2021年半导体制造领域在欧专利的布局与竞争——英特尔公司、法国原子能委员会、京东方科技集团公司领先
2022-10-21 17:49
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█武汉大学科教管理与评价研究中心 陈立新 张琳 黄颖
第三部分 2021年欧洲专利统计分析报告
28 各领域的欧洲专利布局和竞争
28.38 半导体制造领域的欧洲专利竞争态势
第38个技术领域是半导体制造，包括半导体及其部件的制造方法和设备。2021年，欧洲专利局在该领域共授权专利767项（增长率为-23%），占总授权量的0.7%，是专利数量第49多的领域。
2021年，美国在该领域获得专利权249项，占该领域专利授权总量的32.5%。中国在该领域做出专利发明52项，获得专利权51项。日本和韩国获得的专利权数量分别为189和23项。
表28.38-1 2021年各国半导体制造领域的在欧专利发明和专利权数量
国家 和地区 | 发明 数量 | 专利权 数量 | 净流失 数量 | 专利 流失率 | 发明 份额 | 专利权 份额 | 份额 流失量 | |
1 | 美国 | 240 | 249 | -9 | -3.7% | 31.3% | 32.5% | -1.2% |
2 | 德国 | 67 | 65 | 2 | 3.0% | 8.7% | 8.5% | 0.3% |
3 | 日本 | 191 | 189 | 2 | 1.0% | 24.9% | 24.6% | 0.3% |
4 | 法国 | 67 | 71 | -4 | -6.0% | 8.7% | 9.3% | -0.5% |
5 | 中国 | 52 | 51 | 1 | 1.9% | 6.8% | 6.6% | 0.1% |
6 | 韩国 | 22 | 23 | -1 | -4.5% | 2.9% | 3.0% | -0.1% |
7 | 英国 | 15 | 10 | 5 | 33.3% | 2.0% | 1.3% | 0.7% |
8 | 意大利 | 10 | 9 | 1 | 10.0% | 1.3% | 1.2% | 0.1% |
9 | 荷兰 | 12 | 11 | 1 | 8.3% | 1.6% | 1.4% | 0.1% |
10 | 瑞士 | 12 | 9 | 3 | 25.0% | 1.6% | 1.2% | 0.4% |
11 | 瑞典 | 3 | 2 | 1 | 33.3% | 0.4% | 0.3% | 0.1% |
12 | 加拿大 | 4 | 3 | 1 | 25.0% | 0.5% | 0.4% | 0.1% |
13 | 以色列 | 4 | 1 | 3 | 75.0% | 0.5% | 0.1% | 0.4% |
14 | 印度 | 1 | 1 | 0 | 0.0% | 0.1% | 0.1% | 0.0% |
15 | 其他 | 67 | 73 | -6 | -9.0% | 8.7% | 9.5% | -0.8% |
小计 | 767 | 767 | 0 | 0% | 100% | 100% | 0% |
注：本表分别按照专利第一发明人和第一权利人进行统计（中国的数据暂未包含香港、澳门、台湾地区的专利）。
图28.38-1 2021年各国半导体制造领域的在欧专利发明和专利权数量对比
2021年，在半导体制造领域上获得欧洲专利授权最多的机构是英特尔公司、法国原子能委员会、京东方科技集团公司。
表28.38-2 2021年半导体制造领域在欧专利授权前10机构
机构名称 | 国家 | 机构英文名称 | 2021 | |
1 | 英特尔公司 | 美国 | INTEL CORP | 32 |
2 | 法国原子能委员会 | 法国 | COMMISSARIAT ENERGIE ATOMIQUE | 25 |
3 | 京东方科技集团公司 | 中国 | BOE TECHNOLOGY GROUP CO LTD | 22 |
4 | 微电子研究中心 | 比利时 | IMEC VZW | 18 |
5 | 村田机械株式会社 | 日本 | MURATA MACHINERY LTD | 16 |
6 | 硅绝缘体技术有限公司 | 法国 | SOITEC SILICON ON INSULATOR | 15 |
7 | 应用材料有限公司 | 美国 | APPLIED MATERIALS INC | 15 |
8 | 科锐公司 | 美国 | CREE INC | 13 |
9 | 美光科技公司 | 美国 | MICRON TECHNOLOGY INC | 12 |
10 | 科天公司 | 美国 | KLA TENCOR CORP | 12 |
注：本表数据按照第一权利人进行统计。
图28.38-2 2021年半导体制造领域在欧专利授权前10机构
致谢
感谢大连理工大学刘则渊教授、河南师范大学梁立明教授、科技部中国科学技术发展战略研究院武夷山研究员、大连理工大学丁堃教授、大连理工大学杨中楷教授对本报告的大力支持与帮助。同时，向以不同形式对本报告提出意见和建议的专家学者们表示诚挚的感谢。
如需要中美欧日韩五局及PCT专利数据、专利报告，以及咨询相关专利问题请添加微信号。
附表 2021年该领域欧洲授权专利
| PATENT NO. | TITLE | ASSIGNEE |
| EP1398836 | Thin film semiconductor device and manufacturing method | NEC CORP |
| EP1544163 | Method for producing semiconductor device and a semiconductor device, more especially a membrane sensor | BOSCH GMBH ROBERT |
| EP1739483 | Positive photosensitive composition and pattern forming method using the same | FUJI PHOTO FILM CO LTD |
| EP1775760 | WAFER PROCESSING TAPE | FURUKAWA ELECTRIC CO LTD |
| EP1815530 | FIELD EFFECT TRANSISTOR EMPLOYING AN AMORPHOUS OXIDE | CANON KK |
