FN ISI Export Format
VR 1.0
PT P
AU GLENN, TP
PANCZAK, AE
HOLLAWAY, RD
AF GLENN, TP
PANCZAK, AE
HOLLAWAY, RD
TI Forming several chip size integrated circuit (IC) chip packages from a single insulated substrate.
SO H01L-021/56;H01L-021/44
LA English
DT Article
DE u11 (semiconductor materials and processes)
AB NOVELTY - The method comprises the steps of: (1) providing an insulated substrate (13) which has sections (12) with metallizations (22) on its surface; (2) mounting an IC chip in each section; (3) connecting bonding pads on the chips to corresponding metallizations with bond wires; (4) forming a dam (59) on the substrate around its edge; (5) filling the area defined by the dam with an encapsulant; and (6) cutting the encapsulant and the substrate along the edge of each section.
C1 AMKOR TECHNOLOGY INC (AMKR-C).
RP .
CR KAMATA T, 1000, 62009639, V0, P1
ROCHE G, 1000, US4530152, V0, P1
LUMBARD M, 1000, US4890383, V0, P1
COHN C, 1000, US5102829, V0, P1
TAKAMI S, 1000, US5126818, V0, P1
LONG JM, 1000, US5173766, V0, P1
LIN PT, 1000, US5216278, V0, P1
PATIL S, 1000, US5227663, V0, P1
LIN P, 1000, US5239198, V0, P1
MULLEN WB, 1000, US5241133, V0, P1
YAMAGUCHI T, 1000, US5250470, V0, P1
POLAK AJ, 1000, US5258650, V0, P1
FULCHER E, 1000, US5311060, V0, P1
JUSKEY FJ, 1000, US5336931, V0, P1
ROSTOKER M, 1000, US5386342, V0, P1
BLISH RC, 1000, US5397746, V0, P1
LIN PT, 1000, US5436203, V0, P1
MCSHANE MB, 1000, US5468999, V0, P1
DEGANI Y, 1000, US5473512, V0, P1
URUSHIMA M, 1000, US5474957, V0, P1
MIZUKOSHI M, 1000, US5578525, V0, P1
FUJIHARA M, 1000, US5593926, V0, P1
GLENN TP, 1000, US5596485, V0, P1
CIRINO CL, 1000, US5612513, V0, P1
HIGGINS LM, 1000, US5639989, V0, P1
TUTTLE ME, 1000, US5700981, V0, P1
MODEN WL, 1000, US5719440, V0, P1
DUDDERAR TD, 1000, US5767447, V0, P1
NELSON KE, 1000, US5776798, V0, P1
BANERJI, 1994, K. "DEVELOPMENT OF THE SLIGHTLY LARGER THAN IC CAR, V, P
LEVINE, 2112, B. AND GUINTHER F. "THE PACKAGE" ELECTRONIC NEWS V, V, P
NR 2
TC 0
PU
PI
PA
SN
J9 -
PD Oct-31
PY 1996
VL -
IS -
BP -
EP -
DI
PG -
SC U11-D01A3;U11-E02A1
GA 1999633333
UT DIIDW:1999633333
ER
尊敬的李老师,我用CiteSpace分析CSSCI的文献,在数据转换的时候,总是出现不能转换的情况,我把原始数据放在input文件夹,新建了output文件夹,不知道是什么原因,显示结果是:0 of 0 references have been converted successfully (0.0%)老师请你看看可能是什么原因呢?