2021年半导体零配件领域在欧专利的布局与竞争——英特尔公司、三菱电机公司、高通公司领先
2022-10-21 17:52
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█武汉大学科教管理与评价研究中心 陈立新 张琳 黄颖
第三部分 2021年欧洲专利统计分析报告
28 各领域的欧洲专利布局和竞争
28.39 半导体零配件领域的欧洲专利竞争态势
第39个技术领域是半导体零配件，主要包括安装架、密封层、支架、冷却装置、防辐射保护装置等半导体通用零部件。2021年，欧洲专利局在该领域共授权专利525项（增长率为-11%），占总授权量的0.5%，是专利数量第52多的领域。
2021年，美国在该领域获得专利权160项，占该领域专利授权总量的30.5%。中国在该领域做出专利发明20项，获得专利权21项。日本和韩国获得的专利权数量分别为137和14项。
表28.39-1 2021年各国半导体零配件领域的在欧专利发明和专利权数量
国家 和地区 | 发明 数量 | 专利权 数量 | 净流失 数量 | 专利 流失率 | 发明 份额 | 专利权 份额 | 份额 流失量 | |
1 | 美国 | 141 | 160 | -19 | -13.5% | 26.9% | 30.5% | -3.6% |
2 | 德国 | 50 | 48 | 2 | 4.0% | 9.5% | 9.1% | 0.4% |
3 | 日本 | 135 | 137 | -2 | -1.5% | 25.7% | 26.1% | -0.4% |
4 | 法国 | 36 | 35 | 1 | 2.8% | 6.9% | 6.7% | 0.2% |
5 | 中国 | 20 | 21 | -1 | -5.0% | 3.8% | 4.0% | -0.2% |
6 | 韩国 | 15 | 14 | 1 | 6.7% | 2.9% | 2.7% | 0.2% |
7 | 英国 | 12 | 4 | 8 | 66.7% | 2.3% | 0.8% | 1.5% |
8 | 意大利 | 5 | 5 | 0 | 0.0% | 1.0% | 1.0% | 0.0% |
9 | 荷兰 | 20 | 19 | 1 | 5.0% | 3.8% | 3.6% | 0.2% |
10 | 瑞士 | 12 | 15 | -3 | -25.0% | 2.3% | 2.9% | -0.6% |
11 | 瑞典 | 8 | 5 | 3 | 37.5% | 1.5% | 1.0% | 0.6% |
12 | 加拿大 | 1 | 1 | 0 | 0.0% | 0.2% | 0.2% | 0.0% |
13 | 以色列 | 1 | 1 | 0 | 0.0% | 0.2% | 0.2% | 0.0% |
14 | 印度 | 2 | 1 | 1 | 50.0% | 0.4% | 0.2% | 0.2% |
15 | 其他 | 67 | 59 | 8 | 11.9% | 12.8% | 11.2% | 1.5% |
小计 | 525 | 525 | 0 | 0% | 100% | 100% | 0% |
图28.39-1 2021年各国半导体零配件领域的在欧专利发明和专利权数量对比
2021年，在半导体零配件领域上获得欧洲专利授权最多的机构是英特尔公司、三菱电机公司、高通公司。
表28.39-2 2021年半导体零配件领域在欧专利授权前10机构
机构名称 | 国家 | 机构英文名称 | 2021 | |
1 | 英特尔公司 | 美国 | INTEL CORP | 22 |
2 | 三菱电机公司 | 日本 | MITSUBISHI ELECTRIC CORP | 17 |
3 | 高通公司 | 美国 | QUALCOMM INC | 17 |
4 | 三菱综合材料株式会社 | 日本 | MITSUBISHI MATERIALS CORP | 12 |
5 | 京瓷株式会社 | 日本 | KYOCERA CORP | 12 |
6 | 英飞凌科技公司 | 德国 | INFINEON TECHNOLOGIES AG | 11 |
7 | 通用电气公司 | 美国 | GEN ELECTRIC | 10 |
8 | 恩智浦美国公司 | 美国 | NXP USA INC | 10 |
9 | 西门子公司 | 德国 | SIEMENS AG | 9 |
10 | 联发科技股份有限公司 | 中国 | MEDIATEK INC | 9 |
图28.39-2 2021年半导体零配件领域在欧专利授权前10机构
致谢
感谢大连理工大学刘则渊教授、河南师范大学梁立明教授、科技部中国科学技术发展战略研究院武夷山研究员、大连理工大学丁堃教授、大连理工大学杨中楷教授对本报告的大力支持与帮助。同时，向以不同形式对本报告提出意见和建议的专家学者们表示诚挚的感谢。
如需要中美欧日韩五局及PCT专利数据、专利报告，以及咨询相关专利问题请添加微信号。
附表 2021年该领域欧洲授权专利
| PATENT NO. | TITLE | ASSIGNEE |
| EP1316998 | Bumpless Chip Scale Device (CSP) and board assembly | TEXAS INSTRUMENTS INC |
| EP1603158 | PRINTED WIRING BOARD, METHOD FOR MANUFACTURING SAME, LEAD FRAME PACKAGE AND OPTICAL MODULE | FURUKAWA ELECTRIC CO LTD |
| EP1830405 | SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORP |
| EP1938375 | LEADFRAMES FOR IMPROVED MOISTURE RELIABILITY OF SEMICONDUCTOR DEVICES | TEXAS INSTRUMENTS INC |
| EP2005472 | MICROELECTRONIC DEVICES, STACKED MICROELECTRONIC DEVICES, AND METHODS FOR MANUFACTURING SUCH DEVICES | MICRON TECHNOLOGY INC |
| EP2041592 | METHODS AND APPARATUS FOR PASSIVE ATTACHMENT OF COMPONENTS FOR INTEGRATED CIRCUITS | ALLEGRO MICROSYSTEMS INC |
| EP2111636 | HIGH THERMAL PERFORMANCE PACKAGING FOR CIRCUIT DIES | AGERE SYSTEMS INC |
| EP2195831 | A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND THE CORRESPONDING INTERMEDIATE PRODUCT | MICRON TECHNOLOGY INC |
| EP2196075 | LAYERED HEAT SPREADER AND METHOD OF MAKING THE SAME | SPECIALTY MINERALS MICHIGAN |
| EP2232969 | THERMALLY AND ELECTRICALLY CONDUCTIVE INTERCONNECT STRUCTURES | BERGQUIST CO |
| EP2242101 | Receive circuit for connectors with variable complex impedance | ORACLE AMERICA INC |
| EP2284881 | HIGH FREQUENCY MODULE INCLUDING A STORING CASE AND A PLURALITY OF HIGH FREQUENCY CIRCUITS | MITSUBISHI ELECTRIC CORP |
| EP2296177 | SUBSTRATE FOR POWER MODULE, POWER MODULE, AND METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE | MITSUBISHI MATERIALS CORP |
| EP2313924 | GROUNDING SYSTEM AND APPARATUS | JOHNSON CONTROLS TECH CO |
| EP2319081 | METHOD AND APPARATUS FOR FORMING I/O CLUSTERS IN INTEGRATED CIRCUITS | QUALCOMM INC |
| EP2354746 | COOLING MEMBER, AND METHOD AND DEVICE FOR MANUFACTURING SAME | DAIKIN IND LTD |
| EP2357666 | III-nitride power device with solderable front metal | INT RECTIFIER CORP |
| EP2382661 | INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC INTERCONNECTION | ST MICROELECTRONICS SRL |