| EP1878043 | LOW-DIELECTRIC CONSTANT CRYPTOCRYSTAL LAYERS AND NANOSTRUCTURES | TUBITAK |
| EP1894234 | SUBSTRATE STIFFNESS METHOD AND RESULTING DEVICES FOR LAYER TRANSFER PROCESSES | SILICON GENESIS CORP |
| EP1917132 | PLASTIC SEMICONDUCTOR PACKAGE HAVING IMPROVED CONTROL OF DIMENSIONS | TEXAS INSTRUMENTS INC |
| EP1974373 | METHODS OF FABRICATING TRANSISTORS INCLUDING SUPPORTED GATE ELECTRODES AND RELATED DEVICES | CREE INC |
| EP1981063 | PROCESS FOR PRODUCING SOI WAFER AND SOI WAFER | SHINETSU CHEMICAL CO |
| EP1981064 | PROCESS FOR PRODUCING SOI WAFER AND SOI WAFER | SHINETSU CHEMICAL CO |
| EP1994553 | GATE-COUPLED EPROM CELL FOR PRINTHEAD | HEWLETT PACKARD DEVELOPMENT CO |
| EP2050132 | APPARATUS FOR STORAGE OF OBJECTS FROM THE FIELD OF MANUFACTURE OF ELECTRONIC COMPONENTS | TEC SEM AG |
| EP2095405 | SOLAR CELLS | ELKEM SOLAR AS |
| EP2096673 | Display device and manufacturing method thereof | HITACHI DISPLAYS LTD |
| EP2195831 | A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND THE CORRESPONDING INTERMEDIATE PRODUCT | MICRON TECHNOLOGY INC |
| EP2214272 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, COMMUNICATION APPARATUS, AND SEMICONDUCTOR LASER | FURUKAWA ELECTRIC CO LTD |
| EP2242095 | SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD | FUJITSU SEMICONDUCTOR LTD |
| EP2242101 | Receive circuit for connectors with variable complex impedance | ORACLE AMERICA INC |
| EP2254146 | Semiconductor structure and method of manufacturing a semiconductor structure | COMMISSARIAT ENERGIE ATOMIQUE |
| EP2264741 | Silicon carbide dimpled substrate | CREE INC |
| EP2267527 | Pellicle frame and lithographic pellicle | SHINETSU CHEMICAL CO |
| EP2296177 | SUBSTRATE FOR POWER MODULE, POWER MODULE, AND METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE | MITSUBISHI MATERIALS CORP |
| EP2298509 | CARRIER DEVICE, POSITION-TEACHING METHOD, AND SENSOR JIG | RORZE CORP |
| EP2333814 | Auto-sequencing multi-directional inline processing apparatus | ORBOTECH LT SOLAR LLC |
| EP2351872 | TREATMENT METHOD USING PLASMA | TOKYO INST TECH |
| EP2357059 | Method for chemical mechanical planarization of a tungsten-containing substrate | DUPONT AIR PROD NANOMATERIALS |
| EP2358926 | ELECTRODEPOSITION OF COPPER IN MICROELECTRONICS WITH DIPYRIDYL-BASED LEVELERS | ENTHONE |
| EP2372749 | Treatment device for treating a surface of a body | LEVITRONIX GMBH |
| EP2382661 | INTEGRATED ELECTRONIC DEVICE WITH TRANSCEIVING ANTENNA AND MAGNETIC INTERCONNECTION | ST MICROELECTRONICS SRL |
| EP2387796 | SYSTEM AND METHOD FOR INSPECTING A WAFER | SEMICONDUCTOR TECH & INSTR INC |
| EP2393109 | Semiconductor components including conductive through-wafer vias | MICRON TECHNOLOGY INC |
| EP2396808 | MIGRATION AND PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION | BUTCHER KENNETH SCOTT ALEXANDER |
