICRO DEVICES INC |
| EP2939230 | FLEXIBLE ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | LG DISPLAY CO LTD |
| EP2939286 | TRANSPARENT ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | LG DISPLAY CO LTD |
| EP2939291 | ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | LG DISPLAY CO LTD |
| EP2940734 | METHOD AND SYSTEM FOR TRANSIENT VOLTAGE SUPPRESSION DEVICES WITH ACTIVE CONTROL | GEN ELECTRIC |
| EP2940752 | Organic light emitting diode display | SAMSUNG DISPLAY CO LTD |
| EP2942700 | CONDUCTIVE STRUCTURE PRECURSOR, CONDUCTIVE STRUCTURE AND MANUFACTURING METHOD THEREFOR | LG CHEMICAL LTD |
| EP2944862 | Light emitting device and lighting device including the light emitting device | LG INNOTEK CO LTD |
| EP2945470 | ELECTRONIC DEVICE, ELECTRONIC SYSTEM AND CIRCUIT BOARD INTERCONNECTION ARCHITECTURE THEREOF | HUAWEI TECH CO LTD |
| EP2948960 | FLEXIBLE CONDUCTIVE INK | HENKEL IP & HOLDING GMBH |
| EP2948983 | 3D MEMORY | MICRON TECHNOLOGY INC |
| EP2951870 | FLEXIBLE DISPLAY SUBSTRATE, FLEXIBLE ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | LG DISPLAY CO LTD |
| EP2953437 | THREE-DIMENSIONAL POWER DISTRIBUTION INTERCONNECT STRUCTURE | HAMILTON SUNDSTRAND CORP |
| EP2955766 | ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | LG DISPLAY CO LTD |
| EP2956923 | ELECTRONIC DEVICES WITH FLEXIBLE DISPLAY | LG DISPLAY CO LTD |
| EP2960938 | COMPONENT FOR PROTECTION AGAINST OVERVOLTAGES | ST MICROELECTRONICS TOURS SAS |
| EP2960939 | DETECTOR, PET SYSTEM AND X-RAY CT SYSTEM | HAMAMATSU PHOTONICS KK |
| EP2962329 | HIGH QUALITY FACTOR INDUCTOR IMPLEMENTED IN WAFER LEVEL PACKAGING (WLP) | QUALCOMM INC |
| EP2963158 | PLATING METHOD | ROHM & HAAS ELECT MAT |
| EP2963686 | SEMICONDUCTOR PHOTODETECTION DEVICE | HAMAMATSU PHOTONICS KK |
| EP2963917 | IMAGING ELEMENT, AND ELECTRONIC DEVICE | NIKON CORP |
| EP2965596 | THE INVENTION RELATES TO A METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD WITH MULTILAYER SUB-AREAS IN SECTIONS | AUSTRIA TECH & SYSTEM TECH |
| EP2966549 | ELECTRODE MEMBER AND TOUCH WINDOW INCLUDING THE SAME | LG INNOTEK CO LTD |
| EP2966675 | SEMICONDUCTOR DEVICE | SEIKO INSTR INC |
| EP2973681 | LOCAL INTERCONNECT STRUCTURES FOR HIGH DENSITY | QUALCOMM INC |
| EP2973697 | STACKED WAFER WITH COOLANT CHANNELS | RAYTHEON CO |
| EP2973715 | LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME AND METHOD OF FABRICATING A LIGHT EMITTING DIODE DISPLAY WITH INTEGRATED DEFECT DETECTION TEST | LUXVUE TECHNOLOGY CORP |
| EP2974280 | THRESHOLD-MONITORING, CONDITIONAL-RESET IMAGE SENSOR | RAMBUS INC |
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| EP2991130 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | SAMSUNG DISPLAY CO LTD |
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| EP3007347 | RECTIFYING DEVICES AND RECTIFIER ARRANGEMENTS | INFINEON TECHNOLOGIES AG |
| EP3007532 | METHOD FOR MANUFACTURING CIRCUIT BOARD WITH SOFT-MAGNETIC FILM LAMINATED THERETO | NITTO DENKO CORP |
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| EP3008756 | SPLIT-GATE CONDITIONAL- RESET IMAGE SENSOR | RAMBUS INC |
| EP3012867 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | SAMSUNG DISPLAY CO LTD |
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| EP3024027 | VERTICAL AND 3D MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME | |
| EP3025566 | CIRCUIT MATERIALS, CIRCUIT LAMINATES, AND METHODS OF MANUFACTURE THEREOF | ROGERS CORP |
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| EP3027687 | FLEXIBLE WHITE REFLECTIVE DIELECTRIC FOR ELECTRONIC CIRCUITS | DU PONT |