| EP2393109 | Semiconductor components including conductive through-wafer vias | MICRON TECHNOLOGY INC |
| EP2406816 | METHOD FOR FABRICATING SEMICONDUCTOR COMPONENTS USING MASKLESS BACK SIDE ALIGNMENT TO CONDUCTIVE VIAS | MICRON TECHNOLOGY INC |
| EP2427909 | PANELIZED BACKSIDE PROCESSING FOR THIN SEMICONDUCTORS | QUALCOMM INC |
| EP2463906 | Semiconductor device | TOSHIBA KK |
| EP2469591 | Method for fabricating a semiconductor device package | GEN ELECTRIC |
| EP2483919 | NANOSCALE INTERCONNECTS FABRICATED BY ELECTRICAL FIELD DIRECTED ASSEMBLY OF NANOELEMENTS | UNIV NORTHEASTERN |
| EP2497109 | PACKAGE CONFIGURATIONS FOR LOW EMI CIRCUITS | TRANSPHORM INC |
| EP2506302 | WIRING SUBSTRATE, IMAGING DEVICE AND IMAGING DEVICE MODULE | KYOCERA CORP |
| EP2507830 | SLOTTED CONFIGURATION FOR OPTIMIZED PLACEMENT OF MICRO-COMPONENTS USING ADHESIVE BONDING | LIGHTWIRE LLC |
| EP2518764 | Group III nitride based flip-chip integrated circuit and method for fabricating | CREE INC |
| EP2525638 | SUBSTRATE WITH INTEGRATED FINS AND METHOD OF MANUFACTURING SUBSTRATE WITH INTEGRATED FINS | NIPPON LIGHT METAL CO |
| EP2538441 | Apparatus and method for frequency generation | QUALCOMM INC |
| EP2548223 | MICROFABRICATED PILLAR FINS FOR THERMAL MANAGEMENT | QUALCOMM INC |
| EP2582213 | FLOW CHANNEL MEMBER, HEAT EXCHANGER USING SAME, AND ELECTRONIC COMPONENT DEVICE | KYOCERA CORP |
| EP2589076 | BUMPLESS BUILD-UP LAYER PACKAGE DESIGN WITH AN INTERPOSER | INTEL CORP |
| EP2590211 | System and method for operating an electric power converter | GEN ELECTRIC |
| EP2595187 | Surface mountable microwave signal Transition block for microstrip to perpendicular waveguide transition | DELPHI TECH INC |
| EP2596520 | MICROELECTRONIC ELEMENTS WITH REAR CONTACTS CONNECTED WITH VIA FIRST OR VIA MIDDLE STRUCTURES | TESSERA INC |
| EP2596529 | STACKABLE MOLDED MICROELECTRONIC PACKAGES | TESSERA INC |
| EP2600399 | Power semiconductor device | HITACHI LTD |
| EP2605345 | Thermal management of photonics assemblies | ALCATEL LUCENT |
| EP2610908 | COOLING DEVICE | SANOH IND CO LTD |
| EP2612355 | RAMP-STACK CHIP PACKAGE AND MANUFATCURE METHODE THEREOF | ORACLE INT CORP |
| EP2614524 | MONOLITHIC MICROWAVE INTEGRATED CIRCUIT | RAYTHEON CO |
| EP2616995 | SYSTEMS AND METHODS FOR INTEGRATING RADIO-FREQUENCY IDENTIFICATION CIRCUITRY INTO FLEXIBLE CIRCUITS | APPLE INC |
| EP2622654 | METHOD FOR MANUFACTURING OF AN ELECTRIC ACTUATOR | KRUUNUTEKNIIKKA OY |
| EP2626897 | TRANSMISSION LINE TRANSITION HAVING VERTICAL STRUCTURE AND SINGLE CHIP PACKAGE USING LAND GRID ARRAY JOINING | SAMSUNG ELECTRONICS CO LTD |
| EP2626898 | Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus | SHINETSU CHEMICAL CO |
| EP2641269 | USING BUMP BONDING TO DISTRIBUTE CURRENT FLOW ON A SEMICONDUCTOR POWER DEVICE | MICROCHIP TECH INC |
| EP2642517 | SEMICONDUCTOR DEVICE | FUJI ELECTRIC CO LTD |
| EP2647058 | PHOTOVOLTAIC MODULE WITH A CONTROLLED VACUUM, USE OF AN OXYGEN GETTER IN A PHOTOVOLTAIC MODULE AND METHOD FOR MANUFACTURING SUCH A MODULE | APOLLON SOLAR |
| EP2649639 | HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS | TESSERA INC |
| EP2657966 | INSULATING STRUCTURE FOR POWER MODULE AND POWER CONVERSION DEVICE USING POWER MODULE | HITACHI AUTOMOTIVE SYSTEMS LTD |
| EP2673803 | POWER SEMICONDUCTOR MODULE | ABB RESEARCH LTD |
| EP2674971 | METHOD FOR MANUFACTURING HEAT DISSIPATING PLATE FOR SEMICONDUCTOR MODULE, SAID HEAT DISSIPATING PLATE, AND SEMICONDUCTOR MODULE USING SAID HEAT DISSIPATING PLATE | FUJI ELECTRIC CO LTD |
| EP2700095 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | TOYOTA MOTOR CO LTD |
| EP2731128 | Low profile surface mount package with isolated tab | GEN ELECTRIC |
| EP2737539 | HIGH VOLTAGE MOSFET AND METHOD OF MAKING THE SAME | MICROCHIP TECH INC |
| EP2738795 | Electronic device with a mounting substrate with a roughened mounting surface and method for producing the same | DOWA METALTECH CO LTD |
| EP2738798 | PACKAGE FOR ACCOMMODATING SEMICONDUCTOR ELEMENT, SEMICONDUCTOR DEVICE PROVIDED WITH SAME, AND ELECTRONIC DEVICE | KYOCERA CORP |
