||
与3D-MID有关的20条相关文献，仅供参考。
Title, Author(s), Bibliographic reference -
About the metrics
Jiratti Tengsuthiwat, Mavinkere Rangappa Sanjay, Suchart Siengchin, Catalin I. Pruncu 2020, Polymers - Article The three-dimensional molded interconnected device (3D-MID) has received considerable attention because of the growing demand for greater functionality and miniaturization of electronic parts. Polymer...more3D-MID Technology for Surface Modification of Polymer-Based Composites: A Comprehensive Review
T Leneke, S Hirsch 2009, Transactions of The Japan Institute of Electronics Packaging - Article Three-dimensional molded interconnected devices (3D-MID) extend the range of classical printed circuit boards (PCB) to the third dimension. Electrical circuits can be routed over any surface forms. Th...moreA Multilayer Process for 3D-Molded-Interconnect-Devices to Enable the Assembly of Area-Array Based Package Types
Jan Vanfieteren, Frederick Bossuyt, Bart Plovie 2016, 2016 12th International Congress Molded Interconnect Devices (MID) - Proceeding In this paper we present a technology for the production of randomly shaped 3D electronic circuits, which is complementary to the 3D-MID technology. The technology is based on conventional printed cir...moreA New Technology for Rigid 3D Free-Form Electronics Based on the Thermoplastic Deformation of Flat Standard PCB type Circuits
Fabian Zimber, Csongor Márk Horváth, Trygve Thomessen, Jörg Franke 2016, 2016 IEEE/SICE International Symposium on System Integration (SII) - Proceeding The installation of industrial robot systems requires considerable human effort both related to the mechanical and electromechanical setup. However, the task of programming a robot is of particular im...moreControl Strategy for an Industrial Process Monitoring Robot**This work was supported by PPM AS
Arnd Buschhaus, Jörg Franke 2014, Advanced Materials Research - Article Due to their vast number of benefits, plenty of complex and miniaturized three dimensional molded interconnect devices are developed. One especially demanding process step during their manufacturing i...moreUsage of Industrial Robots as Flexible Handling Devices Supporting the Process of Three Dimensional Conductive Pattern Generation
Annette Wimmer, Herbert Reichel, Klaus Schmidt 2018, 2018 13th International Congress Molded Interconnect Devices (MID) - Proceeding This paper describes a method for producing three-dimensional user interfaces. The technology is based on the conventional production of film insert molding components. As part of a research project, ...moreNew standards for 3D-userinterfaces-manufactured by a Film Insert Molding process
Timo Kordass, Jörg Franke 2014, Proceedings of the 2014 37th International Spring Seminar on Electronics Technology - Proceeding This paper gives an overview about the advantage of galvanic plating for 3D-MIDs. At first it is explained how the laser direct structuring process is proceeded. Exemplary on a serial application for ...moreGalvanic Plating for 3D-MID Applications
Christian Goth, Thomas Kuhn, Gerald Gion, Jörg Franke 2014, Advanced Materials Research - Article The adhesion test of metallic structures on MID (Molded Interconnect Devices) parts is an unsolved issue. So far no method really works reliably. The test methods which are conventionally used are the...moreHot Pin Pull Method – New Test Procedure for the Adhesion Measurement for 3D-MID
Yoshinori Ejiri, Shinichirou Sukata, Masaya Toba, Kosuke Urashima, Motoki Yonekura, Takaaki Noudou, Yoshiaki Kurihara, Hiroshi Masuda 2019, 2019 Pan Pacific Microelectronics Symposium (Pan Pacific) - Proceeding Cu particles with an average particle size of 130 nm were found to be suitable for low-temperature metallization. Cu wirings with line/space (L/S)=150 μm/150 μm and $L/S= 150~\mu m/100~\mu ...moreCU Paste for Molded Interconnect Devices