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| EP3063859 | HALF BRIDGE CIRCUIT | HRL LAB LLC |
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| EP3086375 | OPTICAL DETECTOR | HAMAMATSU PHOTONICS KK |
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| EP3091575 | ORGANIC LIGHT-EMITTING DIODE DISPLAY | SAMSUNG DISPLAY CO LTD |
| EP3091577 | PIXEL STRUCTURE AND ORGANIC LIGHT-EMITTING DISPLAY USING PIXEL STRUCTURE | KUNSHAN GOVISIONOX OPTOELECTRONICS CO LTD |
| EP3092662 | SEMICONDUCTOR PHOTODETECTOR | UNIVERSITé PARIS DIDEROT PARIS 7 |
| EP3092663 | SEMICONDUCTOR LIGHT EMITTING DEVICE WITH SHAPED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME | KONINKLIJKE PHILIPS NV |
| EP3093834 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF | LG ELECTRONICS INC |
| EP3093882 | ELECTRONIC CIRCUIT DEVICE | FURUKAWA ELECTRIC CO LTD |
| EP3094917 | MULTICHANNEL LED MODULE WITH WHITE LEDS OF DIFFERENT COLOR COORDINATES | TRIDONIC JENNERSDORF GMBH |
| EP3095129 | MONOLITHICALLY INTEGRATED CASCODE SWITCHES | UNITED SILICON CARBIDE INC |
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| EP3098851 | METHOD FOR PRODUCING AN INFRARED FILTER ASSOCIATED WITH AN IMAGE SENSOR | COMMISSARIAT ENERGIE ATOMIQUE |
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| EP3101690 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | BOE TECHNOLOGY GROUP CO LTD |
| EP3101695 | DEVICE FOR DIRECT X-RAY DETECTION | NOKIA TECHNOLOGIES OY |
| EP3104427 | ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND TOP EMITTING OLED DEVICE FOR IMPROVING VIEWING ANGLE CHARACTERISTICS | KUNSHAN NEW FLAT PANEL DISPLAY TECHNOLOGY CT CO LTD |
| EP3105787 | INTEGRATED DEVICE COMPRISING VIA WITH SIDE BARRIER LAYER TRAVERSING ENCAPSULATION LAYER | QUALCOMM INC |
| EP3105791 | SEMICONDUCTOR MODULE WITH TWO AUXILIARY EMITTER CONDUCTOR PATHS | ABB SCHWEIZ AG |
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| EP3107130 | ORGANIC LIGHT EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | LG DISPLAY CO LTD |
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| EP3116028 | SYSTEMS, CIRCUITS, DEVICES, AND METHODS WITH BIDIRECTIONAL BIPOLAR TRANSISTORS | IDEAL POWER INC |
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| EP3128555 | LIGHT-EMITTING SEMI-CONDUCTOR CHIP WITH INTEGRATED ESD PROTECTION AND A METHOD FOR PRODUCING A LIGHT-EMITTING SEMICONDUCTOR CHIP | OSRAM OPTO SEMICONDUCTORS GMBH |
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| EP3136438 | LIGHT-EMITTING DIODE STUCTURE AND DISPLAY APPARATUS INCORPORATING THE SAME | SAMSUNG DISPLAY CO LTD |
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| EP3163615 | LIGHT EMITTING DEVICE | LG INNOTEK CO LTD |
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| EP3163623 | TRANSPARENT ORGANIC LIGHT EMITTING DISPLAY DEVICE | LG DISPLAY CO LTD |
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| EP3163633 | A LIGHT-BASED SENSOR APPARATUS AND ASSOCIATED METHODS | NOKIA TECHNOLOGIES OY |
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| EP3291300 | ORGANIC LIGHT EMITTING DISPLAY DEVICE | LG DISPLAY CO LTD |
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| EP3291321 | FLEXIBLE DISPLAY | LG DISPLAY CO LTD |
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| EP3392921 | DISPLAY APARATUS | SAMSUNG DISPLAY CO LTD |
| EP3394892 | MAKING SEMICONDUCTOR DEVICES WITH ALIGNMENT BONDING AND SUBSTRATE REMOVAL | HONG KONG BEIDA JADE BIRD DISPLAY LTD |