| EP2744311 | Method for producing resonating patterns suitable for the performance of passive RF functions | THALES SA |
| EP2747134 | Amplifier device | NXP BV |
| EP2761655 | INTERLAYER COMMUNICATIONS FOR 3D INTEGRATED CIRCUIT STACK | INTEL CORP |
| EP2766931 | STUB MINIMIZATION FOR WIREBOND ASSEMBLIES WITHOUT WINDOWS | INVENSAS CORP |
| EP2769410 | POWER SEMICONDUCTER MODULE AND POWER SEMICONDUCTOR MODULE ASSEMBLY WITH MULTIPLE POWER SEMICONDUCTER MODULES | ABB TECHNOLOGY AG |
| EP2772936 | Method of wire bonding parallel bond wires aswell as a reshaping process of the same, and the related apparatus | THALES SA |
| EP2775520 | Open source Power Quad Flat No-Lead (PQFN) leadframe | INT RECTIFIER CORP |
| EP2792943 | LED holder | BENDER & WIRTH GMBH CO |
| EP2793256 | Semiconductor device manufacturing method and semiconductor device | FUJI ELECTRIC CO LTD |
| EP2812919 | STACKED DIE ASSEMBLY WITH MULTIPLE INTERPOSERS | XILINX INC |
| EP2815429 | MAINTAINING ALIGNMENT IN A MULTI-CHIP MODULE USING A COMPRESSIBLE STRUCTURE | ORACLE INT CORP |
| EP2816604 | Array substrate and organic light-emitting display including the same | SAMSUNG DISPLAY CO LTD |
| EP2816624 | Method for producing a through electrical connection and a through capacitor in a substrate, and corresponding device | ST MICROELECTRONICS CROLLES 2 |
| EP2824696 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF | TOYOTA MOTOR CO LTD |
| EP2824705 | Semiconductor devices | INTEL IP CORP |
| EP2831913 | METHOD OF PROVIDING A VIA HOLE AND ROUTING STRUCTURE | SILEX MICROSYSTEMS AB |
| EP2833397 | SUBSTRATE FOR POWER MODULE AND MANUFACTURING METHOD THEREFOR | MITSUBISHI MATERIALS CORP |
| EP2849223 | Semiconductor substrate including a cooling channel and method of forming a semiconductor substrate including a cooling channel | HAMILTON SUNDSTRAND CORP |
| EP2849543 | Components and circuits for output termination | FUJITSU SEMICONDUCTOR LTD |
| EP2860777 | LED ILLUMINATION MODULE AND LED ILLUMINATION APPARATUS | SHIKOKU INSTRUMENTATION CO LTD |
| EP2862204 | MULTICHIP PACKAGING FOR IMAGING SYSTEM | RAYTHEON CO |
| EP2863725 | HEAT DISSIPATION STRUCTURE | KANEKA CORP |
| EP2866257 | Printed circuit board and manufacturing method thereof and semiconductor pacakge using the same | LG INNOTEK CO LTD |
| EP2870626 | HANDLE FOR SEMICONDUCTOR-ON-DIAMOND WAFERS AND METHOD OF MANUFACTURE | ELEMENT SIX TECHNOLOGIES US CORP |
| EP2870836 | PARASITIC CAPACITANCE COMPENSATING TRANSMISSION LINE | CISCO TECH INC |
| EP2875525 | SEMICONDUCTOR DIE WITH A THROUGH SILICON VIA AND MANUFACTURING PROCESS OF A SUCH VIA | IPDIA |
| EP2879174 | Packaged RF power transistor device having next to each other a ground and a video lead for connecting a decoupling capacitor, RF power amplifier | NXP BV |
| EP2884242 | Sensor Package And Manufacturing Method | NXP BV |
| EP2884532 | Method for manufacturing an electrically conductive member for an electronic component having one end provided with a cavity | COMMISSARIAT ENERGIE ATOMIQUE |
| EP2889901 | Semiconductor device with through-substrate via and method of producing a semiconductor device with through-substrate via | AMS AG |
| EP2889902 | ELECTRIC POWER SEMICONDUCTOR DEVICE | MITSUBISHI ELECTRIC CORP |
| EP2891808 | Systems and methods for coupling a semiconductor device of an automation device to a heat sink | ROCKWELL AUTOMATION TECH INC |
| EP2894954 | HEAT DISSIPATION HOUSING STRUCTURE CONNECTED TO HEAT DISSIPATION FIN | MARCHESI METAL TECHNOLOGY SUZHOU CO LTD |
| EP2899754 | Semiconductor device | SAMSUNG ELECTRONICS CO LTD |
| EP2904637 | DEVICE AND METHOD FOR TEMPERATURE CONTROL | FORCED PHYSICS LLC |
| EP2911192 | SUBSTRATE FOR POWER MODULE WITH HEAT SINK, POWER MODULE WITH HEAT SINK, AND METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK | MITSUBISHI MATERIALS CORP |
| EP2912705 | INDUCTOR STRUCTURE WITH PRE-DEFINED CURRENT RETURN | XILINX INC |
| EP2914077 | COMPONENT SUPPLY APPARATUS | FUJI MACHINE MFG |
| EP2916349 | SEMICONDUCTOR MODULE | NSK LTD |
| EP2917936 | AXIAL SEMICONDUCTOR PACKAGE | VISHAY GEN SEMICONDUCTOR LLC |
| EP2919263 | COVER MATERIAL FOR HERMITIC SEALING AND PACKAGE FOR CONTAINING ELECTRONIC COMPONENT | NEOMAX MATERIALS CO LTD |