Philipp Ninz, Frank Kern, Eugen Ermantraut, Hagen Müller, Wolfgang Eberhardt, André Zimmermann, Rainer Gadow 2018, Procedia CIRP - Article Laser induced selective activation and metallization of ceramics is a novel additive metal plating process enabling the application fine metallic paths or metallic surfaces on complex three-dimension...moreDoping of Alumina Substrates for Laser Induced Selective Metallization
S. Kreitz, C. Penache, M. Thomas, C.-P. Klages 2005, Surface and Coatings Technology - Article The present paper reports on the local atmospheric pressure plasma pretreatment of polymeric substrates for a subsequent metallization by electroless nickel and copper electrolytes, respectively. Plas...morePatterned DBD treatment for area-selective metallization of polymers–plasma printing
Annette Wimmer, Herbert Reichel, Bernhard Rauch, René Schramm, Johannes Hörber, Bastian Habler 2016, 2016 12th International Congress Molded Interconnect Devices (MID) - Proceeding For the manufacturing of decorative Molded Interconnect Devices, In-Mold Labelling is combined with foils functionalized by printing. This appears to enable a cost efficient process chain, e. g. for a...moreManufacturing of sandwich structures for the integration of electronics in in mold labelling components
Wimmer Annette, Schirmer Julian, Reichel Herbert, Reichenberger Marcus 2021, 2021 14th International Congress Molded Interconnect Devices (MID) - Proceeding This paper describes a method for the technical engineering of threedimensional mechatronic interconnect devices. The technology is based on the conventional production of film insert molding componen...moreNumerical and experimental analysis of high pressure forming and injection molding processes with assembled film electronics
Yoshinori Ejiri, Shinichirou Sukata, Masaya Toba, Kosuke Urashima, Motoki Yonekura, Takaaki Noudou, Yoshiaki Kurihara, Hiroshi Masuda 2018, 2018 13th International Congress Molded Interconnect Devices (MID) - Proceeding Cu particles with an average particle size of 130 nm were found to be suitable for low-temperature metallization. Cu wirings with line/space $(\mathrm{L}/\mathrm{S}) = 150 \mu \mathrm{m}/150 \mu {\mat...moreCu Paste for Molded Interconnect Devices
F. Tricot, C. Venet, D. Beneventi, D. Curtil, D. Chaussy, T. P. Vuong, J. E. Broquin, N. Reverdy-Bruas 2018, RSC Advances - Article <p xmlns="http://www.ncbi.nlm.nih.gov/JATS1" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance">Evaluation of the printing quality of a direct writing process developed fo...moreFabrication of 3D conductive circuits: print quality evaluation of a direct ink writing process
Ph. Lombard, M. Cabrera, V. Semet, B. Allard, S. Kamotesov, Maël Moguedet, J-Y Charmeau 2017, J3eA - Article Dans un contexte concurrentiel accru, les industries doivent développer de nouvelles solutions pour répondre à des défis majeurs (innovation, design, fonctionnalité, consommation…). La plastronique, q...moreFormation en Plastronique et aux dispositifs MID
Enrico Sita, Csongor Márk Horváth, Trygve Thomessen, Péter Korondi, Anthony G. Pipe 2017, 2017 IEEE/SICE International Symposium on System Integration (SII) - Proceeding Planning and monitoring the manufacturing of high quality one-of-a-kind products are challenging tasks. In the implementation of an industrial system, the commissioning phase is typically comprised of...moreROS-Unity3D Based System for Monitoring of an Industrial Robotic Process
Sulaiman Khalifeh 2020, Polymers in Organic Electronics - Chapter5 OPTIMIZATION OF POLYMERIC STRUCTURES OF ORGANIC PRINTED CIRCUIT BOARDS
R. Ruprecht, G. Finnah, V. Piotter 2005, Microengineering of Metals and Ceramics - Chapter This chapter contains sections titled: Introduction Types of Microcomponents Characteristic Features of Microinjection Molding Machinery and Peripherals for Microinjection Molding Molding Tools for Mi...moreMicroinjection Molding ‐ Principles and Challenges
Detlef Löhe, Jürgen Haußelt (Eds.) 2005, Advanced Micro and Nanosystems - Edited BookMicroengineering of Metals and Ceramics
Archiver|手机版|科学网 ( 京ICP备07017567号-12 )
GMT+8, 2024-4-26 13:22
Powered by ScienceNet.cn
Copyright © 2007- 中国科学报社