| EP3394911 | ACCESS DEVICES TO CORRELATED ELECTRON SWITCH | ADVANCED RISC MACH LTD |
| EP3394912 | ORGANIC OPTOELECTRONIC DEVICE, ARRAY OF SUCH DEVICES AND METHOD FOR PRODUCING SUCH ARRAYS | COMMISSARIAT ENERGIE ATOMIQUE |
| EP3396714 | IMAGING ELEMENT AND IMAGING DEVICE | NIKON CORP |
| EP3399395 | DISPLAY APPARATUS AND IMAGE FORMING APPARATUS COMPRISING SAME | HP PRINTING KOREA CO LTD |
| EP3399550 | DISPLAY DEVICE | |
| EP3399552 | COPLANAR ELECTRODE PHOTODIODE ARRAY AND MANUFACTURING METHOD THEREFOR | NUCTECH CO LTD |
| EP3404711 | INTEGRATED POWER SEMICONDUCTOR PACKAGING APPARATUS AND POWER CONVERTER | GEN ELECTRIC |
| EP3404718 | ELECTRONIC DEVICE | SONY CORP |
| EP3405980 | OXIDE SEMICONDUCTOR MATERIAL, THIN-FILM TRANSISTOR, AND FABRICATION METHOD THEREOF | BOE TECHNOLOGY GROUP CO LTD |
| EP3405983 | OPTOELECTRONIC MODULES HAVING FLUID PERMEABLE CHANNELS AND METHODS FOR MANUFACTURING THE SAME | HEPTAGON MICRO OPTICS PTE LTD |
| EP3407386 | IMAGE CAPTURING ELEMENT AND ELECTRONIC DEVICE | SONY CORP |
| EP3407388 | RADIO FREQUENCY AND OPTICAL BASED POWER FOR REMOTE COMPONENT CONDITIONING USING THERMOELECTRICS | UNITED TECHNOLOGIES CORP |
| EP3410484 | SOLID-STATE IMAGING DEVICE | TOWERJAZZ PANASONIC SEMICONDUCTOR CO LTD |
| EP3410489 | MEMORY CELLS AND DEVICES | XEROX CORP |
| EP3410491 | OLED PANEL, OLED MODULE, FINGERPRINT IDENTIFICATION METHOD AND DEVICE THEREOF | BEIJING XIAOMI MOBILE SOFTWARE CO LTD |
| EP3413344 | CONNECTING ELEMENT AND ARRANGEMENT | HE SYSTEM ELECTRONIC GMBH & CO KG |
| EP3413348 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | SHINDENGEN ELECTRIC MFG |
| EP3413695 | CERAMIC SUBSTRATE AND MANUFACTURING METHOD THEREFOR | MITSUBISHI ELECTRIC CORP |
| EP3414777 | IMAGE SENSORS WITH ELECTRONIC SHUTTER | INVISAGE TECHNOLOGIES INC |
| EP3415554 | RESIN FILM, LAMINATED FILM, AND SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOARD | SUMITOMO CHEMICAL CO |
| EP3416194 | DISPLAY APPARATUS | SAMSUNG DISPLAY CO LTD |
| EP3419065 | DISPLAY DEVICE | SAMSUNG DISPLAY CO LTD |
| EP3420577 | THREE DIMENSIONAL MEMORY DEVICE CONTAINING MULTILAYER WORDLINE BARRIER FILMS AND METHOD OF MAKING THEREOF | SANDISK TECHNOLOGIES LLC |
| EP3420591 | THROUGH-MEMORY-LEVEL VIA STRUCTURES BETWEEN STAIRCASE REGIONS IN A THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THEREOF | SANDISK TECHNOLOGIES LLC |
| EP3422367 | ELECTROCONDUCTIVE PASTE, ELECTRONIC SUBSTRATE, AND METHOD FOR MANUFACTURING SAID SUBSTRATE | MITSUBOSHI BELTING LTD |
| EP3423278 | ADDITIVE MANUFACTURING PROCESSES UTILIZING METAL NANOPARTICLES | LOCKHEED CORP |
| EP3423964 | INTERACTIVE ROUTING OF CONNECTION IN CIRCUIT USING WELDING AUTO WELDING AND AUTO CLONING | SYNOPSYS INC |
| EP3424081 | CSP LED MODULE HAVING IMPROVED LIGHT EMISSION | TRIDONIC JENNERSDORF GMBH |
| EP3424283 | CIRCUIT OF AN ELECTRONIC CONTROL UNIT | WABCO EUROPE BVBA |
| EP3425023 | WHITE LIGHT EMITTING DEVICES | SAMSUNG ELECTRONICS CO LTD |
| EP3425677 | THIN FILM TRANSISTOR AND MANUFACTURING METHOD THEREFOR, DISPLAY PANEL AND DISPLAY APPARATUS | KUNSHAN NEW FLAT PANEL DISPLAY TECHNOLOGY CT CO LTD |
| EP3426976 | SOCKET ASSEMBLY, LIGHT EMITTER MODULE, AND LIGHTING SYSTEM | TE CONNECTIVITY NEDERLAND BV |
| EP3428692 | X-RAY DETECTOR WITH INTERMEDIATE UNIT AND EVALUATION LEVEL | SIEMENS HEALTHCARE GMBH |
| EP3428839 | ELECTRONIC DEVICE | GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD |
| EP3428964 | SEMICONDUCTOR DEVICE | KYOCERA CORP |
| EP3428968 | DISPLAY APPARATUS | SAMSUNG DISPLAY CO LTD |