| EP2402982 | Method for manufacturing thin film capacitor and thin film capacitor obtained by the same | ST MICROELECTRONICS TOURS SAS |
| EP2404316 | THRESHOLD VOLTAGE ADJUSTMENT THROUGH GATE DIELECTRIC STACK MODIFICATION | IBM |
| EP2406816 | METHOD FOR FABRICATING SEMICONDUCTOR COMPONENTS USING MASKLESS BACK SIDE ALIGNMENT TO CONDUCTIVE VIAS | MICRON TECHNOLOGY INC |
| EP2416349 | Method of forming vias in silicon carbide and resulting devices and circuits | CREE INC |
| EP2416629 | PULSE-MODULATED HIGH-FREQUENCY POWER CONTROL METHOD AND PULSE-MODULATED HIGH-FREQUENCY POWER SOURCE DEVICE | KYOSAN ELECTRIC MFG |
| EP2419929 | WAFER MANUFACTURING CLEANING APPARATUS, PROCESS AND METHOD OF USE | INTERNAT TEST SOLUTIONS |
| EP2432009 | PURGING APPARATUS AND PURGING METHOD | MURATA MACHINERY LTD |
| EP2444994 | WAFER PROCESSING SHEET | LG CHEMICAL LTD |
| EP2456904 | METHOD FOR PRODUCING A STRUCTURED COATING ON A SUBSTRATE, COATED SUBSTRATE, AND SEMI-FINISHED PRODUCT HAVING A COATED SUBSTRATE | MSG LITHOGLAS AG |
| EP2458620 | Fabrication of graphene electronic devices using step surface contour | IHP GMBH |
| EP2478563 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | SEMICONDUCTOR ENERGY LAB |
| EP2483919 | NANOSCALE INTERCONNECTS FABRICATED BY ELECTRICAL FIELD DIRECTED ASSEMBLY OF NANOELEMENTS | UNIV NORTHEASTERN |
| EP2492963 | Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof | CREE INC |
| EP2497109 | PACKAGE CONFIGURATIONS FOR LOW EMI CIRCUITS | TRANSPHORM INC |
| EP2517226 | METHOD AND DEVICE FOR TREATING SILICON SUBSTRATES | SCHMID GMBH GEBR |
| EP2518764 | Group III nitride based flip-chip integrated circuit and method for fabricating | CREE INC |
| EP2525391 | Method for producing ferroelectric thin film | MITSUBISHI MATERIALS CORP |
| EP2534690 | SYSTEMS AND METHODS FOR A CONTINUOUS-WELL DECOUPLING CAPACITOR | ADVANCED MICRO DEVICES INC |
| EP2538444 | SILICON CARBIDE INSULATED GATE SEMICONDUCTOR ELEMENT AND METHOD FOR PRODUCING SAME | SUMITOMO ELECTRIC INDUSTRIES |
| EP2539104 | METHOD AND APPARATUS FOR IRRADIATING A SEMICONDUCTOR MATERIAL SURFACE BY LASER ENERGY | EXCICO FRANCE |
| EP2543060 | SYSTEMS AND METHODS FOR APPLICATION OF OPTICAL MATERIALS TO OPTICAL ELEMENTS | CREE INC |
| EP2543072 | STRUCTURES AND METHODS OF FABRICATING DUAL GATE DEVICES | VISHAY SILICONIX |
| EP2551891 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME | SUMITOMO ELECTRIC INDUSTRIES |
| EP2572380 | METHOD FOR PRODUCING CHIP STACKS, AND A CARRIER FOR CARRYING OUT THE METHOD | EV GROUP E THALLNER GMBH |
| EP2585628 | INCLUSION OF CHIP ELEMENTS IN A SHEATHED WIRE | COMMISSARIAT ENERGIE ATOMIQUE |
| EP2587531 | CURRENT CONTROL SEMICONDUCTOR DEVICE AND CONTROL APPARATUS USING SAME | HITACHI AUTOMOTIVE SYSTEMS LTD |