| EP2924726 | Thermal interface devices | GEN ELECTRIC |
| EP2927951 | PROTECTIVE-FILM-FORMING COMPOSITION, PROTECTIVE-FILM-FORMING SHEET, AND CHIP WITH CURABLE PROTECTIVE FILM | LINTEC CORP |
| EP2927954 | Fastening system for a power module | BRUSA ELEKTRONIK AG |
| EP2929562 | SEMICONDUCTOR ASSEMBLY | ABB TECHNOLOGY LTD |
| EP2936554 | DIE-STACKED DEVICE WITH PARTITIONED MULTI-HOP NETWORK | ADVANCED MICRO DEVICES INC |
| EP2936558 | SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE | |
| EP2938172 | HEAT CONTROL DEVICE FOR POWER EQUIPMENT | ACCELINK TECHNOLOGIES CO LTD |
| EP2950358 | LIGHT EMITTING DEVICE PACKAGE | LG INNOTEK CO LTD |
| EP2962329 | HIGH QUALITY FACTOR INDUCTOR IMPLEMENTED IN WAFER LEVEL PACKAGING (WLP) | QUALCOMM INC |
| EP2963686 | SEMICONDUCTOR PHOTODETECTION DEVICE | HAMAMATSU PHOTONICS KK |
| EP2965355 | POWER MOS TRANSISTOR WITH IMPROVED METAL CONTACT | MICROCHIP TECH INC |
| EP2972651 | ELECTRONIC DEVICES ASSEMBLED WITH HEAT ABSORBING AND/OR THERMALLY INSULATING COMPOSITION | HENKEL IP & HOLDING GMBH |
| EP2973662 | PASSIVATION LAYER FOR HARSH ENVIRONMENTS AND METHODS OF FABRICATION THEREOF | BOSCH GMBH ROBERT |
| EP2973697 | STACKED WAFER WITH COOLANT CHANNELS | RAYTHEON CO |
| EP2984652 | THERMAL MANAGEMENT FOR SOLID-STATE DRIVE | WESTERN DIGITAL TECH INC |
| EP2988325 | ELECTRICAL INTERCONNECT STRUCTURE FOR AN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THEREOF | GEN ELECTRIC |
| EP2988328 | Power semiconductor module and method of manufacturing there same | ABB TECHNOLOGY OY |
| EP2998991 | SEMICONDUCTOR DEVICE AND METHODS FOR MANUFACTURING THE SAME | TOSHIBA KK |
| EP3002786 | Semiconductor chip | SENSIRION AG |
| EP3002795 | ILLUMINATION DEVICE | TOSHIBA LIGHTING & TECHNOLOGY |
| EP3007223 | POWER CONVERTER PACKAGE WITH INTEGRATED OUTPUT INDUCTOR | INT RECTIFIER CORP |
| EP3007227 | COMPACT POWER SEMICONDUCTOR PACKAGE | INT RECTIFIER CORP |
| EP3016138 | PACKAGED ASSEMBLY FOR HIGH DENSITY POWER APPLICATIONS | INFINEON TECHNOLOGIES CORP |
| EP3016484 | SOLID STATE CONTACTOR WITH IMPROVED INTERCONNECT STRUCTURE | GOODRICH CORP |
| EP3018712 | SEMICONDUCTOR DEVICE | RENESAS ELECTRONICS CORP |
| EP3024023 | Slat fastening assembly | |
| EP3026700 | POWER MODULE AND MANUFACTURING METHOD THEREOF | ROHM CO LTD |
| EP3030061 | WIRING SUBSTRATE, WIRING SUBSTRATE WITH LEAD, AND ELECTRONIC DEVICE | KYOCERA CORP |
| EP3031075 | CONDUCTIVE INTERCONNECT STRUCTURES INCORPORATING NEGATIVE THERMAL EXPANSION MATERIALS AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS | MICRON TECHNOLOGY INC |
| EP3032578 | METHOD FOR FABRICATING THROUGH-SUBSTRATE VIAS | IMEC |
| EP3038155 | INTEGRATED CIRCUIT PACKAGE WITH A CAPACITOR | INTEL CORP |
| EP3042394 | LOW PACKAGE PARASITIC INDUCTANCE USING A THRU-SUBSTRATE INTERPOSER | QUALCOMM INC |
| EP3043380 | Cooling apparatus | ABB TECHNOLOGY OY |
| EP3047521 | VARIABLE HEAT CONDUCTOR | GE INTELLIGENT PLATFORMS INC |
| EP3050081 | INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES | INTEL CORP |
| EP3050098 | DIE PACKAGE WITH SUPERPOSER SUBSTRATE FOR PASSIVE COMPONENTS | INTEL CORP |
| EP3051584 | HEAT SPREADER WITH DOWN SET LEG ATTACHMENT FEATURE | INTEL CORP |
| EP3053187 | HIGH POWER RF CIRCUIT | ANAREN INC |
| EP3053190 | THREE DIMENSIONAL STRUCTURES WITHIN MOLD COMPOUND | INTEL CORP |
| EP3058592 | COMPACT LASER DEVICE | KONINKLIJKE PHILIPS NV |
| EP3062590 | WIRING BOARD AND ELECTRONIC DEVICE | KYOCERA CORP |
| EP3065167 | HIGH-FREQUENCY MODULE AND MICROWAVE TRANSCEIVER | TOSHIBA KK |
| EP3067922 | SEMICONDUCTOR DEVICE AND THE METHOD OF PRODUCING THE SAME | SONY CORP |
| EP3067999 | LASER-OSCILLATION COOLING DEVICE | MITSUBISHI HEAVY IND LTD |
| EP3069382 | INTEGRATED CIRCUIT ARRAY AND METHOD FOR MANUFACTURING AN ARRAY OF INTEGRATED CIRCUITS | KONINKLIJKE PHILIPS NV |
| EP3086364 | ELECTRONIC COMPONENT-USE PACKAGE AND PIEZOELECTRIC DEVICE | DAISHINKU CORP |
| EP3092879 | ELECTRONIC POWER DEVICE WITH IMPROVED COOLING | SAFRAN ELECTRONICS & DEFENSE |
| EP3093882 | ELECTRONIC CIRCUIT DEVICE | FURUKAWA ELECTRIC CO LTD |