| EP3430643 | COMPONENT CARRIER WITH INTEGRATED STRAIN GAUGE | AUSTRIA TECH & SYSTEM TECH |
| EP3430646 | STAIRSTEP INTERPOSERS WITH INTEGRATED SHIELDING FOR ELECTRONICS PACKAGES | INTEL CORP |
| EP3430874 | PHASE MODULE FOR A POWER CONVERTER | SIEMENS AG |
| EP3432316 | INSULATING RESIN MATERIAL, METAL-LAYER-ATTACHED INSULATING RESIN MATERIAL USING SAME, AND WIRING SUBSTRATE | NITTO DENKO CORP |
| EP3432353 | HIGH FREQUENCY CIRCUIT | MITSUBISHI ELECTRIC CORP |
| EP3433670 | ARRAY SUBSTRATE MOTHERBOARD, DISPLAY PANEL MOTHERBOARD, AND FABRICATING METHOD THEREOF | BOE TECHNOLOGY GROUP CO LTD |
| EP3435412 | LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | LG DISPLAY CO LTD |
| EP3435416 | IMAGING DEVICE | PANASONIC IP MAN CO LTD |
| EP3435417 | IMAGING DEVICE | PANASONIC IP MAN CO LTD |
| EP3438802 | DISPLAY APPARATUS | SAMSUNG DISPLAY CO LTD |
| EP3439040 | SOLID-STATE IMAGE PICKUP ELEMENT, SENSOR DEVICE, AND ELECTRONIC APPARATUS | SONY CORP |
| EP3439042 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREFOR | SEOUL SEMICONDUCTOR CO LTD |
| EP3439043 | DISPLAY DEVICE | SAMSUNG DISPLAY CO LTD |
| EP3439289 | IMAGING ELEMENT AND IMAGING DEVICE | NIKON CORP |
| EP3440696 | INTEGRATED RESISTOR FOR SEMICONDUCTOR DEVICE | POWER INTEGRATIONS INC |
| EP3440713 | MICRO-TRANSFER PRINTED LED AND COLOR FILTER STRUCTURE | X CELEPRINT LTD |
| EP3441859 | DISPLAY AND DETECTION SYSTEM | ISORG |
| EP3442030 | SPIN CURRENT MAGNETIZATION ROTATING ELEMENT, MAGNETORESISTIVE EFFECT ELEMENT AND MAGNETIC MEMORY | TDK CORP |
| EP3442309 | METHOD FOR THE PRODUCTION OF AN ELECTRICALLY CONDUCTIVE TEXTILE SURFACE ELEMENT | BENECKE KALIKO AG |
| EP3443588 | ROBUST LOW INDUCTANCE POWER MODULE PACKAGE | GEN ELECTRIC |
| EP3443823 | FLEXIBLE PRINTED CIRCUIT WITH ENHANCED GROUND PLANE CONNECTIVITY | MICROSOFT TECHNOLOGY LICENSING LLC |
| EP3444842 | ARRAY SUBSTRATE, MANUFACTURING METHOD THEREFOR, SENSOR, AND DETECTION DEVICE | BOE TECHNOLOGY GROUP CO LTD |
| EP3444844 | STACK TYPE SENSOR PACKAGE STRUCTURE | |
| EP3444861 | OLED DISPLAY PANEL, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO LTD |
| EP3445039 | DETECTION CIRCUIT FOR PHOTO SENSOR WITH STACKED SUBSTRATES | FACEBOOK TECH LLC |
| EP3445042 | SOLID-STATE IMAGING ELEMENT, ELECTRONIC DEVICE AND CONTROL METHOD FOR SOLID-STATE IMAGING ELEMENT | SONY CORP |
| EP3446475 | IMAGE SENSOR TILE AND IMAGE SENSOR | TELEDYNE DALSA BV |
| EP3448137 | COIL COMPONENT | SUMIDA CORP |
| EP3451382 | PIXEL ARRAY AND MANUFACTURING METHOD THEREFOR, AND ORGANIC LIGHT EMITTING DIODE ARRAY SUBSTRATE | BOE TECHNOLOGY GROUP CO LTD |
| EP3451520 | COMPONENT STRUCTURE, POWER MODULE AND POWER MODULE ASSEMBLY STRUCTURE | DELTA ELECTRONICS SHANGHAI CO |
| EP3454170 | TOOL-LESS TOP SERVICE OF M.2 LATCH ON BOARD | |
| EP3454367 | SEMICONDUCTOR MODULE | FUJI ELECTRIC CO LTD |
| EP3454371 | FABRICATION METHODS FOR OPTOELECTRONIC MODULES THAT HAVE SHIELDING TO REDUCE LIGHT LEAKAGE OR STRAY LIGHT | HEPTAGON MICRO OPTICS PTE LTD |
| EP3454385 | LIGHT EMITTING DEVICE | NICHIA CORP |
| EP3455882 | METHOD FOR PRODUCING AN OPTOELECTRONIC DEVICE COMPRISING A PLURALITY OF GALLIUM NITRIDE DIODES | COMMISSARIAT ENERGIE ATOMIQUE |
| EP3460565 | DISPLAY PANEL | SAMSUNG DISPLAY CO LTD |
| EP3462278 | FLEXIBLE DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE DEVICE | LG DISPLAY CO LTD |
| EP3462489 | MESA SHAPED MICRO LIGHT EMITTING DIODE WITH BOTTOM N-CONTACT | FACEBOOK TECH LLC |
| EP3462494 | INTEGRATED RADIATION DETECTOR DEVICE | DETECTION TECH OY |