| EP2596520 | MICROELECTRONIC ELEMENTS WITH REAR CONTACTS CONNECTED WITH VIA FIRST OR VIA MIDDLE STRUCTURES | TESSERA INC |
| EP2596529 | STACKABLE MOLDED MICROELECTRONIC PACKAGES | TESSERA INC |
| EP2601675 | MULTI-LAYER OVERLAY METROLOGY TARGET AND COMPLIMENTARY OVERLAY METROLOGY MEASUREMENT SYSTEMS | KLA TENCOR CORP |
| EP2612156 | MODULAR SCANNER, AND METHOD FOR OPERATING SAME | CASCADE MICROTECH INC |
| EP2612355 | RAMP-STACK CHIP PACKAGE AND MANUFATCURE METHODE THEREOF | ORACLE INT CORP |
| EP2613375 | ORGANIC SEMICONDUCTOR PARTICULATE MATERIAL, ORGANIC SEMICONDUCTOR THIN-FILM, DISPERSION LIQUID FOR FORMING ORGANIC SEMICONDUCTOR FILM, METHOD FOR PRODUCING ORGANIC SEMICONDUCTOR THIN-FILM, AND ORGANIC THIN-FILM TRANSISTOR | UNIV SHINSHU |
| EP2620981 | Transistors and methods of manufacturing the same | SAMSUNG ELECTRONICS CO LTD |
| EP2624283 | SAPPHIRE SUBSTRATE AND SEMICONDUCTOR LIGHT-EMITTING ELEMENT | NICHIA CORP |
| EP2624291 | Device for processing a substrate and method for this | SOLAR SEMI GMBH |
| EP2626898 | Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus | SHINETSU CHEMICAL CO |
| EP2626908 | SOLAR CELL ELEMENT AND METHOD FOR MANUFACTURING SAME | SHOEI CHEMICAL IND CO |
| EP2636069 | SEMICONDUCTOR CHIP CARRIERS WITH MONOLITHICALLY INTEGRATED QUANTUM DOT DEVICES AND METHOD OF MANUFACTURE THEREOF | DE ROCHEMONT L PIERRE |
| EP2637197 | Direct bonding process using a compressible porous layer | COMMISSARIAT ENERGIE ATOMIQUE |
| EP2639828 | Circuit support assembly | BOSCH GMBH ROBERT |
| EP2642520 | Embedded flash memory | BROADCOM CORP |
| EP2645410 | Device for processing wafers | EV GROUP GMBH |
| EP2647043 | METHOD FOR TREATING WAFERS AND DIES | THIN MATERIALS AG |
| EP2649639 | HIGH DENSITY THREE-DIMENSIONAL INTEGRATED CAPACITORS | TESSERA INC |
| EP2656383 | SIMULTANEOUS WAFER BONDING AND INTERCONNECT JOINING | TESSERA INC |
| EP2659506 | VACUUM TREATMENT APPARATUS AND A METHOD FOR MANUFACTURING | OC OERLIKON BALZERS AG |
| EP2660857 | Thin-film photovoltaic device | FLISOM AG |
| EP2665088 | Layered bonded structures formed from reactive bonding of zinc metal and zinc peroxide | BOEING CO |
| EP2666184 | IMPROVED INTERFACE BETWEEN A I-III-VI2 MATERIAL LAYER AND A MOLYBDENUM SUBSTRATE | NEXCIS |
| EP2670887 | ADHESION PROMOTING COMPOSITION FOR METAL LEADFRAMES | MACDERMID ACUMEN INC |
| EP2672518 | Semiconductor device with heterojunction | NISSAN MOTOR |
| EP2673803 | POWER SEMICONDUCTOR MODULE | ABB RESEARCH LTD |
| EP2673806 | SEMICONDUCTOR DEVICE AND RELATED FABRICATION METHODS | FREESCALE SEMICONDUCTOR INC |
| EP2675935 | METHOD FOR PRODUCING A THIN FILM MADE OF LEAD ZIRCONATE TITANATE | PYREOS LTD |
| EP2680300 | Semiconductor device and driver circuit with drain and isolation structure interconnected through a diode circuit, and method of manufacture thereof | FREESCALE SEMICONDUCTOR INC |