| EP3096350 | SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD FOR FORMING THE SAME | |
| EP3098841 | PROCESS FOR MANUFACTURING A SURFACE-MOUNT SEMICONDUCTOR DEVICE, AND CORRESPONDING SEMICONDUCTOR DEVICE | ST MICROELECTRONICS SRL |
| EP3105787 | INTEGRATED DEVICE COMPRISING VIA WITH SIDE BARRIER LAYER TRAVERSING ENCAPSULATION LAYER | QUALCOMM INC |
| EP3105791 | SEMICONDUCTOR MODULE WITH TWO AUXILIARY EMITTER CONDUCTOR PATHS | ABB SCHWEIZ AG |
| EP3108499 | BOTTOM PACKAGE WITH METAL POST INTERCONNECTIONS | QUALCOMM INC |
| EP3111474 | METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD WITH AN EMBEDDED SENSOR CHIP, AND PRINTED CIRCUIT BOARD | AT & S AUSTRIA TECH & SYSTEMTECHNIK AG |
| EP3111475 | EMBEDDED MULTI-DEVICE BRIDGE WITH THROUGH-BRIDGE CONDUCTIVE VIA SIGNAL CONNECTION | INTEL CORP |
| EP3113216 | A METHOD FOR BONDING AND INTERCONNECTING INTEGRATED CIRCUIT DEVICES | IMEC VZW |
| EP3118896 | SEMICONDUCTOR DEVICE | TOYOTA MOTOR CO LTD |
| EP3120381 | FLEXIBLE ELECTRONICS APPARATUS AND ASSOCIATED METHODS | NOKIA TECHNOLOGIES OY |
| EP3123499 | THROUGH-BODY VIA FORMATION TECHNIQUES | INTEL CORP |
| EP3123508 | INDUCTOR EMBEDDED IN A PACKAGE SUBTRATE | QUALCOMM INC |
| EP3123509 | ANTIFUSE ELEMENT USING SPACER BREAKDOWN | INTEL CORP |
| EP3125287 | SEMICONDUCTOR MODULE AND DRIVE UNIT EQUIPPED WITH SEMICONDUCTOR MODULE | MITSUBISHI ELECTRIC CORP |
| EP3125291 | MULTILAYER STRUCTURE INCLUDING DIFFUSION BARRIER LAYER AND DEVICE INCLUDING THE MULTILAYER STRUCTURE | SAMSUNG ELECTRONICS CO LTD |
| EP3128546 | POWER AMPLIFIER MODULE PACKAGE AND PACKAGING METHOD THEREOF | CT INTEGRATED SMART SENSORS FOUND |
| EP3130005 | LIGHTING DEVICE HAVING A PATTERNED CONFORMAL COATING DOPED WITH A LUMINESCENT MATERIAL | GROTE IND LLC |
| EP3130007 | PACKAGE SUBSTRATE COMPRISING SURFACE INTERCONNECT AND CAVITY COMPRISING ELECTROLESS FILL | QUALCOMM INC |
| EP3131114 | BARE DIE INTEGRATION WITHIN A FLEXIBLE SUBSTRATE | PALO ALTO RES CT INC |
| EP3136430 | WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE | KYOCERA CORP |
| EP3136432 | RESIN STRUCTURE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN, AND METHOD FOR MANUFACTURING SAID STRUCTURE | OMRON TATEISI ELECTRONICS CO |
| EP3138126 | ELECTRONIC ASSEMBLY COMPRISING A CARRIER STRUCTURE MADE FROM A PRINTED CIRCUIT BOARD | AT & S AUSTRIA TECH & SYSTEMTECHNIK AG |
| EP3149768 | OVER-MOLD PACKAGING FOR WIDE BAND-GAP SEMICONDUCTOR DEVICES | CREE INC |
| EP3154077 | METHOD FOR MANUFACTURING AN ELECTRONIC ELEMENT AND AN ELECTRONIC ELEMENT | FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E V |
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| EP3208837 | ELECTRIC MODULE WITH ELECTRICAL COMPONENT | SIEMENS AG |
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| EP3471138 | HEAT SINK PLATE | THE GOODSYSTEM CORP |
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| EP3472861 | HETEROGENEOUS BALL PATTERN PACKAGE | XILINX INC |
| EP3472865 | A STANDARD CELL ARCHITECTURE FOR PARASITIC RESISTANCE REDUCTION | QUALCOMM INC |
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| EP3474644 | MULTILAYER WIRING BOARD FOR INSPECTION OF ELECTRONIC COMPONENTS | NGK SPARK PLUG CO |
| EP3477696 | ELEMENT SUBMOUNT AND METHOD FOR MANUFACTURING THE SAME | XSENSE TECH CORPORATION |
| EP3480843 | METHOD FOR MANUFACTURING PACKAGE SUBSTRATE FOR CARRYING SEMICONDUCTOR ELEMENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT-MOUNTED SUBSTRATE | MITSUBISHI GAS CHEMICAL CO |
| EP3483932 | GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION | INTEL CORP |
| EP3485510 | PACKAGE WITH PASSIVATED INTERCONNECTS | INTEL CORP |
| EP3491096 | GEL-TYPE THERMAL INTERFACE MATERIAL | HONEYWELL INT INC |
| EP3491665 | METHOD AND SYSTEM FOR BONDING A CHIP TO A SUBSTRATE | TNO |
| EP3495139 | THERMALLY CONDUCTIVE SILICONE RUBBER COMPOSITE SHEET | SHINETSU CHEMICAL CO |
| EP3496139 | HEAT DISSIPATION STRUCTURE FOR ELECTRIC CIRCUIT DEVICE | DENKA COMPANY LTD |
| EP3496152 | WIDE BANDGAP HIGH ELECTRON MOBILITY TRANSISTOR (HEMT) | CREE INC |
| EP3497722 | STANDALONE INTERFACE FOR STACKED SILICON INTERCONNECT (SSI) TECHNOLOGY INTEGRATION | XILINX INC |