| EP3462496 | PHOTO DETECTING APPARATUS AND METHOD OF MANUFACTURING THE SAME | LG DISPLAY CO LTD |
| EP3465747 | SECURED CHIP | IRDETO BV |
| EP3465754 | COMPACT LIGHT-EMITTING DIODE ARRANGEMENT | INOVA SEMICONDUCTORS GMBH |
| EP3465758 | IMAGE SENSOR SEMICONDUCTOR PACKAGES AND RELATED METHODS | SEMICONDUCTOR COMPONENTS IND LLC |
| EP3466221 | METHOD AND APPARATUS FOR CONTROLLING JET DISPENSING BY DISPLACEMENT MEASUREMENT | MYCRONIC AB |
| EP3467893 | ORGANIC LIGHT-EMITTING DIODE DEVICE AND PREPARATION METHOD THEREFOR, AND ARRAY SUBSTRATE AND DISPLAY APPARATUS | BOE TECHNOLOGY GROUP CO LTD |
| EP3468170 | SOLID-STATE IMAGING ELEMENT AND IMAGING APPARATUS | SONY CORP |
| EP3470226 | INFLATABLE PNEUMATIC STENCIL CLAMP | ASM ASSEMBLY SYSTEMS SINGAPORE PTE LTD |
| EP3471141 | USING MEMS FABRICATION INCORPORATING INTO LED DEVICE MOUNTING AND ASSEMBLY | |
| EP3472865 | A STANDARD CELL ARCHITECTURE FOR PARASITIC RESISTANCE REDUCTION | QUALCOMM INC |
| EP3474328 | COMBINATION SENSORS AND ELECTRONIC DEVICES | SAMSUNG ELECTRONICS CO LTD |
| EP3474639 | EMBEDDING A COMPONENT INTO A COMPONENT CARRIER BY TRANSFERRING THE COMPONENT INTO A CAVITY BEING ALREADY FILLED WITH FILLING MATERIAL | AUSTRIA TECH & SYSTEM TECH |
| EP3474644 | MULTILAYER WIRING BOARD FOR INSPECTION OF ELECTRONIC COMPONENTS | NGK SPARK PLUG CO |
| EP3477699 | LED PANEL AND DISPLAY APPARATUS HAVING THE SAME | SAMSUNG ELECTRONICS CO LTD |
| EP3477703 | PHOTOELECTRIC CONVERSION DEVICE, MANUFACTURING METHOD THEREOF, AND APPARATUS | CANON KK |
| EP3477704 | CAMERA PHOTOSENSITIVE COMPONENT, CAMERA, AND CAMERA SHOOTING TERMINAL | BEIJING XIAOMI MOBILE SOFTWARE CO LTD |
| EP3477705 | DISPLAY DEVICE | LG DISPLAY CO LTD |
| EP3477723 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | SAMSUNG DISPLAY CO LTD |
| EP3477725 | DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME | SAMSUNG DISPLAY CO LTD |
| EP3478036 | LED LIGHT SOURCE MODULE AND MANUFACTURING METHOD | SELF ELECTRONICS CO LTD |
| EP3479402 | METHOD AND APPARATUS FOR REMOTE FIELD PROGRAMMABLE GATE ARRAY PROCESSING | INTEL CORP |
| EP3479407 | LINEAR SENSOR FOR A SPECTROSCOPIC OPTICAL COHERENCE TOMOGRAPHY IMAGING APPARATUS | TELEDYNE E2V SEMICONDUCTORS SAS |
| EP3479409 | OPTOELECTRONIC DEVICE COMPRISING THREE-DIMENSIONAL DIODES | ALEDIA |
| EP3480843 | METHOD FOR MANUFACTURING PACKAGE SUBSTRATE FOR CARRYING SEMICONDUCTOR ELEMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT-MOUNTED SUBSTRATE | MITSUBISHI GAS CHEMICAL CO |
| EP3483937 | SOLID-STATE IMAGING DEVICE, CORRECTION METHOD, AND ELECTRONIC DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORP |
| EP3485707 | ELECTRONIC ASSEMBLY WITH THERMAL FUSE | BROSE FAHRZEUGTEILE GMBH&CO KG |
| EP3489385 | ELECTROLESS PALLADIUM/GOLD PLATING PROCESS | KOJIMA CHEMICALS CO LTD |
| EP3489744 | DISPLAY DEVICE | FUNAI ELECTRIC CO |
| EP3490004 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | SAMSUNG DISPLAY CO LTD |
| EP3490248 | IMAGE CAPTURING ELEMENT AND IMAGE CAPTURING SYSTEM | NIKON CORP |
| EP3491670 | ARRAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE | BOE TECHNOLOGY GROUP CO LTD |
| EP3491900 | APPLICATION OF ELECTRICAL CONDUCTORS OF A SOLAR CELL | LANDA LABS 2012 LTD |
| EP3492972 | THIN-FILM TRANSISTOR ARRAY SUBSTRATE AND ORGANIC LIGHT-EMITTING DISPLAY DEVICE INCLUDING THE SAME | LG DISPLAY CO LTD |
| EP3493258 | LED DISPLAY MODULE AND MANUFACTURING METHOD THEREOF | LEYARD OPTOELECTRONIC CO LTD |
| EP3493263 | OLED ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING SAME, AND OLED DISPLAY PANEL | BOE TECHNOLOGY GROUP CO LTD |