| EP2688105 | High electron mobility transistors and methods of manufacturing the same | SAMSUNG ELECTRONICS CO LTD |
| EP2696365 | Semiconductor buffer structure, semiconductor device including the same, and method of manufacturing semiconductor device using semiconductor buffer structure | SAMSUNG ELECTRONICS CO LTD |
| EP2696369 | Methods for manufacturing a field-effect semiconductor device | IMEC |
| EP2722873 | CHEMICAL MECHANICAL POLISHING (CMP) COMPOSITION FOR SHALLOW TRENCH ISOLATION (STI) APPLICATIONS AND METHODS OF MAKING THEREOF | AIR PROD & CHEM |
| EP2722875 | Apparatus and method of electrical testing for flip chip | SPREADTRUM COMM SHANGHAI CO |
| EP2724377 | DMOS TRANSISTOR WITH A SLANTED SUPER JUNCTION DRIFT STRUCTURE | TEXAS INSTRUMENTS INC |
| EP2733733 | Stamp structures and transfer methods using the same | SAMSUNG ELECTRONICS CO LTD |
| EP2737485 | NVM BITCELL WITH A REPLACEMENT CONTROL GATE AND ADDITIONAL FLOATING GATE | SYNOPSYS INC |
| EP2737525 | SEMICONDUCTOR DIE ASSEMBLIES, SEMICONDUCTOR DEVICES INCLUDING SAME, AND METHODS OF FABRICATION | MICRON TECHNOLOGY INC |
| EP2737539 | HIGH VOLTAGE MOSFET AND METHOD OF MAKING THE SAME | MICROCHIP TECH INC |
| EP2738795 | Electronic device with a mounting substrate with a roughened mounting surface and method for producing the same | DOWA METALTECH CO LTD |
| EP2742527 | APPARATUS AND METHOD FOR BONDING SUBSTRATES | EV GROUP E THALLNER GMBH |
| EP2750179 | Integrated circuit including a clock tree cell | COMMISSARIAT L éNERGIE ATOMIQUE ET AUX éNERGIES ALTERNATIVES |
| EP2751833 | WAFER HOLDER AND TEMPERATURE CONDITIONING ARRANGEMENT AND METHOD OF MANUFACTURING A WAFER | OERLIKON ADVANCED TECHNOLOGIES AG |
| EP2754174 | CONTAINER STORAGE ADD-ON FOR BARE WORKPIECE STOCKER | DYNAMIC MICRO SYSTEMS |
| EP2754738 | SUBSTRATE FOR EPITAXIAL GROWTH, AND CRYSTAL LAMINATE STRUCTURE | TAMURA SEISAKUSHO KK |
| EP2755237 | Trench MOS gate semiconductor device and method of fabricating the same | SAMSUNG ELECTRONICS CO LTD |
| EP2761661 | MCT DEVICE WITH BASE-WIDTH-DETERMINED LATCHING AND NON-LATCHING STATES | PAKAL TECHNOLOGIES LLC |
| EP2763178 | IGBT AND MANUFACTURING METHOD THEREFOR | TOYOTA MOTOR CO LTD |
| EP2763181 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | SUMITOMO ELECTRIC INDUSTRIES |
| EP2765612 | Ga2O3 SEMICONDUCTOR ELEMENT | TAMURA SEISAKUSHO KK |
| EP2771909 | DEVICE FOR HEATING A SUBSTRATE | SMIT OVENS BV |
| EP2772943 | Method for producing a microelectronic device and corresponding device | COMMISSARIAT ENERGIE ATOMIQUE |
| EP2774177 | METHOD AND APPARATUS FOR FLOATING OR APPLYING VOLTAGE TO A WELL OF AN INTEGRATED CIRCUIT | SYNOPSYS INC |