| EP3499560 | SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME | INFINEON TECHNOLOGIES AG |
| EP3503176 | SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD | HUAWEI TECH CO LTD |
| EP3504792 | PACKAGED RF POWER AMPLIFIER HAVING A HIGH POWER DENSITY | AMPLEON NETHERLANDS BV |
| EP3506339 | MICRO DEVICE TRANSFER HEAD AND RELATED METHOD | |
| EP3506348 | THIN FILM PASSIVE DEVICES INTEGRATED IN A PACKAGE SUBSTRATE | INTEL CORP |
| EP3509114 | OPTICAL SEMICONDUCTOR DEVICE AND OPTICAL SEMICONDUCTOR DEVICE PRODUCTION METHOD | NIKKISO CO LTD |
| EP3511977 | SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME | INFINEON TECHNOLOGIES AG |
| EP3512034 | ON-PACKAGE INTEGRATED STIFFENER ANTENNA | INTEL CORP |
| EP3512315 | PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, PREPREG | PANASONIC IP MAN CO LTD |
| EP3513432 | PRESS-PACK POWER MODULE | RISE ACREO AB |
| EP3514828 | SEMICONDUCTOR INTEGRATED CIRCUITRY | SOCIONEXT INC |
| EP3520138 | INTEGRATED CIRCUIT PACKAGE HAVING RECTANGULAR ASPECT RATIO | INTEL CORP |
| EP3522685 | METALLIC LAYER AS CARRIER FOR COMPONENT EMBEDDED IN CAVITY OF COMPONENT CARRIER | AUSTRIA TECH & SYSTEM TECH |
| EP3523824 | HOUSING FOR AN ELECTRONIC COMPONENT, IN PARTICULAR A SEMICONDUCTOR CHIP | POSSEHL ELECTRONICS DEUTSCHLAND GMBH |
| EP3524529 | ADDITIVELY MANUFACTURED STRUCTURES FOR THERMAL AND/OR MECHANICAL SYSTEMS, AND METHODS FOR MANUFACTURING THE STRUCTURES | GEN ELECTRIC |
| EP3526815 | SIGNAL ROUTING IN INTEGRATED CIRCUIT PACKAGING | GOOGLE LLC |
| EP3529831 | COAXIAL CONNECTOR FEED-THROUGH FOR MULTI-LEVEL INTERCONNECTED SEMICONDUCTOR WAFERS | RAYTHEON CO |
| EP3529832 | POWER MODULE | BOSCH GMBH ROBERT |
| EP3529851 | HEAT DISSIPATING STRUCTURE AND BATTERY PROVIDED WITH THE SAME | SHINETSU POLYMER CO |
| EP3534398 | HEAT-DISSIPATING MEMBER AND ELECTRONIC DEVICE USING SAME | KYOCERA CORP |
| EP3534510 | ROTATING ELECTRICAL MACHINE HAVING INTEGRATED CONTROL DEVICE | MITSUBISHI ELECTRIC CORP |
| EP3536739 | HEAT-CONDUCTING FOAM SHEET FOR ELECTRONIC INSTRUMENTS AND HEAT-CONDUCTING LAMINATE FOR ELECTRONIC INSTRUMENTS | SEKISUI CHEMICAL CO LTD |
| EP3540359 | HEAT CONDUCTION DEVICE AND ASSOCIATED HEAT DISSIPATION SYSTEM | ALSTOM TRANSP TECH |
| EP3541157 | ELECTRONIC ASSEMBLY COMPRISING A HOUSING WITH COOLING FINS | ZUMTOBEL LIGHTING GMBH |
| EP3544053 | DISCRETE POWER TRANSISTOR PACKAGE HAVING SOLDERLESS DBC TO LEADFRAME ATTACH | IXYS CORP |
| EP3544055 | ELECTRICAL SWITCHING APPARATUS AND METHOD FOR PRODUCING AN ELECTRICAL SWITCHING APPARATUS | LEONI BORDNETZ SYS GMBH |
| EP3544392 | ELECTRONIC DEVICE AND METHOD FOR PRODUCING SAME | OMRON TATEISI ELECTRONICS CO |
| EP3545547 | INTEGRATED CIRCUIT NANOPARTICLE THERMAL ROUTING STRUCTURE OVER INTERCONNECT REGION | TEXAS INSTRUMENTS INC |
| EP3545550 | MANUFACTURING OF A POWER SEMICONDUCTOR MODULE | ABB SCHWEIZ AG |
| EP3547365 | POWER MODULE AND MANUFACTURING METHOD THEREOF | DELTA ELECTRONICS INC |
| EP3549164 | DEVICE FOR REMOVING HEAT | SAGEMCOM BROADBAND SAS |
| EP3554200 | CORE SUBSTRATE, MULTILAYER WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR MODULE, COPPER-CLAD SUBSTRATE, AND METHOD FOR PRODUCING CORE SUBSTRATE | TOPPAN PRINTING CO LTD |
| EP3555914 | POWER SEMICONDUCTOR MODULE WITH LOW GATE PATH INDUCTANCE | ABB SCHWEIZ AG |
| EP3555915 | ELECTRONIC POWER CIRCUITS COMPRISING BUS-BARS FORMING HEAT SINKS AND INTEGRATION METHOD | INST VEDECOM |
| EP3555965 | GROUND STRAP AND METHOD OF GROUNDING A PLURALITY OF ELECTRICALLY CONDUCTIVE MEMBERS THEREWITH | FED MOGUL POWERTRAIN LLC |
| EP3561429 | HEAT DISSIPATION DEVICE | CAMBRICON TECH CORP LTD |
| EP3565391 | WIRING SUBSTRATE SINGULATING METHOD AND SUBSTRATE FOR PACKAGE | TOPPAN PRINTING CO LTD |
| EP3566247 | CIRCUITS FOR AND METHODS OF IMPLEMENTING AN INDUCTOR AND A PATTERN GROUND SHIELD IN AN INTEGRATED CIRCUIT | XILINX INC |
| EP3571715 | SEMICONDUCTOR SWITCHING DEVICE | ABB SCHWEIZ AG |
| EP3571716 | PROCESS FOR MANUFACTURING A POWER ELECTRONIC MODULE BY ADDITIVE MANUFACTURING, ASSOCIATED MODULE AND SUBSTRATE | SAFRAN |
| EP3571717 | METHOD FOR FORMING A RESISTIVE ELEMENT IN A SUPERCONDUCTING INTERCONNECT STRUCTURE | NORTHROP GRUMMAN SYSTEMS CORP |