| EP3493282 | ISOLATION OF MAGNETIC LAYERS DURING ETCH IN A MAGNETORESISTIVE DEVICE | EVERSPIN TECHNOLOGIES INC |
| EP3493528 | IMAGE PICKUP ELEMENT | SONY SEMICONDUCTOR SOLUTIONS CORP |
| EP3496082 | FLEXIBLE DISPLAY DEVICE | LG DISPLAY CO LTD |
| EP3496142 | LIGHT EMITTING DIODE APPARATUS AND MANUFACTURING METHOD THEREOF | SAMSUNG ELECTRONICS CO LTD |
| EP3496177 | ORGANIC LIGHT EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | LG DISPLAY CO LTD |
| EP3497470 | A DEMODULATOR WITH A CARRIER GENERATING PINNED PHOTODIODE AND A METHOD FOR OPERATING IT | SOFTKINETIC SENSORS N V |
| EP3497471 | A DEMODULATOR WITH A CARRIER GENERATING PINNED PHOTODIODE | SONY DEPTHSENSING SOLUTIONS |
| EP3497723 | METHOD OF FORMING LOW HEIGHT SPLIT GATE MEMORY CELLS | SILICON STORAGE TECH INC |
| EP3499598 | ORGANIC LIGHT-EMITTING DIODE AND PREPARATION METHOD THEREOF, AND DISPLAY DEVICE | BOE TECHNOLOGY GROUP CO LTD |
| EP3501243 | ELECTRICAL CONNECTOR | INTERPLEX IND INC |
| EP3503190 | CMOS IMAGE SENSOR ENCAPSULATION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | PIONEER MAT INC CHENGDU |
| EP3503191 | CMOS IMAGE SENSOR ENCAPSULATION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | PIONEER MAT INC CHENGDU |
| EP3503231 | A SPIN-TRANSFER TORQUE DEVICE | IMEC VZW |
| EP3503232 | THREE-DIMENSIONAL VARIABLE RESISTANCE MEMORY WITH TIP CONTACTS | INTEL CORP |
| EP3504741 | FOLDABLE DISPLAY DESIGN WITH GENERALIZED LAYER MECHANICAL COMPATIBILITY | 3M INNOVATIVE PROPERTIES CO |
| EP3506324 | RESISTOR, CIRCUIT BOARD PROVIDED WITH SAME, AND ELECTRONIC DEVICE | KYOCERA CORP |
| EP3506353 | DISPLAYING APPARATUS HAVING LIGHT EMITTING DEVICE | SEOUL SEMICONDUCTOR CO LTD |
| EP3506358 | THERMOELECTRIC DEVICE WITH THERMOELECTRIC JUNCTION FORMED IN THE THICKNESS OF A SUBSTRATE AND METHOD FOR MANUFACTURING SUCH A THERMOELECTRIC DEVICE | COMMISSARIAT ENERGIE ATOMIQUE |
| EP3506504 | DEVICES AND METHODS RELATED TO RADIO-FREQUENCY SWITCHES HAVING IMPROVED PERFORMANCE | SKYWORKS SOLUTIONS INC |
| EP3507726 | BREADBOARD AND ELECTRONICS EXPERIMENTATION SYSTEM | JOEBOTICS INCORPORATED |
| EP3507831 | MEMORY CELLS AND MEMORY ARRAYS | MICRON TECHNOLOGY INC |
| EP3507835 | ELECTROMAGNETIC RADIATION DETECTOR COMPRISING CHARGE TRANSPORT ACROSS A BONDED INTERFACE | G RAY SWITZERLAND SA |
| EP3509094 | MICRO DEVICE TRANSFER EQUIPMENT AND RELATED METHOD | |
| EP3509108 | PHOTOELECTRIC DEVICES AND IMAGE SENSORS AND ELECTRONIC DEVICES | SAMSUNG ELECTRONICS CO LTD |
| EP3511993 | TUNNEL MAGNETORESISTIVE EFFECT ELEMENT, MAGNETIC MEMORY, AND BUILT-IN MEMORY | TDK CORP |
| EP3512315 | PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, PREPREG | PANASONIC IP MAN CO LTD |
| EP3514831 | SOLID-STATE IMAGE PICKUP APPARATUS AND IMAGE PICKUP SYSTEM | CANON KK |
| EP3515157 | FLEXIBLE ELECTRICAL CIRCUIT WITH CONNECTION BETWEEN ELECTRICALLY CONDUCTIVE STRUCTURAL ELEMENTS | SCHREINER GROUP GMBH & CO KG |
| EP3516691 | CMOS IMAGE SENSOR | HUAWEI TECH CO LTD |
| EP3518632 | COMPONENT MOUNTING MACHINE | FUJI CORP |
| EP3520138 | INTEGRATED CIRCUIT PACKAGE HAVING RECTANGULAR ASPECT RATIO | INTEL CORP |
| EP3520582 | ELECTRONIC DEVICE COMPRISING A MODULE CONNECTED TO A PCB AND ELECTRONIC UNIT COMPRISING SUCH A DEVICE | SAFRAN ELECTRONICS & DEFENSE |
| EP3522074 | DISPLAY ASSEMBLY AND MANUFACTURING METHOD THEREOF AND DISPLAY APPARATUS | BEIJING XIAOMI MOBILE SOFTWARE CO LTD |
| EP3522217 | PIXEL FOR UNCOOLED INFRARED FOCAL PLANE DETECTOR AND PREPARATION METHOD THEREFOR | YANTAI RAYTRON TECH CO LTD |