| EP2780933 | METHOD OF TRANSFERRING A MICRO DEVICE | LUXVUE TECHNOLOGY CORP |
| EP2780934 | MICRO DEVICE TRANSFER HEAD | LUXVUE TECHNOLOGY CORP |
| EP2782119 | Method for locally modifying the strains in a SOI substrate, in particular a FD SOI substrate and corresponding device | ST MICROELECTRONICS CROLLES 2 |
| EP2782121 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | FUJI ELECTRIC CO LTD |
| EP2791034 | TRANSPORT APPARATUS | BROOKS AUTOMATION INC |
| EP2793256 | Semiconductor device manufacturing method and semiconductor device | FUJI ELECTRIC CO LTD |
| EP2798669 | COMPOSITIONS AND METHODS FOR SELECTIVELY ETCHING TITANIUM NITRIDE | ENTEGRIS INC |
| EP2801104 | IMPROVED INTERFACE BETWEEN A I/III/VI 2 LAYER AND A BACK CONTACT LAYER IN A PHOTOVOLTAIC CELL | NEXCIS |
| EP2802002 | Substrate having hetero-structure and method for manufacturing the same | LG ELECTRONICS INC |
| EP2804202 | THERMALLY OXIDIZED HETEROGENEOUS COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SAME | SHINETSU CHEMICAL CO |
| EP2804214 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF | TOYOTA MOTOR CO LTD |
| EP2805352 | VERTICAL INTEGRATION OF CMOS ELECTRONICS WITH PHOTONIC DEVICES | SKORPIOS TECHNOLOGIES INC |
| EP2806461 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME | FUJI ELECTRIC CO LTD |
| EP2812915 | SUBSTRATE TREATMENT SYSTEM | ROTH & RAU AG |
| EP2816624 | Method for producing a through electrical connection and a through capacitor in a substrate, and corresponding device | ST MICROELECTRONICS CROLLES 2 |
| EP2819154 | Method for forming a strained semiconductor structure | IMEC VZW |
| EP2823288 | WAFER AND RETICLE INSPECTION SYSTEMS AND METHOD FOR SELECTING ILLUMINATION PUPIL CONFIGURATIONS | KLA TENCOR CORP |
| EP2824693 | Nitride semiconductor element, nitride semiconductor wafer, and method for forming nitride semiconductor layer | TOSHIBA KK |
| EP2824696 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF | TOYOTA MOTOR CO LTD |
| EP2824698 | SUSCEPTOR | TOYO TANSO CO |
| EP2830097 | Bipolar transistor having self-adjusted emitter contact | IHP GMBH |
| EP2831910 | DEVICE FOR REMOVING A COATING FROM A SUBSTRATE AND METHOD | SOLAR SEMI GMBH |
| EP2831913 | METHOD OF PROVIDING A VIA HOLE AND ROUTING STRUCTURE | SILEX MICROSYSTEMS AB |
| EP2831929 | MANUFACTURE OF MULTIJUNCTION SOLAR CELL DEVICES | SOITEC SILICON ON INSULATOR |
| EP2836823 | SYSTEMS AND METHODS FOR SAMPLE INSPECTION AND REVIEW | KLA TENCOR CORP |
| EP2837025 | END HANDLER | SEMICONDUCTOR TECH & INSTR INC |
| EP2840593 | ENHANCED SWITCH DEVICE AND MANUFACTURING METHOD THEREFOR | ENKRIS SEMICONDUCTOR INC |
| EP2840599 | ACCOMMODATING CONTAINER, SHUTTER OPENING AND CLOSING UNIT FOR ACCOMMODATING CONTAINER, AND WAFER STOCKER USING SAME | RORZE CORP |