| EP3573097 | COOLING APPARATUS, SEMICONDUCTOR MODULE, VEHICLE, AND MANUFACTURING METHOD | FUJI ELECTRIC CO LTD |
| EP3573438 | REMOTE HEAT EXCHANGER | |
| EP3574522 | SEMICONDUCTOR ARRANGEMENT | YASA LTD |
| EP3574523 | SEMICONDUCTOR COOLING ARRANGEMENT | YASA LTD |
| EP3574721 | AN ELECTRONIC SENSITIVE ZONE PROTECTION SYSTEM | ASELSAN ELEKTRONIK SANAYI VE TICARET ANONIM SIRKETI |
| EP3575727 | LOOP-TYPE HEAT PIPE | SHINKO ELECTRIC IND CO |
| EP3577686 | METHOD FOR SECURING A BONDING PRODUCT IN A WORKING REGION OF A BONDER | HESSE GMBH |
| EP3579286 | PHOTONIC CHIP PENETRATED BY A VIA | COMMISSARIAT ENERGIE ATOMIQUE |
| EP3580779 | METHODS OF INTERCONNECT FOR HIGH DENSITY 2.5D AND 3D INTEGRATION | XILINX INC |
| EP3582259 | STEPPED COMPONENT ASSEMBLY ACCOMMODATED WITHIN A STEPPED CAVITY IN COMPONENT CARRIER | AUSTRIA TECH & SYSTEM TECH |
| EP3583622 | THERMAL DISSIPATION AND ELECTRICAL ISOLATING DEVICE | LOHMANN GMBH & CO KG |
| EP3583692 | ELECTRONIC ARRANGEMENT WITH POWER MODULE, CIRCUIT BOARD AND COOLING BODY | SEW EURODRIVE GMBH & CO |
| EP3584833 | ELECTRICAL POWER ASSEMBLY AND POWER MODULE WITH IMPROVED ALIGNMENT | MITSUBISHI ELECTRIC R&D CT EUROPE BV |
| EP3586360 | ELECTRONIC COMPONENT HAVING A TRANSISTOR AND INTERDIGITATED FINGERS TO FORM AT LEAST A PORTION OF A CAPACITIVE COMPONENT WITHIN THE ELECTRONIC COMPONENT | COMMISSARIAT ENERGIE ATOMIQUE |
| EP3588552 | THERMAL INTERFACE MATERIAL SHEET AND METHOD OF MANUFACTURING A THERMAL INTERFACE MATERIAL SHEET | ABB SCHWEIZ AG |
| EP3588556 | DISCRETE ELECTRONIC COMPONENT COMPRISING A TRANSISTOR | COMMISSARIAT ENERGIE ATOMIQUE |
| EP3588557 | PACKAGE STRUCTURE | DELTA ELECTRONICS INTL SINGAPORE PTE LTD |
| EP3588561 | DYNAMIC SUBSTRATE BIASING FOR EXTENDED VOLTAGE OPERATION | NXP USA INC |
| EP3590133 | FLEXIBLE CONDUCTIVE BONDING | MICROSOFT TECHNOLOGY LICENSING LLC |
| EP3593078 | COOLING DEVICE | SIEMENS AG |
| EP3598484 | HIGH-FREQUENCY CIRCUIT PACKAGE AND SENSOR MODULE | MITSUBISHI ELECTRIC CORP |
| EP3598487 | METHOD FOR INTEGRATING STRUCTURES IN A SUPPORT AND ASSOCIATED DEVICE | COMMISSARIAT ENERGIE ATOMIQUE |
| EP3598488 | SEMICONDUCTOR DEVICE, CHIP MODULE, AND SEMICONDUCTOR MODULE | AISIN AW CO |
| EP3602235 | FLEXIBLE HEAT SPREADER | MICROSOFT TECHNOLOGY LICENSING LLC |
| EP3603356 | CONTACT ARRANGEMENT | BOSCH GMBH ROBERT |
| EP3605599 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | SAMSUNG ELECTRONICS CO LTD |
| EP3605603 | SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER | SAMSUNG ELECTRONICS CO LTD |
| EP3608949 | IN-LINE PROTECTION FROM PROCESS INDUCED DIELECTRIC DAMAGE | NXP BV |
| EP3611455 | LOOP-TYPE HEAT PIPE AND METHOD OF MANUFACTURING THE SAME | SHINKO ELECTRIC IND CO |
| EP3611456 | LOOP HEAT PIPE | SHINKO ELECTRIC IND CO |
| EP3613076 | RADIOFREQUENCY TRANSMISSION/RECEPTION DEVICE | PRIMO1D |
| EP3618104 | SEMICONDUCTOR CHIPS AND METHODS OF MANUFACTURING THE SAME | SAMSUNG ELECTRONICS CO LTD |
| EP3618109 | INTEGRATED PASSIVE COUPLER AND METHOD | NXP BV |
| EP3618114 | SEMICONDUCTOR PACKAGE | SAMSUNG ELECTRONICS CO LTD |
| EP3619739 | SEMICONDUCTOR MODULE | BOSCH GMBH ROBERT |
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| EP3624186 | ELECTROMAGNETICALLY-SHIELDED MICROELECTRONIC ASSEMBLIES AND METHODS FOR THE FABRICATION THEREOF | NXP USA INC |
| EP3624187 | IMPENDANCE CONTROL UNIT | AMPLEON NETHERLANDS BV |
| EP3624206 | CHIP PACKAGE AND CHIP THEREOF | |
| EP3625819 | HYBRID BONDING METHOD FOR SEMICONDUCTOR WAFERS AND RELATED THREE-DIMENSIONAL INTEGRATED DEVICE | LFOUNDRY SRL |
| EP3625823 | POWER MODULE HAVING AT LEAST ONE POWER SEMICONDUCTOR | SIEMENS AG |
| EP3625824 | HEAT SINK AND METHOD FOR PRODUCING SAME | DIABATIX NV |
| EP3625834 | PRECLEAN AND DEPOSITION METHODOLOGY FOR SUPERCONDUCTOR INTERCONNECTS | NORTHROP GRUMMAN SYSTEMS CORP |
| EP3627549 | LIQUID-TYPE COOLING APPARATUS AND MANUFACTURING METHOD FOR HEAT RADIATION FIN IN LIQUID-TYPE COOLING APPARATUS | MITSUBISHI ELECTRIC CORP |
| EP3629372 | INTERCONNECT STRUCTURE AND RELATED METHODS | IMEC VZW |