| EP3522685 | METALLIC LAYER AS CARRIER FOR COMPONENT EMBEDDED IN CAVITY OF COMPONENT CARRIER | AUSTRIA TECH & SYSTEM TECH |
| EP3522690 | INVERTER | TOYOTA JIDOSHOKKI KK |
| EP3523826 | FRONT-SIDE TYPE IMAGE SENSOR AND METHOD FOR MANUFACTURING SUCH A SENSOR | SOITEC SILICON ON INSULATOR |
| EP3525063 | FLEXIBLE DISPLAY DEVICE | SAMSUNG DISPLAY CO LTD |
| EP3525325 | ELECTRIC COMPRESSOR | MITSUBISHI HEAVY IND THERMAL SYSTEMS LTD |
| EP3525449 | IMAGE-CAPTURING ELEMENT AND IMAGE-CAPTURING DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORP |
| EP3525450 | PHOTOELECTRIC CONVERSION APPARATUS AND IMAGING SYSTEM | CANON KK |
| EP3526643 | ARRAY SUBSTRATE AND REPAIRING METHOD THEREOF | BOE TECHNOLOGY GROUP CO LTD |
| EP3527374 | SCREEN PRINTER | FUJI CORP |
| EP3528295 | DISPLAY COMPRISING LED CHIP AND METHOD OF MANUFACTURING THE SAME | FACEBOOK TECH LLC |
| EP3531452 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | SONY CORP |
| EP3531693 | PHOTOELECTRIC CONVERSION ELEMENT AND IMAGE PROCESSING APPARATUS | RICOH CO LTD |
| EP3531810 | ELECTRONIC DEVICE INCLUDING CONDUCTIVE MEMBER FORMING CAPACITIVE COUPLING WITH BRACKET AND ELECTRICALLY CONNECTED TO GROUNDS OF PLURALITY OF CIRCUIT BOARDS DISPOSED IN THE BRACKET | SAMSUNG ELECTRONICS CO LTD |
| EP3534403 | DETECTOR | RIGAKU DENKI CO LTD |
| EP3534510 | ROTATING ELECTRICAL MACHINE HAVING INTEGRATED CONTROL DEVICE | MITSUBISHI ELECTRIC CORP |
| EP3537494 | DISPLAY DEVICE AND ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE | SAMSUNG DISPLAY CO LTD |
| EP3540788 | LIGHT RECEIVING DEVICE AND METHOD OF MANUFACTURING LIGHT RECEIVING DEVICE | TOSHIBA KK |
| EP3542400 | LIGHTING DEVICE WITH UV LED | SIGNIFY HOLDING BV |
| EP3542603 | ELECTRICAL PLUG SOCKET | TELEGAERTNER KARL GAERTNER GMBH |
| EP3544282 | CAMERA MODULE | LG INNOTEK CO LTD |
| EP3547019 | DISPLAY ASSEMBLY AND MOBILE TERMINAL | GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD |
| EP3547365 | POWER MODULE AND MANUFACTURING METHOD THEREOF | DELTA ELECTRONICS INC |
| EP3547368 | ELECTRONIC DEVICE | |
| EP3549767 | PRINTING APPARATUS AND ACCOMMODATION APPARATUS | FUJI CORP |
| EP3550664 | PCB LAMINATED STRUCTURE AND MOBILE TERMINAL HAVING THE SAME | LG ELECTRONICS INC |
| EP3550937 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT-EMITTING DIODE | LG ELECTRONICS INC |
| EP3553822 | ESD PROTECTION DEVICE, SEMICONDUCTOR DEVICE THAT INCLUDES AN ESD PROTECTION DEVICE, AND METHOD OF MANUFACTURING SAME | NXP USA INC |
| EP3554066 | SOLID STATE IMAGING APPARATUS | HAMAMATSU PHOTONICS KK |
| EP3554200 | CORE SUBSTRATE, MULTILAYER WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR MODULE, COPPER-CLAD SUBSTRATE, AND METHOD FOR PRODUCING CORE SUBSTRATE | TOPPAN PRINTING CO LTD |
| EP3555810 | CAPACITIVE FINGERPRINT SENSING DEVICE COMPRISING DISPLAY FUNCTIONALITY | FINGERPRINT CARDS AB |
| EP3555914 | POWER SEMICONDUCTOR MODULE WITH LOW GATE PATH INDUCTANCE | ABB SCHWEIZ AG |
| EP3555915 | ELECTRONIC POWER CIRCUITS COMPRISING BUS-BARS FORMING HEAT SINKS AND INTEGRATION METHOD | INST VEDECOM |
| EP3555919 | PIXEL STRUCTURE, IMAGE SENSOR, IMAGE CAPTURING APPARATUS, AND ELECTRONIC DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORP |
| EP3555921 | TANDEM PHOTOVOLTAIC DEVICE COMPRISING A SUB-CELL BASED ON PEROVSKITE AND A SUB-CELL BASED ON SILICON | COMMISSARIAT ENERGIE ATOMIQUE |
| EP3555979 | LAMINATED MULTI PHASE BUSBAR AND METHOD OF MANUFACTURING THE SAME | ABB SCHWEIZ AG |
