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与3D-MID有关的20条相关文献

已有 662 次阅读 2021-5-8 21:15 |个人分类:新观察|系统分类:论文交流

与3D-MID有关的20条相关文献,仅供参考。

Title, Author(s), Bibliographic reference - 

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New standards for 3D-userinterfaces-manufactured by a Film Insert Molding process

Annette Wimmer, Herbert Reichel, Klaus Schmidt

2018, 2018 13th International Congress Molded Interconnect Devices (MID) - Proceeding

This paper describes a method for producing three-dimensional user interfaces. The technology is based on the conventional production of film insert molding components. As part of a research project, ...more

Galvanic Plating for 3D-MID Applications

Timo Kordass, Jörg Franke

2014, Proceedings of the 2014 37th International Spring Seminar on Electronics Technology - Proceeding

This paper gives an overview about the advantage of galvanic plating for 3D-MIDs. At first it is explained how the laser direct structuring process is proceeded. Exemplary on a serial application for ...more

CU Paste for Molded Interconnect Devices

Yoshinori Ejiri, Shinichirou Sukata, Masaya Toba, Kosuke Urashima, Motoki Yonekura, Takaaki Noudou, Yoshiaki Kurihara, Hiroshi Masuda

2019, 2019 Pan Pacific Microelectronics Symposium (Pan Pacific) - Proceeding

Cu particles with an average particle size of 130 nm were found to be suitable for low-temperature metallization. Cu wirings with line/space (L/S)=150 μm/150 μm and $L/S= 150~\mu m/100~\mu ...more

Doping of Alumina Substrates for Laser Induced Selective Metallization

Philipp Ninz, Frank Kern, Eugen Ermantraut, Hagen Müller, Wolfgang Eberhardt, André Zimmermann, Rainer Gadow

2018, Procedia CIRP - Article

Laser induced selective activation and metallization of ceramics is a novel additive metal plating process enabling the application fine metallic paths or metallic surfaces on complex three-dimension...more

Cu Paste for Molded Interconnect Devices

Yoshinori Ejiri, Shinichirou Sukata, Masaya Toba, Kosuke Urashima, Motoki Yonekura, Takaaki Noudou, Yoshiaki Kurihara, Hiroshi Masuda

2018, 2018 13th International Congress Molded Interconnect Devices (MID) - Proceeding

Cu particles with an average particle size of 130 nm were found to be suitable for low-temperature metallization. Cu wirings with line/space $(\mathrm{L}/\mathrm{S}) = 150 \mu \mathrm{m}/150 \mu {\mat...more

Formation en Plastronique et aux dispositifs MID

Ph. Lombard, M. Cabrera, V. Semet, B. Allard, S. Kamotesov, Maël Moguedet, J-Y Charmeau

2017, J3eA - Article

Dans un contexte concurrentiel accru, les industries doivent développer de nouvelles solutions pour répondre à des défis majeurs (innovation, design, fonctionnalité, consommation…). La plastronique, q...more

ROS-Unity3D Based System for Monitoring of an Industrial Robotic Process

Enrico Sita, Csongor Márk Horváth, Trygve Thomessen, Péter Korondi, Anthony G. Pipe

2017, 2017 IEEE/SICE International Symposium on System Integration (SII) - Proceeding

Planning and monitoring the manufacturing of high quality one-of-a-kind products are challenging tasks. In the implementation of an industrial system, the commissioning phase is typically comprised of...more

Microinjection Molding ‐ Principles and Challenges

R. Ruprecht, G. Finnah, V. Piotter

2005, Microengineering of Metals and Ceramics - Chapter

This chapter contains sections titled: Introduction Types of Microcomponents Characteristic Features of Microinjection Molding Machinery and Peripherals for Microinjection Molding Molding Tools for Mi...more




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