| EP2843712 | Device and method for the manufacture of a wafer having selective positioning in the carrier system | SILTECTRA GMBH |
| EP2851959 | SEMICONDUCTOR DEVICE | SUMITOMO ELECTRIC INDUSTRIES |
| EP2852980 | HEMT DEVICE AND METHOD OF MANUFACTURING THE SAME | HRL LAB LLC |
| EP2863417 | SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME | DENSO CORP |
| EP2863421 | Holder device for holding wafers | EV GROUP E THALLNER GMBH |
| EP2863440 | SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME | DENSO CORP |
| EP2870623 | PROCESS BOX, ASSEMBLY, AND METHOD FOR PROCESSING A COATED SUBSTRATE | SAINT GOBAIN |
| EP2870624 | DEVICE AND METHOD FOR HEAT TREATING AN OBJECT | SAINT GOBAIN |
| EP2870625 | SYSTEM AND METHOD FOR PROCESSING SUBSTRATES | SAINT GOBAIN |
| EP2870626 | HANDLE FOR SEMICONDUCTOR-ON-DIAMOND WAFERS AND METHOD OF MANUFACTURE | ELEMENT SIX TECHNOLOGIES US CORP |
| EP2875525 | SEMICONDUCTOR DIE WITH A THROUGH SILICON VIA AND MANUFACTURING PROCESS OF A SUCH VIA | IPDIA |
| EP2876666 | Method for producing ferroelectric thin film | MITSUBISHI MATERIALS CORP |
| EP2876675 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME, AND RINSING FLUID | MITSUI CHEMICALS INC |
| EP2879168 | METHOD FOR REMOVING POLYCRYSTALLINE SILICON PROTECTING LAYER ON IGBT BACK FACE HAVING FIELD TERMINATION STRUCTURE | CSMC TECHNOLOGIES FAB1 CO LTD |
| EP2884532 | Method for manufacturing an electrically conductive member for an electronic component having one end provided with a cavity | COMMISSARIAT ENERGIE ATOMIQUE |
| EP2889901 | Semiconductor device with through-substrate via and method of producing a semiconductor device with through-substrate via | AMS AG |
| EP2890835 | METHOD FOR DEPOSITING AN ALUMINIUM NITRIDE LAYER | OERLIKON ADVANCED TECHNOLOGIES AG |
| EP2891808 | Systems and methods for coupling a semiconductor device of an automation device to a heat sink | ROCKWELL AUTOMATION TECH INC |
| EP2892079 | Electronic circuits including a MOSFET and a dual-gate JFET | ACCO SEMICONDUCTOR INC |
| EP2893555 | DEVICE FOR SEPARATING TWO SUBSTRATES | SOITEC SILICON ON INSULATOR |
| EP2894954 | HEAT DISSIPATION HOUSING STRUCTURE CONNECTED TO HEAT DISSIPATION FIN | MARCHESI METAL TECHNOLOGY SUZHOU CO LTD |
| EP2901485 | NON-PLANAR SEMICONDUCTOR DEVICE HAVING GROUP III-V MATERIAL ACTIVE REGION WITH MULTI-DIELECTRIC GATE STACK | INTEL CORP |
| EP2901488 | NON-PLANAR SEMICONDUCTOR DEVICE HAVING GERMANIUM-BASED ACTIVE REGION WITH RELEASE ETCH-PASSIVATION SURFACE | INTEL CORP |
| EP2903018 | METHOD FOR FORMING FINE PATTERN, AND FINE PATTERN FORMED USING SAME | KOREA IND TECH INST |
| EP2903028 | TRENCH DMOS DEVICE AND MANUFACTURING METHOD THEREOF | CSMC TECHNOLOGIES FAB1 CO LTD |
| EP2904636 | RELEASABLE SUBSTRATE ON A CARRIER | TNO |
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