| EP3556189 | MULTI-PHASE BUSBAR FOR CONDUCTING ELECTRIC ENERGY AND METHOD OF MANUFACTURING THE SAME | ABB SCHWEIZ AG |
| EP3557620 | DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME | SAMSUNG DISPLAY CO LTD |
| EP3557770 | ELECTRIC INTERCONNECTOR SYSTEM | CONTINENTAL AUTOMOTIVE GMBH |
| EP3559996 | LIGHT EMITTING DIODES WITH SENSOR SEGMENT FOR OPERATIONAL FEEDBACK | LUMILEDS LLC |
| EP3560304 | METHOD OF FORMING A SOLDERABLE SOLDER DEPOSIT ON A CONTACT PAD | ATOTECH DEUTSCHLAND GMBH |
| EP3560716 | SCREEN PRINTING MACHINE | FUJI CORP |
| EP3561715 | SYSTEM FOR SECURING A MAGNETIC CARD READER, CORRESPONDING MAGNETIC CARD READER AND ELECTRONIC DEVICE | INGENICO GROUP |
| EP3561877 | THREE DIMENSIONAL MEMORY ARRAY ARCHITECTURE | MICRON TECHNOLOGY INC |
| EP3562040 | SEMICONDUCTOR DEVICE HAVING A BIDIRECTIONAL SWITCH AND DISCHARGE CIRCUIT | INFINEON TECHNOLOGIES AUSTRIA AG |
| EP3563414 | CAMERA MODULE, METHOD FOR PRODUCING CAMERA MODULE,AND ELECTRONIC APPARATUS | SONY SEMICONDUCTOR SOLUTIONS CORP |
| EP3563415 | HYBRID SENSOR CHIP ASSEMBLY AND METHOD FOR REDUCING RADIATIVE TRANSFER BETWEEN A DETECTOR AND READ-OUT INTEGRATED CIRCUIT | RAYTHEON CO |
| EP3563419 | OPTOELECTRONIC DEVICE WITH LIGHT-EMITTING DIODES | ALEDIA |
| EP3563420 | PROCESS FOR FABRICATING AN OPTOELECTRONIC DEVICE INCLUDING PHOTOLUMINESCENT PADS OF PHOTORESIST | ALEDIA |
| EP3563647 | ELECTRONIC STRUCTURE COMPRISING A MATRIX ARRAY OF ELECTRONIC DEVICES HAVING IMPROVED THERMAL PERFORMANCES | COMMISSARIAT ENERGIE ATOMIQUE |
| EP3565388 | VOLTAGE DETERMINATION DEVICE | KEIHIN CORP |
| EP3565391 | WIRING SUBSTRATE SINGULATING METHOD AND SUBSTRATE FOR PACKAGE | TOPPAN PRINTING CO LTD |
| EP3566248 | DETACH AND REATTACH OF A FLEXIBLE POLYIMIDE BASED X-RAY DETECTOR | CARESTREAM HEALTH INC |
| EP3570337 | SEMICONDUCTOR DEVICE | ABLIC INC |
| EP3571717 | METHOD FOR FORMING A RESISTIVE ELEMENT IN A SUPERCONDUCTING INTERCONNECT STRUCTURE | NORTHROP GRUMMAN SYSTEMS CORP |
| EP3571721 | METHOD FOR MASS-PRODUCTION OF CURVED ELECTRONIC CIRCUITS | COMMISSARIAT ENERGIE ATOMIQUE |
| EP3572555 | METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD | UNIV SHINSHU |
| EP3573103 | PHOTOELECTRIC CONVERSION APPARATUS | HUAWEI TECH CO LTD |
| EP3574522 | SEMICONDUCTOR ARRANGEMENT | YASA LTD |
| EP3574523 | SEMICONDUCTOR COOLING ARRANGEMENT | YASA LTD |
| EP3574721 | AN ELECTRONIC SENSITIVE ZONE PROTECTION SYSTEM | ASELSAN ELEKTRONIK SANAYI VE TICARET ANONIM SIRKETI |
| EP3575296 | TRIAZINE COMPOUND, COMPOSITION AND ORGANIC OPTOELECTRONIC DEVICE AND DISPLAY DEVICE | SAMSUNG SDI CO LTD |
| EP3575683 | MEAT LIGHTING SYSTEM WITH IMPROVED EFFICIENCY AND RED OVERSATURATION | SIGNIFY HOLDING BV |
| EP3576148 | LIGHT EMITTING DIODE DISPLAY DEVICE | LG DISPLAY CO LTD |
| EP3576149 | MEMORY CELL WITH INDEPENDENTLY-SIZED ELEMENTS | MICRON TECHNOLOGY INC |
| EP3576150 | IMAGE-CAPTURE ELEMENT AND METHOD FOR MANUFACTURING IMAGE-CAPTURE ELEMENT | NIKON CORP |
| EP3576152 | SOLID-STATE IMAGE-CAPTURE ELEMENT AND ELECTRONIC DEVICE | SONY SEMICONDUCTOR SOLUTIONS CORP |
| EP3576404 | SOLID-STATE IMAGE PICKUP ELEMENT | SONY SEMICONDUCTOR SOLUTIONS CORP |
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| EP3588182 | DISPLAY DEVICE | SAMSUNG DISPLAY CO LTD |
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| EP3588574 | DISPLAY DEVICE | SAMSUNG DISPLAY CO LTD |
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| EP3608980 | MEMORY DEVICE | COMMISSARIAT ENERGIE ATOMIQUE |
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