| EP3631392 | OPTICALLY TRANSPARENT ELECTROMAGNETIC SHIELD ASSEMBLY | SAFRAN ELECTRONICS & DEFENSE |
| EP3631854 | METHOD AND APPARATUS FOR PRODUCING A PRINTED CIRCUIT BOARD SANDWICH AND PRINTED CIRCUIT BOARD SANDWICH | BOSCH GMBH ROBERT |
| EP3635779 | SILICA-CONTAINING SUBSTRATES WITH VIAS HAVING AN AXIALLY VARIABLE SIDEWALL TAPER AND METHODS FOR FORMING THE SAME | CORNING INC |
| EP3637462 | TRANSISTOR WITH NON-CIRCULAR VIA CONNECTIONS IN TWO ORIENTATIONS | NXP USA INC |
| EP3640982 | PCB BASED DOHERTY AMPLIFIER WITH IMPEDANCE MATCHING NETWORK ELEMENTS INTEGRATED IN THE PCB | CREE INC |
| EP3644355 | PACKAGING OF A SEMICONDUCTOR DEVICE WITH PHASE-CHANGE MATERIAL FOR THERMAL PERFORMANCE | DEERE & CO |
| EP3644358 | POWER SEMICONDUCTOR MODULE ARRANGEMENT INCLUDING A CONTACT ELEMENT | INFINEON TECHNOLOGIES AG |
| EP3647902 | LIQUID-COOLED INTEGRATED CIRCUIT SYSTEM | HEWLETT PACKARD ENTPR DEV LP |
| EP3648159 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE | INFINEON TECHNOLOGIES AUSTRIA AG |
| EP3648160 | ELECTRICALLY PROGRAMMABLE FUSE, MANUFACTURING METHOD THEREFOR, AND STORAGE UNIT | SHENZHEN WEITONGBO TECH CO LTD |
| EP3649671 | POWER SEMICONDUCTOR MODULE | ABB POWER GRIDS SWITZERLAND AG |
| EP3651188 | A METHOD FOR CONTACTING A BURIED INTERCONNECT RAIL FROM THE BACK SIDE OF AN IC | IMEC VZW |
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| EP3651195 | METHOD FOR MANUFACTURING A COOLING CIRCUIT | COMMISSARIAT ENERGIE ATOMIQUE |
| EP3651291 | SEMICONDUCTOR LASER DEVICE | PANASONIC IP MAN CO LTD |
| EP3651292 | SEMICONDUCTOR LASER DEVICE | PANASONIC IP MAN CO LTD |
| EP3651342 | INVERTER MODULE | AISIN AW CO |
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| EP3654373 | MULTI-CHIP-PACKAGE | INFINEON TECHNOLOGIES AG |
| EP3657671 | RF POWER AMPLIFIER PALLET | AMPLEON NETHERLANDS BV |
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| EP3668290 | HEAT DISSIPATION SHEET HAVING HIGH THERMAL CONDUCTIVITY AND HIGH ELECTRIC INSULATION PROPERTY | DENKA COMPANY LTD |
| EP3672378 | ELECTRIC DEVICE AND METHOD FOR PRODUCING SAME | OMRON TATEISI ELECTRONICS CO |
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| EP3679601 | SEMICONDUCTOR ASSEMBLY | SIEMENS AG |
| EP3679602 | THERMAL STRUCTURES FOR DISSIPATING HEAT AND METHODS FOR MANUFACTURE THEREOF | THE PROVOST FELLOWS FOUND SCHOLARS AND THE OTHER MEMBERS OF BOARD OF THE COLLEGE OF THE HOLY & UNDIV |
| EP3682473 | MULTIPLE GROUND PLANE THERMAL SINK | NORTHROP GRUMMAN SYSTEMS CORP |
| EP3686539 | HEAT SINK | FURUKAWA ELECTRIC CO LTD |
| EP3686540 | HEAT SINK | FURUKAWA ELECTRIC CO LTD |
| EP3686925 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE PROVIDED WITH SAME | MITSUBISHI ELECTRIC CORP |
| EP3686927 | SWITCHING SEMICONDUCTOR DEVICE | LG ELECTRONICS INC |
| EP3686928 | A SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE | ST MICROELECTRONICS SRL |
| EP3698400 | HEAT SINK FOR AN ELECTRONIC COMPONENT, ELECTRONIC SUBASSEMBLY WITH A HEAT SINK OF THIS KIND AND METHOD FOR PRODUCING A HEAT SINK OF THIS KIND | SIEMENS AG |
| EP3714485 | METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE | ROGERS GERMANY GMBH |
| EP3714669 | POWER ELECTRONIC MODULE | SAFRAN |
| EP3716324 | AN IMPROVED SOLID-STATE SWITCHING DEVICE OF THE WITHDRAWABLE TYPE | ABB SPA |
| EP3718959 | AN ELECTRONIC DEVICE AND CORRESPONDING MANUFACTURING METHOD | STMICROELECTRONICS MALTA LTD |
| EP3731266 | OPTIMAL SIGNAL ROUTING PERFORMANCE THROUGH DIELECTRIC MATERIAL CONFIGURATION DESIGNS IN PACKAGE SUBSTRATE | INTEL CORP |
| EP3735706 | METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE | ROGERS GERMANY GMBH |
| EP3739621 | THROUGH SILICON VIA FABRICATION | HONEYWELL INT INC |
| EP3740042 | ASSEMBLY AND METHOD FOR OPERATING A SEMICONDUCTOR ELEMENT AND LIGHT | MARELLI AUTOMOTIVE LIGHTING REUTLINGEN GERMANY GMBH |
| EP3787045 | MARKING METHOD | AZUR SPACE SOLAR POWER GMBH |
| EP3788651 | POWER SEMICONDUCTOR MODULE WITH INTEGRATED SURGE ARRESTER | ABB POWER GRIDS SWITZERLAND AG |
| EP3824494 | POWER SEMICONDUCTOR MODULE AND METHOD OF FORMING THE SAME | ABB POWER GRIDS SWITZERLAND AG |
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